摘要:
The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt.% of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt.% of polyester-polyether copolymer (B); and 40 to 70 wt.% of scale-like graphite (C) having a fixed carbon content of 98 wt.% or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.
摘要:
The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
摘要翻译:本发明涉及:(i)具有优良的导热性并且能够被加工成薄壁和软质模塑制品的树脂组合物,树脂组合物包含:(a)树脂由40〜60摩尔%的 单元(A),其具有联苯基,和5至线性单元(B)的摩尔%40,以及5至40摩尔%的线性单元(C),其中所述树脂本身的导热率不小于0.4的 W /(米·K); 和(b)无机填料具有不小于1W /(M·K)的热导率,(ⅱ)一散热或含有该树脂组合物的热传递环的树脂材料,和(iii)的热传导膜含 的树脂组合物。
摘要:
The present invention provides a thermally-conductive organic additive which (i) is an organic polymer, unlike a thermally-conductive inorganic filler such as ceramic, metal and a carbon material, (ii) is capable of imparting thermal conductivity to plastic by being added thereto, (iii) can reduce the weight of a composition even when added to a resin in a large amount, without causing abrasion on molds and deteriorating an electrical insulation property of the composition, and (iv) provides the composition with excellent molding processability. The present thermally-conductive organic additive includes a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1):
-M-Sp- (1)
wherein M represents a mesogenic group; and Sp represents a spacer, the liquid crystalline thermoplastic resin itself having thermal conductivity of not less than 0.45 W/(m·K).
摘要:
The present invention provides a resin composition containing ultrafine particles exhibiting excellent properties absent from conventional materials. The resin composition is produced by uniformly dispersing, in a resin, metal or semiconductor ultrafine particles with the surfaces modified with a polymer. Specifically, a polymer having a mercapto group at one end is produced by radical polymerization of an unsaturated monomer in the presence of a specified thiocarbonylthio group-containing compound and then treating the resultant polymer with a treating agent, and the surfaces of the ultrafine particles are modified with the polymer having a mercapto group at one end to prepare the polymer-modified ultrafine particles. The polymer-modified ultrafine particles are mixed with a resin to achieve the resin composition containing the ultrafine particles uniformly dispersed in the resin.
摘要:
The present invention provides flame retardants which can provide high flame retardancy by means of silicon compounds. A flame retardant comprising an aromatic group-containing organosiloxane compound wherein said compound has the following mean composition formula (1), does not flow at 23°C, flows at 200°C, does not gelate when headed at 200°C with stirring for 30 minutes, has a number average molecular weight of not less than 2,000 and at the same time, dissolves not less than 100 g in 1 L of a solvent toluene at 23°C;
R 1 m R 2 n SiO (4-m-n)/2 (1)
in the formula, R 1 represents a univalent aliphatic hydrocarbon group containing 1 to 4 carbon atoms; R 2 represents a univalent aromatic hydrocarbon group containing 6 to 24 carbon atoms; R 1 and R 2 each may contain two or more species; and m and n are numbers satisfying 1.1 ≦ m + n ≦ 1.7 and 0.4 ≦ n/m ≦ 2.5.
摘要翻译:本发明提供能够通过硅化合物提供高阻燃性的阻燃剂。 包含含芳族基团的有机硅氧烷化合物的阻燃剂,其中所述化合物具有以下平均组成式(1),在23℃下不流动,在200℃下流动,在200℃下搅拌并不凝胶化, 30分钟,数均分子量不小于2,000,同时在1升溶剂甲苯中在23℃下溶解不少于100g; R 1 mR 2 nSiO(4-m-n)/ 2在式中,R 1表示含有1至4个碳原子的单价脂族烃基; R 2表示含有6〜24个碳原子的一价芳香族烃基; R 1和R 2各自可以含有两种或更多种; m和n是满足1.1≤n+n≤1.7且0.4≤n/m≤2.5的数。
摘要:
This invention provides a flame retardant which is inexpensive, has a high level flame retardant effect and is substantially free of such atoms as halogen, phosphorus and nitrogen. A flame retardant which comprises a polymer comprising silicon, boron and oxygen, having a skeleton substantially formed by a silicon-oxygen bond and a boron-oxygen bond and having an aromatic ring within the molecule. A flame retardant resin composition which contains 100 parts by weight of a resin and 0.1 to 50 parts by weight of the above flame retardant.
摘要:
A flame retarded thermoplastic resin composition comprising a thermoplastic resin comprising (A) a polycarbonate resin and (B) a thermoplastic polyester resin in an (A)/(B) ratio of 99/1 to 50/50 by weight, and per 100 parts by weight of the thermoplastic resin, (C) 0.1 to 30 parts by weight of an organic phosphorus based flame retarder and (D) 0.1 to 15 parts by weight of a copolymer comprising units of at least one olefin, units of at least one alkyl (meth)acrylate having a C 1 to C 10 alkyl group and units of at least one glycidyl (meth)acrylate. The composition is provided with a high degree of flame resistance without using chlorine or bromine-containing compounds and, moreover, has excellent impact resistance, solvent resistance, wet heat resistance, molding processability and heat stability.
摘要:
The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.