公开(公告)号：EP3181638A4

公开(公告)日：2018-03-14

申请号：EP15828970

申请日：2015-07-30

申请人： LG CHEMICAL LTD

发明人： KIM JU EUN ,  KIM GI CHEUL ,  PARK SUNG SOO ,  CHOI HYEON ,  CHOI HEE JUNG ,  JOO HYO SOOK ,  YOON KI YOUL

IPC分类号： C08L33/06 ,  C08J3/075 ,  C08J3/24 ,  C08K3/34

CPC分类号： B01J20/267 ,  B01J20/261 ,  B01J20/3021 ,  B01J20/3085 ,  C08F220/06 ,  C08J3/075 ,  C08J3/245 ,  C08J2333/02 ,  C08K3/346 ,  C08K2201/011 ,  C08L33/02

摘要： The present invention relates to superabsorbent polymer and a method for preparing the same. More specifically, the present invention relates to superabsorbent polymer with improved properties, comprising a dual cross-linking structure derived from alkyleneglycol multifunctional (meth)acrylate and modified nanoclay, and a method for preparing the same. According to the present invention, the modified nanoclay and alkyleneglycol multifunctional (meth)acrylate are used as internal crosslinking agents in the process of preparing superabsorbent polymer, thus contributing to improvement in the cross-linking degree and the properties of superabsorbent polymer.

公开(公告)号：EP2657311A4

公开(公告)日：2017-04-26

申请号：EP12738906

申请日：2012-01-27

申请人： LG CHEMICAL LTD

发明人： KIM SE RA ,  CHANG SUK KY ,  JUNG BYUNG KYU ,  HWANG YOON TAE ,  KU CHA HUN ,  KIM SUNG JONG ,  YANG SE WOO ,  JOO HYO SOOK ,  PARK MIN SOO

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01M2/10 ,  H01M6/00 ,  H01M10/04

CPC分类号： C09J7/241 ,  B32B27/285 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B37/02 ,  C09J7/0207 ,  C09J7/0264 ,  C09J7/22 ,  C09J7/245 ,  C09J7/25 ,  C09J7/26 ,  C09J7/29 ,  C09J133/08 ,  C09J2203/33 ,  C09J2401/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2475/00 ,  C09J2475/006 ,  H01M2/10 ,  H01M4/04 ,  H01M6/005 ,  H01M10/02 ,  H01M10/04 ,  H01M10/0431 ,  H01M10/049 ,  Y10T29/49114 ,  Y10T428/24521 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： An electrode assembly and a battery are provided. The electrode assembly may be effectively fixed inside a can as a pressure-sensitive adhesive tape attached to an outer circumferential surface of the electrode assembly is formed into a 3D shape by an electrolyte. Thus, the electrode assembly does not move and rotate inside the can due to external vibration or impact and damage of welded regions of a tab or disconnection of inner circuits can be prevented.

摘要翻译： 提供电极组件和电池。 当电极组件的外周表面上附着的压敏粘合带通过电解质形成为3D形状时，电极组件可被有效地固定在罐内。 因此，由于外部振动或冲击，电极组件不会在罐内移动和旋转，并且可以防止突片的焊接区域的损坏或内部电路的断开。

公开(公告)号：EP3196231A4

公开(公告)日：2018-05-23

申请号：EP15879096

申请日：2015-12-29

申请人： LG CHEMICAL LTD

发明人： PARK SUNG SOO ,  KIM GI CHEUL ,  KIM JU EUN ,  CHOI HYEON ,  JOO HYO SOOK ,  PARK SUNG HYUN ,  CHOI HEE JUNG ,  YOON KI YOUL

IPC分类号： B01J20/26 ,  B01J20/28 ,  B01J20/30 ,  C08J3/075 ,  C08J3/12 ,  C08K9/06

CPC分类号： B01J20/267 ,  A61F2013/530481 ,  B01J20/103 ,  B01J20/265 ,  B01J20/28004 ,  B01J20/28007 ,  B01J20/28011 ,  B01J20/28059 ,  B01J20/28061 ,  B01J20/28064 ,  B01J20/3021 ,  B01J20/3085 ,  B01J20/3204 ,  B01J20/3282 ,  C08J3/075 ,  C08J3/12 ,  C08J3/24 ,  C08J3/245 ,  C08J2300/14 ,  C08K9/06

摘要： The present invention relates to a super-absorbent polymer having excellent properties, both centrifugal retention capacity (CRC) and absorption under pressure (AUP) having been improved by introducing a surface crosslinked layer crosslinked by surface-modified inorganic particles, and to a method for preparing the same. The super-absorbent polymer comprises: a base resin powder containing a crosslinked polymer of water-soluble ethylene-based unsaturated monomers having an at least partially neutralized acidic group; and a surface crosslinked layer formed on the base resin powder, wherein inorganic particles may be chemically bound to the crosslinked polymer contained in the surface crosslinked layer, via an oxygen-containing bond or a nitrogen-containing bond.

