-
公开(公告)号:EP3364455A1
公开(公告)日:2018-08-22
申请号:EP17156474.3
申请日:2017-02-16
IPC分类号: H01L23/498 , H05K1/02
CPC分类号: H01L23/4985 , H01L23/49838 , H05K1/028 , H05K1/0283 , H05K1/038 , H05K1/189 , H05K3/0058 , H05K3/284 , H05K2201/09063 , H05K2201/09272 , H05K2201/10106
摘要: The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11,12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11,12).