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1.发明授权
公开(公告)号：EP0861280B1
公开(公告)日：2001-12-12
申请号：EP96937842.1
申请日：1996-10-30
发明人： LEE, Jean , BOYD, Jack , KUO, Albert
IPC分类号： C08G73/12
CPC分类号： C08G73/121 , C08F222/40 , C08G73/12 , C08G73/123 , C08G73/124 , C08G73/125 , C08J5/24 , C08J2379/08 , C09D179/085
摘要： Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
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2.发明公开
公开(公告)号：EP0861280A1
公开(公告)日：1998-09-02
申请号：EP96937842.0
申请日：1996-10-30
发明人： LEE, Jean , BOYD, Jack , KUO, Albert
CPC分类号： C08G73/121 , C08F222/40 , C08G73/12 , C08G73/123 , C08G73/124 , C08G73/125 , C08J5/24 , C08J2379/08 , C09D179/085
摘要： Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
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公开(公告)号：EP1851258A1
公开(公告)日：2007-11-07
申请号：EP06719273.2
申请日：2006-01-24
IPC分类号： C08F222/40 , C08G73/12
CPC分类号： C08F222/40 , C08G73/12 , C08G73/126
摘要： The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin formulation with no undissolved solid BMI, but which retains equivalent mechanical properties as BMI resin formulations incorporating slurried solid BMI particles.
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公开(公告)号：EP1144190B1
公开(公告)日：2003-12-17
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
CPC分类号： B32B5/26 , B29C70/44 , B29C70/546 , B32B27/04 , C08G59/32 , C08G59/3218 , C08G59/38 , C08J5/24 , C08J2363/00 , C08L63/00 , Y10T428/249928 , Y10T428/249933 , Y10T428/24994 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249947
摘要： The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg (6) in a vacuum envelope (22), said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum (24) to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
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5.发明公开BISMALEIMIDE RESIN SYSTEM WITH IMPROVED MANUFACTURING PROPERTIES 有权BISMALEINIMIDHARZSYSTEM具有改进的制造特征
公开(公告)号：EP1874867A1
公开(公告)日：2008-01-09
申请号：EP06740344.4
申请日：2006-04-03
CPC分类号： C08G73/121 , C08K5/06 , C08L79/085 , C08L79/08
摘要： The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.
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公开(公告)号：EP0861281A1
公开(公告)日：1998-09-02
申请号：EP96938713.0
申请日：1996-10-30
发明人： BOYD, Jack , KUO, Albert
CPC分类号： C08G73/125 , C08G73/12 , C08G73/123 , C08G73/124 , C08J5/24 , C08J2379/08
摘要： Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
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公开(公告)号：EP1144190B2
公开(公告)日：2008-09-17
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
CPC分类号： B32B5/26 , B29C70/44 , B29C70/546 , B32B27/04 , C08G59/32 , C08G59/3218 , C08G59/38 , C08J5/24 , C08J2363/00 , C08L63/00 , Y10T428/249928 , Y10T428/249933 , Y10T428/24994 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249947
摘要： The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg (6) in a vacuum envelope (22), said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum (24) to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
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8.发明授权
公开(公告)号：EP0861281B1
公开(公告)日：2002-06-05
申请号：EP96938713.3
申请日：1996-10-30
发明人： BOYD, Jack , KUO, Albert
IPC分类号： C08G73/12 , C08F222/40
CPC分类号： C08G73/125 , C08G73/12 , C08G73/123 , C08G73/124 , C08J5/24 , C08J2379/08
摘要： Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
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公开(公告)号：EP1144190A3
公开(公告)日：2002-02-27
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
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10.发明授权BISMALEIMIDE RESIN SYSTEM WITH IMPROVED MANUFACTURING PROPERTIES 有权BISMALEINIMIDHARZSYSTEM具有改进的制造特征
公开(公告)号：EP1874867B1
公开(公告)日：2012-06-20
申请号：EP06740344.4
申请日：2006-04-03
CPC分类号： C08G73/121 , C08K5/06 , C08L79/085 , C08L79/08
摘要： The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.
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