公开(公告)号：EP2676975A4

公开(公告)日：2014-07-02

申请号：EP12746591

申请日：2012-02-14

申请人： LG CHEMICAL LTD

发明人： JOO HYO SOOK ,  SHIM JUNG SUP ,  KIM SE RA ,  CHANG SUK KY

IPC分类号： C08F20/10 ,  C08F20/18 ,  C08J5/18 ,  C08L33/04 ,  C09J7/02

CPC分类号： C09D133/08 ,  C08F20/10 ,  C08F20/18 ,  C08F220/18 ,  C08F2220/325 ,  C09D4/00 ,  C09J7/24 ,  C09J7/385 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/606 ,  C09J2433/006 ,  Y10T428/2809

摘要： Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided.

公开(公告)号：EP2444995A4

公开(公告)日：2016-04-06

申请号：EP10789683

申请日：2010-06-15

申请人： LG CHEMICAL LTD

发明人： KIM SE RA ,  JOO HYO SOOK ,  CHANG SUK KY ,  SHIM JUNG SUP

IPC分类号： C08G18/62 ,  C08G18/81 ,  C08L33/08 ,  C09J7/02 ,  C09J175/16 ,  H01L21/683

CPC分类号： H01L21/6836 ,  C08G18/6229 ,  C08G18/8116 ,  C08G2170/40 ,  C08L33/08 ,  C09J7/24 ,  C09J175/16 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/006 ,  C09J2463/006 ,  C09J2467/006 ,  C09J2471/006 ,  C09J2475/006 ,  H01L2221/68327 ,  H01L2221/6834 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/06 ,  C08F220/20

摘要： Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.

公开(公告)号：EP2270112A4

公开(公告)日：2013-07-24

申请号：EP09734324

申请日：2009-04-24

申请人： LG CHEMICAL LTD

发明人： YOO HYUN JEE ,  KHO DONG HAN ,  KIM JANG SOON ,  PARK HYO SOON ,  HONG JONG WAN ,  JOO HYO SOOK

IPC分类号： C09J163/00

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5ˆ¼20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

公开(公告)号：EP2193176A4

公开(公告)日：2014-11-19

申请号：EP08858568

申请日：2008-10-24

申请人： LG CHEMICAL LTD

发明人： HONG JONG WAN ,  KIM JANG SOON ,  PARK HYO SOON ,  YOO HYUN JEE ,  KHO DONG HAN ,  JOO HYO SOOK

IPC分类号： C09J7/02 ,  C09J133/02 ,  C09J133/14 ,  C09J163/00 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L24/29 ,  C08L33/068 ,  C08L2666/04 ,  C09J7/35 ,  C09J133/02 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/2874 ,  Y10T428/31515 ,  H01L2924/00

摘要： The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 μm. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

公开(公告)号：EP2676991A4

公开(公告)日：2014-11-05

申请号：EP12747060

申请日：2012-02-14

申请人： LG CHEMICAL LTD

发明人： JOO HYO SOOK ,  KIM SE RA ,  SHIM JUNG SUP ,  CHANG SUK KY

IPC分类号： C08J5/18 ,  C08F20/18 ,  C08L33/06 ,  C09J7/02 ,  H01L21/48

CPC分类号： H01L21/78 ,  B29C39/006 ,  C08F8/10 ,  C08F20/18 ,  C08G18/6229 ,  C08G18/8116 ,  C09J7/0267 ,  C09J7/24 ,  C09J133/066 ,  C09J175/16 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2809 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/20 ,  C08F220/36

摘要： Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up.

