公开(公告)号：EP3367435A2

公开(公告)日：2018-08-29

申请号：EP18157432.8

申请日：2018-02-19

Applicant: Deere & Company

Inventor： KINYANJUI, Robert K ,  ROAN, Thomas J ,  ZURN, Michael J ,  PALMER, Brad G ,  SINGH, Brij N

IPC: H01L23/488 ,  H01L23/367 ,  H01L23/495 ,  H01L21/60 ,  H01L25/18

CPC classification number: H01L23/49568 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L25/18 ,  H01L27/0629 ,  H01L2224/27312 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29347 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/3303 ,  H01L2224/33106 ,  H01L2224/33107 ,  H01L2224/33181 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic assembly (111, 211, 311) comprises a semiconductor device (14) with a first side (42) and a second side (44) opposite the first side (42). The first side (42) has a first conductive pad (34). The second side (44) has a primary metallic surface (22, 122). A first substrate (e.g. lead frame) (10, 110) is bonded to the first conductive pad (34) via a first metallic bonding layer (12, 112). A second substrate (e.g., heat sinking circuit board) (18, 24) is bonded to the primary metallic surface (22, 122) via a second metallic bonding layer (16, 116). The first and second metallic bonding layers (12, 16, 112, 116) are composed of solder or of solder and copper, e.g., copper particles, copper flakes, copper pellets or copper fillers, wherein the copper pellets may be coated with a solderable finish such as tin, silver or electroless nickel immersion gold (ENIG). In the first bonding layer (12), the second bonding layer (16) or both, the copper content can facilitate enhanced heat dissipation from the semiconductor device (14), can promote improved thermomechanical strength of one or more bonding layers (12, 16) and can reduce mismatch and associated thermal stress resulting from a difference in coefficients of thermal expansion of the semiconductor device (14) and the first substrate (10) (e.g., lead frame) or secondary substrate (18) (e.g., heat sink). The first metallic bonding layer (12, 112) may be arranged as a first matrix of islands of solder. The lead frame (10, 110) may have a substantially planar portion (46) having a lower surface for interfacing with the first conductive pad (34) on the semiconductor device (14) and having an upper surface for coupling or receiving, directly or indirectly, a first heat sink (20). The substantially planar portion (46) of the lead frame (110) may comprise holes (54) serving as solder outgassing outlets and also allowing for the creation of an array of solder fillets on the surface of the lead frame (110) at the end of soldering. The first side (42) of the semiconductor device (14) may have the first conductive pad (34), a second conductive pad (38), and a third conductive pad (40). The second side (44) of the semiconductor device (14) may comprise the primary metallic surface (22) and a secondary metallic surface (23), where the primary metallic surface (22) and the secondary metallic surface (23) are spaced apart and separated by a dielectric region (45) or dielectric barrier. Alternatively, the primary metallic surface (122) may form a metallic ground plane. The electronic assembly (211) may further comprise a supplemental substrate (56) or circuit board that intervenes between the second substrate or second heat sink (24) and the semiconductor device (14). The semiconductor device (14) may comprise a semiconductor die, such as an insulated gate bipolar transistor (IGBT) or an insulated gate bipolar transistor and a diode on or in a direct bonded copper carrier or semiconductor substrate.

公开(公告)号：EP2259311B1

公开(公告)日：2018-07-25

申请号：EP10177700.1

申请日：2007-02-01

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Kriechbaum, Arno ,  Bauer, Wolfgang ,  Stahr, Johannes ,  Liebfahrt, Sabine

IPC: H01L23/538

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2203/0191 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

公开(公告)号：EP3222692A4

公开(公告)日：2018-07-04

申请号：EP15860929

申请日：2015-09-18

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： TANIKAWA MITSURU ,  WATANABE TAKASHI ,  FUJITA YUSUKE ,  FUJITA YOSHITO ,  UEDA MICHIHISA ,  INUI OSAMU ,  TAKAHASHI RYOSUKE ,  INOUE TAKANORI

IPC: C09J201/00 ,  C09J4/02 ,  C09J5/06 ,  C09J11/06 ,  H01L21/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: C09J133/14 ,  C09J4/00 ,  C09J5/06 ,  C09J11/06 ,  C09J133/06 ,  C09J163/00 ,  C09J201/00 ,  C09J201/08 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/52 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/75 ,  H01L24/83 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/278 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75155 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00 ,  C08F220/18 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/83

Abstract: Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25°C of a B-staged adhesive is at least 5.0 × 10 2 Pa and at most 8.0 0 × 10 4 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm 2 so that illumination at a wavelength of 365 nm is 100 mW/cm 2 .

公开(公告)号：EP3202501A4

公开(公告)日：2018-06-27

申请号：EP15846681

申请日：2015-09-18

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： UEDA MICHIHISA ,  HONDA MASUMI ,  MORIMOTO NAOYUKI ,  INOUE TAKANORI ,  WATANABE TAKASHI ,  HAMADA TAICHI ,  TAKAHASHI RYOSUKE

IPC: B05C5/00 ,  B05C11/10 ,  B41J2/01 ,  B41J2/175 ,  C08G59/42 ,  C08L63/00 ,  H01L21/027 ,  H01L21/67 ,  H01L23/00 ,  H05K3/00 ,  H05K3/28

CPC classification number: B05C5/001 ,  B05C5/0204 ,  B05C11/1039 ,  B05C11/1042 ,  B41J2/175 ,  B41J2/17513 ,  C08G59/4215 ,  C08L63/00 ,  H01L21/6715 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83874 ,  H05K3/0091 ,  H05K3/285 ,  H05K2203/0759 ,  Y02P20/123 ,  H01L2924/0665 ,  H01L2924/0635

Abstract: There is provided a liquid ejection device capable of applying a high quality curable composition stably and efficiently by heating the curable composition to a temperature at which the curable composition can be ejected from a head, in a short time without heating the curable composition rapidly and excessively. This liquid ejection device (1) is provided with: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the liquid composition; a first heating means (4) for heating the liquid composition within the first tank (2); a first channel (5) for supplying the liquid composition from the first tank (2) to the head (3); a second heating means (6) for heating the liquid composition passing through the first channel (5) at a heating temperature higher than that of the first heating means (4); a second channel (7) for returning the liquid composition from the head (3) to the first tank (2) ; a second pump (8) that is provided on the first channel (5) ; and a first pump (9) that is provided on the second channel (7), wherein the temperature difference between the heating temperature of the second heating means (6) and the heating temperature of the first heating means (4) is 65°C or less.

