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    THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT
    1.
    发明公开
    THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT 审中-公开
    维也纳HARZPRESSKÖRPERUND VERFAHREN ZUR HERSTELLUNG EINESWÄRMELEITENDENHARZPRESSKÖRPERS

    公开(公告)号：EP2824131A1

    公开(公告)日：2015-01-14

    申请号：EP13758627.7

    申请日：2013-03-01

    申请人： Kaneka Corporation

    发明人： YOSHIHARA, Shusuke ,  EZAKI, Toshiaki ,  NAKAMURA, Mitsuru

    IPC分类号： C08J5/04 ,  B29C45/00 ,  B29K105/18

    CPC分类号： C08K3/38 ,  B29C31/04 ,  B29C45/0013 ,  B29C45/0046 ,  B29K2067/00 ,  B29K2105/0047 ,  B29K2105/0058 ,  B29K2105/16 ,  B29K2995/0013 ,  C08K3/04 ,  C08K3/041 ,  C08K3/346 ,  C08K7/14 ,  C08K2003/385 ,  C09K19/02 ,  C09K19/2007 ,  C09K2019/521 ,  C08L67/02

    摘要： A resin molded article of the present invention includes at least a resin and an inorganic filler that is in a plate form, a spheroidal form, or a fiber form, in a region of 50% or more of a volume of the resin molded article, the resin having resin molecular chains oriented in a thickness direction of the resin molded article and the inorganic filler having a long axis oriented in an in-plane direction of the resin molded article, the resin molecular chains having an orientation degree α in a range of 0.6 or more and less than 1.0, the orientation degree being calculated by the following Formula (1), from a half-value width W obtained by wide-angle X-ray scattering measurement: orientation degree α = 360 ⁢ ° - ΣW / 360 ⁢ °
    wherein W is a half-value width of a scattering peak between the resin molecular chains, in an intensity distribution in directions of azimuth angles in a range of 0° to 360° in the wide-angle X-ray scattering measurement.

    摘要翻译： 本发明的树脂成形体在树脂成形品的体积的50％以上的区域中至少含有树脂和无机填料，其为板状，球状或纤维状， 所述树脂具有沿着树脂成形体的厚度方向取向的树脂分子链和具有沿所述树脂成型品的面内方向取向的长轴的无机填料，所述树脂分子链的取向度± 0.6以上且小于1.0时，通过广角X射线散射测定得到的半值宽度W，通过下式（1）计算取向度：取向度±= 360 ¢°-W / 360 ¢°其中W是在广角X射线散射中在0°至360°范围内的方位角方向上的强度分布中的树脂分子链之间的散射峰的半值宽度 测量。

    METAL RESIN COMPLEX
    5.
    发明公开
    METAL RESIN COMPLEX 审中-公开
    金属树脂复合物

    公开(公告)号：EP3305519A1

    公开(公告)日：2018-04-11

    申请号：EP16802803.3

    申请日：2016-05-30

    申请人： Kaneka Corporation

    发明人： EZAKI, Toshiaki

    IPC分类号： B32B15/08 ,  B29C45/14 ,  H01L33/64 ,  C08K3/00 ,  C08K7/06 ,  C08L101/00

    CPC分类号： B29C45/14336 ,  B23K26/364 ,  B29B7/48 ,  B29C45/0001 ,  B29C45/14 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2077/00 ,  B29K2081/04 ,  B29K2105/0026 ,  B29K2105/0085 ,  B29K2105/16 ,  B29K2309/08 ,  B29K2507/04 ,  B29K2705/02 ,  B32B15/08 ,  C08J5/043 ,  C08J2367/02 ,  C08J2377/02 ,  C08J2381/02 ,  C08K3/00 ,  C08K3/04 ,  C08K7/06 ,  C08K7/14 ,  C08L101/00 ,  C23F1/20 ,  F21S45/48 ,  F21V29/74 ,  F21V29/89 ,  H01L33/64

    摘要： The present invention provides a metal resin composite including a thermally conductive resin composition and a surface-treated metal which are integrally molded by injection molding to be tightly joined to each other at an interface between the resin and the metal, the metal resin composite excelling in heat radiation property and moldability, being light in weight, and being easily producible. The metal resin composite includes a member made of thermally conductive resin composition and a member made of metal and including a surface on which fine recesses are formed by a surface treatment, these members contacting with each other and being joined to each other in such a manner that the thermally conductive resin composition flows into and is fixed to the recesses by injection molding of the thermally conductive resin composition, wherein: the thermally conductive resin composition contains a thermoplastic resin (A) and an inorganic filler (B); thermal conductivity of the thermally conductive resin composition in a surface direction (In-Plane thermal conductivity) is 1 W/(m·K) or more; and the inorganic filler (B) is at least one selected from the group consisting of inorganic particles (B1) having thermal conductivity of 2 W/(m·K) or more and a volume average particle diameter of 1 to 700 µm and inorganic fibers (B2) having thermal conductivity of 1 W/(m·K) or more, a number average fiber diameter of 1 to 50 µm, and a number average fiber length of 6 mm or less.

