公开(公告)号：EP1010781A1

公开(公告)日：2000-06-21

申请号：EP98914059.5

申请日：1998-04-17

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： TANAKA, Yoshiaki, Sekisui Engineering Co., Ltd. ,  KODERA, Yoshiaki, Sekisui Chemical Co., Ltd. ,  MATSUBARA, Manabu, Sawa Industries Co., Ltd. ,  KANKI, Kazuhiko, Sekisui Chemical Co., Ltd. ,  SUZUKI, Tatsuo, Sekisui Chemical Co., Ltd. ,  UKAI, Kazuo, Sekisui Chemical Co., Ltd.

IPC分类号： C25D17/22 ,  C25D7/00 ,  H01B1/00 ,  H01B1/20 ,  H01B1/22 ,  H01L21/60

CPC分类号： C23C18/1619 ,  C23C18/1653 ,  C23C18/31 ,  C25D5/10 ,  C25D7/00 ,  C25D17/22 ,  H01L21/6715 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2924/013

摘要： The present invention has its object to provide a manufacturing device for making conductive particles that efficiently permit a placed layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid.
The manufacturing device for conductive fine particles of the present invention comprises a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.

摘要翻译： 本发明具有的目的是提供一个制造装置制造的导电性粒子并有效地允许均匀厚度的层放置将要形成在每个的所有粒子的没有电镀液聚集粒子。 用于本发明的导电性微粒的制造装置包括固定到一个垂直驱动轴的上端的圆板状的底板; 没有被放置在底板的外周上表面，做了多孔构件仅允许电镀液从中穿过; 接触环用于导电放置在多孔构件的上表面上; 具有开口到上侧中心部分上，向其中具有相同孔直径的开口直径的空心圆柱体的上端的梯形圆锥状的中空罩接合，与所述中空圆柱体的上端朝向弯曲 中空圆筒的内壁侧; 一个可旋转的基座处理室以这样的方式形成，以夹着多孔元件和接触环，中空盖和底板的外周部之间; 的供给管用于供给电镀液通过该开口在处理室; 用于接收从多孔构件的孔散射电镀液的容器; 用于排出在所述容器中累积的电镀液排水管; 和电极通过所述开口接触所述电镀液插入。