公开(公告)号：EP3331001A1

公开(公告)日：2018-06-06

申请号：EP16841723.6

申请日：2016-08-26

Applicant: Hitachi Chemical Company, Ltd.

Inventor： KOSEKI, Yuta ,  FUJIMOTO, Daisuke ,  YAMADA, Kumpei ,  SUZUKI, Naoya ,  ONOZEKI, Hitoshi ,  TAKAHASHI, Hiroshi

IPC: H01L21/60

CPC classification number: C08L21/00 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/13082 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/7532 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83191 ,  H01L2924/00014

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

公开(公告)号：EP2540437B1

公开(公告)日：2018-04-25

申请号：EP12174012.0

申请日：2012-06-28

Applicant: Thales ,  Université Paul Sabatier (Toulouse III) ,  Centre National de la Recherche Scientifique

Inventor： VENDIER, Olivier ,  RAYNAUD, Lidwine ,  BACO, Valérie ,  GOUGEON, Michel ,  LE TRONG, Hoa ,  TAILHADES, Philippe

IPC: B23K35/36 ,  B23K35/02 ,  B23K35/30

CPC classification number: B23K35/3618 ,  B23K1/0016 ,  B23K35/02 ,  B23K35/025 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3616 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/013 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/00

公开(公告)号：EP3167485A4

公开(公告)日：2018-03-07

申请号：EP14897417

申请日：2014-07-11

Applicant: INTEL CORP

Inventor： GANESAN SANKA ,  ZIADEH BASSAM ,  NIMKAR NITESH

IPC: H01L25/07 ,  H01L23/28 ,  H01L23/48 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/0657 ,  H01L23/293 ,  H01L24/02 ,  H01L24/03 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0381 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/27 ,  H01L2224/28105 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/3301 ,  H01L2224/33106 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/80903 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83855 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and configurations. In one embodiment, an integrated circuit (IC) assembly includes a package substrate having a first side and a second side disposed opposite to the first side, a first die having an active side coupled with the first side of the package substrate and an inactive side disposed opposite to the active side, the first die having one or more through-silicon vias (TSVs) configured to route electrical signals between the first die and a second die, and a mold compound disposed on the first side of the package substrate, wherein the mold compound is in direct contact with a sidewall of the first die between the active side and the inactive side and wherein a distance between the first side and a terminating edge of the mold compound that is farthest from the first side is equal to or less than a distance between the inactive side of the first die and the first side. Other embodiments may be described and/or claimed.

公开(公告)号：EP3163607A4

公开(公告)日：2018-03-07

申请号：EP15812648

申请日：2015-06-22

Applicant: TOPPAN PRINTING CO LTD

Inventor： KOBAYASHI AKANE ,  AKUTAGAWA YOSHITO

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L23/49838 ,  C09J7/0264 ,  C09J7/22 ,  C09J201/00 ,  C09J2203/326 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68386 ,  H01L2224/1146 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/16104 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/00 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01322 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/56 ,  H01L2221/68381

Abstract: A wiring substrate 11 used for improvement in manufacturing efficiency of a semiconductor device includes a support body 12 having transparency; an adhesive layer 13 disposed on a main surface 12a of the support body 12, the adhesive layer 13 including a peeling layer 41 which contains a third resin which is decomposed by light irradiation and a protective layer 42 which is disposed on the peeling layer 41 and contains a fourth resin; and a laminate 21 disposed on the adhesive layer 13, the laminate 21 including a first resin layer 14, a second resin layer 19 disposed on the first resin layer 14, and a wiring pattern 18 disposed at least between the first resin layer 14 and the second resin layer 19. Accordingly, the semiconductor chip 22 and the wiring substrate 11 which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device 1.

公开(公告)号：EP3138124A4

公开(公告)日：2018-03-07

申请号：EP15785531

申请日：2015-04-29

Applicant: MICRON TECHNOLOGY INC

Inventor： NG HONG WAN ,  YE SENG KIM

IPC: H01L23/12 ,  H01L21/98 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15174 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.

公开(公告)号：EP3009486B1

公开(公告)日：2018-01-31

申请号：EP14810749.3

申请日：2014-04-18

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： IKEO, Satoshi ,  SAGAWA, Toshifumi ,  DOI, Ryosuke ,  KIKUCHI, Hiroshi ,  MUKUNO, Hideki

IPC: C09J7/00 ,  C09J11/04 ,  C09J201/00 ,  G01F1/692 ,  G01F1/684 ,  H01L21/02 ,  H01L21/301 ,  H01L21/52 ,  G01F5/00 ,  H01L21/78 ,  H01L21/683 ,  C09J7/02 ,  H01L23/31 ,  H01L21/56 ,  G01F15/10

CPC classification number: H01L21/6836 ,  C09J7/00 ,  C09J7/20 ,  C09J201/00 ,  C09J2203/326 ,  G01F1/6845 ,  G01F1/692 ,  G01F5/00 ,  G01F15/10 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/27436 ,  H01L2224/298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.