    摘要翻译： 本发明提供一种金属树脂组合物，其包含导热性树脂组合物和表面处理金属，所述金属树脂组合物通过注射成型而一体成型，以在树脂和金属之间的界面处彼此紧密接合， 热辐射性和成型性，重量轻，易于生产。 金属树脂组合物包括由导热树脂组合物制成的构件和由金属制成的构件，并且包括通过表面处理在其上形成微细凹陷的表面，这些构件彼此接触并且以这种方式彼此接合 所述导热性树脂组合物通过注射成型所述导热性树脂组合物而流入并固定于所述凹部，所述导热性树脂组合物含有热塑性树脂（A）和无机填充材料（B）。 导热性树脂组合物的面内方向的导热率（面内导热率）为1W /（m·K）以上， （B）为选自热导率2W /（m·K）以上，体积平均粒径1〜700μm的无机粒子（B1）和无机粒子 （B2）具有1W /（m·K）或更高的导热率，1至50μm的数均纤维直径和6mm或更小的数均纤维长度。

    LED LAMP HEAT SINK
    7.
    发明公开
    LED LAMP HEAT SINK 审中-公开
    LED灯泡散热片

    公开(公告)号：EP3211680A1

    公开(公告)日：2017-08-30

    申请号：EP15852182.3

    申请日：2015-10-23

    申请人： Kaneka Corporation

    发明人： EZAKI, Toshiaki ,  MATSUMOTO, Kazuaki

    IPC分类号： H01L33/64 ,  C08K7/00 ,  C08L67/00 ,  H01L23/373

    CPC分类号： H01L33/641 ,  C08K7/00 ,  C08L67/00 ,  C08L67/02 ,  C09K5/14 ,  F28F21/02 ,  F28F21/06 ,  H01L23/373 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt.% of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt.% of polyester-polyether copolymer (B); and 40 to 70 wt.% of scale-like graphite (C) having a fixed carbon content of 98 wt.% or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.

    摘要翻译： 本发明提供一种具有优异的导热性和成型性，重量轻并且可以低成本生产的LED灯散热器。 LED灯散热器部分或全部由导热树脂组合物制成并冷却LED模块。 导热性树脂组合物至少含有：10〜50重量％的数均分子量为12,000〜70,000的热塑性聚酯树脂（A） 10至50重量％的聚酯 - 聚醚共聚物（B）; 以及固定碳含量为98重量％以上且纵横比为21以上的鳞片状石墨（C）40〜70重量％。 导热性树脂组合物的比重为1.7〜2.0。 导热性树脂组合物的面方向的导热率为15W /（m·K）以上。

    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY
    9.
    发明公开
    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY 有权
    THERMOPLASTISCHES HARZ MIT HOHERWÄRMELEITFÄHIGKEIT

    公开(公告)号：EP2562201A1

    公开(公告)日：2013-02-27

    申请号：EP11771733.0

    申请日：2011-04-14

    申请人： Kaneka Corporation

    发明人： YOSHIHARA, Shusuke ,  EZAKI, Toshiaki ,  MATSUMOTO, Kazuaki

    IPC分类号： C08G63/00 ,  C08G63/181 ,  C08G63/68 ,  C08G63/685

    CPC分类号： C08G63/20 ,  C08G63/193

    摘要： Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.

    摘要翻译： 本发明提供一种导热性优异的热塑性树脂，其中热塑性树脂在热塑性树脂材料熔融时发生的聚合过程引起的数均分子量发生变化，数均分子量的变化引起的导热率变化为 低。 热塑性树脂具有（A）特定结构，（B）由单官能低分子量化合物密封的分子链末端。 树脂本身具有优异的导热性。 数均分子量的变化在热塑性树脂材料的熔融期间变小，使得树脂本身的热导率变化变小。

    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY
    10.
    发明公开
    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY 有权
    具有高导热性的热塑性树脂

    公开(公告)号：EP2562200A1

    公开(公告)日：2013-02-27

    申请号：EP11771732.2

    申请日：2011-04-14

    申请人： Kaneka Corporation

    发明人： YOSHIHARA, Shusuke ,  EZAKI, Toshiaki ,  MATSUMOTO, Kazuaki

    IPC分类号： C08G63/00 ,  C08G63/68 ,  C08K3/00 ,  C08K3/28 ,  C08K13/04 ,  C08L67/00 ,  C08G63/185 ,  C08G63/685

    CPC分类号： C08G63/185 ,  C08K3/28 ,  C08L67/00

    摘要： Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die.
    The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol% or more ends of molecular chains are carboxyl groups.

    摘要翻译： 本发明提供一种热塑性树脂，其中，（A）通过使用一般的注射成型用模具，在添加导热性填充材料时能够显着提高树脂组合物的导热性，并且能够注射成型（B）。 热塑性树脂是其中主要具有特定重复单元的主链; 分子链的60摩尔％以上为羧基。