公开(公告)号：EP3088446A4

公开(公告)日：2017-05-24

申请号：EP15830082

申请日：2015-08-04

申请人： LG CHEMICAL LTD

发明人： JOO HYO SOOK ,  YOON KI YOUL ,  KIM GI CHEUL ,  KIM JU EUN ,  CHOI HYEON ,  CHOI HEE JUNG ,  PARK SUNG SOO ,  PARK SUNG HYUN ,  LEE MYUNG HAN

IPC分类号： B01J20/26 ,  A61L15/24 ,  A61L15/60 ,  B01J20/28 ,  B01J20/30 ,  C08J3/075 ,  C08J3/24 ,  C08K3/00 ,  C08K5/00 ,  C08L33/06

CPC分类号： C08J3/245 ,  A61L15/24 ,  A61L15/60 ,  B01J20/267 ,  B01J20/28004 ,  B01J20/28059 ,  B01J20/28061 ,  B01J20/28064 ,  C08F220/06 ,  C08F222/02 ,  C08F292/00 ,  C08J3/075 ,  C08J3/24 ,  C08J2333/02 ,  C08K3/00 ,  C08K5/00 ,  C08F2222/1013 ,  C08F2230/085

摘要： The present invention relates to a superabsorbent polymer that has more improved gel strength and is improved in both water retention capacity (centrifuge retention capacity, CRC) and absorption ability under pressure (AUP) because of an optimized cross-linked structure of a base resin powder inside a cross-linked surface layer, and a preparation method thereof. The superabsorbent polymer includes a base resin powder including a 1st cross-linked polymer of a water-soluble ethylenic unsaturated monomer having acid groups of which at least a part is neutralized, and a cross-linked surface layer that includes a 2nd cross-linked polymer further cross-linked from the 1st cross-linked polymer and is formed on the base resin powder, wherein an inorganic particle is chemically bonded to the 1st cross-linked polymer by the medium of a cross-linking bond, an oxygen-containing bond (-O-), or a nitrogen-containing bond (-NR-, where R is hydrogen or a C1-C3 alkyl or an amide bond).

摘要翻译： 本发明涉及一种超吸收性聚合物，其由于基础树脂粉末的优化的交联结构而具有更高的凝胶强度并且在保水容量（离心保留容量，CRC）和压力下的吸收能力（AUP） 在交联表面层内部，以及其制备方法。 超吸收性聚合物包含基础树脂粉末和交联表面层，所述基础树脂粉末包含具有酸基的至少部分被中和的水溶性烯键式不饱和单体的第一交联聚合物和包含第二交联聚合物 与第一交联聚合物进一步交联，并在基础树脂粉末上形成，其中无机颗粒通过交联键，含氧键（ -O-）或含氮键（-NR-，其中R是氢或C1-C3烷基或酰胺键）。

公开(公告)号：EP2657310A4

公开(公告)日：2017-03-15

申请号：EP12738841

申请日：2012-01-27

申请人： LG CHEMICAL LTD

发明人： KIM SE RA ,  CHANG SUK KY ,  KIM SUNG JONG ,  JUNG BYUNG KYU ,  KU CHA HUN ,  YANG SE WOO ,  JOO HYO SOOK

IPC分类号： H01M10/04 ,  C09J7/02 ,  H01M2/10 ,  H01M6/00 ,  H01M10/0566

CPC分类号： C09J7/241 ,  B32B27/285 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B37/02 ,  C09J7/0207 ,  C09J7/0264 ,  C09J7/22 ,  C09J7/245 ,  C09J7/25 ,  C09J7/26 ,  C09J7/29 ,  C09J133/08 ,  C09J2203/33 ,  C09J2401/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2475/00 ,  C09J2475/006 ,  H01M2/10 ,  H01M4/04 ,  H01M6/005 ,  H01M10/02 ,  H01M10/04 ,  H01M10/0431 ,  H01M10/049 ,  Y10T29/49114 ,  Y10T428/24521 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： An electrode assembly and a battery are provided. The electrode assembly may be effectively fixed inside a can as a pressure-sensitive adhesive tape attached to an outer circumferential surface of the electrode assembly is formed into a 3D shape by an electrolyte. Thus, the electrode assembly does not move and rotate inside the can due to external vibration or impact and damage of welded regions of a tab or disconnection of inner circuits can be prevented.

摘要翻译： 提供电极组件和电池。 电极组件可以有效地固定在罐内，因为通过电解质将附着在电极组件的外周表面上的压敏粘合带形成为3D形状。 因此，由于外部振动或冲击，电极组件不会在罐内移动和旋转，并且可以防止突片的焊接区域的损坏或内部电路的断开。