摘要:
Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.
摘要:
An electrode assembly and a battery are provided. The electrode assembly may be effectively fixed inside a can as a pressure-sensitive adhesive tape attached to an outer circumferential surface of the electrode assembly is formed into a 3D shape by an electrolyte. Thus, the electrode assembly does not move and rotate inside the can due to external vibration or impact and damage of welded regions of a tab or disconnection of inner circuits can be prevented.
摘要:
The present invention relates to an acrylic pressure sensitive adhesive composition, specifically, an acrylic pressure sensitive adhesive composition having improved anti-static properties, comprising 100 part by weight of acrylic copolymers, 0.01 to 20 part by weight of ester plasticizer having at least one ether linkage in the molecular structure, and 0.001 to 25 part by weight of metal salts consisting of alkali metal cation, and anion which is counter-ion of super strong acid and has perfluoro alkyl group, and prevent whitening of appearance under high temperature and humidity condition as well as static electricity without change of the durability, transparency, and adhesion.
摘要:
Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided.
摘要:
The present invention relates to a polarizer having an antistatic layer and a liquid crystal display. The present invention may provide a polarizer which may prevent malfunction of devices by static electricity generated in preparation or use procedures even without using the ITO layer conventionally formed between the upper glass substrate of a liquid crystal panel and a polarizer in a liquid crystal display for an antistatic purpose, and has excellent physical properties such as endurance reliability under high temperature or high humidity condition and optical characteristics, and a liquid crystal display thereof.
摘要:
The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.
摘要:
The present invention relates to a pressure-sensitive adhesive film and a semiconductor wafer backgrinding method using the same. The present invention provides a pressure-sensitive adhesive film capable of remarkably improving production efficiency in a wafer backgrinding of a semiconductor manufacturing process due to its superior cutting and adherence properties in the semiconductor manufacturing process and an excellent cushioning property. Moreover, the present invention also provides a pressure-sensitive adhesive film having superior peeling and re-peeling properties and wettability to the wafer while providing excellent water resistance, and a backgrinding method using the pressure-sensitive adhesive film.