公开(公告)号：EP3337665A1

公开(公告)日：2018-06-27

申请号：EP15911597.1

申请日：2015-12-21

申请人： Hewlett-Packard Development Company, L.P.

发明人： DOWELL, Daniel D. ,  SHAH, Minalben Bhavin

IPC分类号： B41J2/175 ,  B41J2/19 ,  B41J2/14

CPC分类号： B41J2/1433 ,  B41J2/162 ,  B41J2/164 ,  B41J2/175 ,  B41J2/17503 ,  B41J2/19

摘要： Example implementations relate to liquid adsorption. In an example, a liquid adsorption system includes a vapor barrier container having a sealable internal volume, a liquid dispensing device in the internal volume, where the liquid dispensing device includes liquid in a liquid flow path extending through at least a portion of the liquid dispensing device to an opening in communication with the internal volume, and a liquid adsorbing material in the internal volume.

公开(公告)号：EP3286003A1

公开(公告)日：2018-02-28

申请号：EP16783614

申请日：2016-04-13

申请人： FUJIFILM DIMATIX INC

发明人： MENZEL CHRISTOPH ,  ESSEN KEVIN VON ,  BARSS STEVEN H ,  OTTOSSON MATS G ,  IMAI DARREN

IPC分类号： B41J2/14 ,  B41J2/175 ,  B41J2/20 ,  B41J2/22 ,  F16L33/16

CPC分类号： B41J2/04525 ,  B41J2/055 ,  B41J2/14233 ,  B41J2/1433 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  B41J2002/14459 ,  B41J2202/12

摘要： A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

公开(公告)号：EP3212419A1

公开(公告)日：2017-09-06

申请号：EP14905040.3

申请日：2014-10-30

申请人： Hewlett-Packard Development Company, L.P.

发明人： WHITE, Lawrence H. ,  CARDINALI, Thomas J. ,  HAGAR, Michael

IPC分类号： B41J2/175 ,  B41J2/135

CPC分类号： B41J2/1604 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/164 ,  B41J2/175

摘要： Printheads and methods for forming printheads are described herein. In one example, a printhead includes a single resistor window in a conducting layer within the printhead. The printhead also includes a number of resistors formed in a resistor film deposited over the single resistor window. The resistors have two different widths, and each of the two different widths ejects a different droplet size when energized.

摘要翻译： 本文描述了用于形成打印头的打印头和方法。 在一个示例中，打印头在打印头内的导电层中包括单个电阻器窗口。 打印头还包括形成在沉积在单个电阻器窗口上的电阻器膜中的多个电阻器。 电阻器具有两种不同的宽度，两种不同宽度中的每一种在通电时喷射不同的液滴尺寸。

公开(公告)号：EP3203539A2

公开(公告)日：2017-08-09

申请号：EP17154121.2

申请日：2017-02-01

申请人： Seiko Epson Corporation

发明人： FUKUZAWA, Yuma ,  FUKUDA, Shunya ,  SHIMADA, Masato ,  OTA, Mutsuhiko

IPC分类号： H01L41/253 ,  H01L41/257

CPC分类号： B41J2/1607 ,  B41J2/164 ,  H01L41/0973 ,  H01L41/257 ,  H01L41/297

摘要： A method is provided for manufacturing a piezoelectric device including a piezoelectric element 300 that is disposed above a diaphragm 50 and that has a multilayer structure including a first electrode 60 disposed above the diaphragm, a piezoelectric layer 70 disposed on the first electrode, and a second electrode 80 disposed on the piezoelectric layer. The method includes forming the multilayer structure including the first electrode, the piezoelectric layer, and the second electrode above the diaphragm, forming a voltage application electrode 95 extending outwardly from an end of the second electrode to cover a region located above the piezoelectric layer in an inactive section 320 having no second electrode, applying a voltage between the first electrode and the second electrode, and removing the voltage application electrode 95.

摘要翻译： 提供了一种用于制造压电器件的方法，该压电器件包括设置在隔膜50上方的压电元件300，并且该压电器件具有多层结构，该多层结构包括布置在隔膜上方的第一电极60，布置在第一电极上的压电层70以及第二 设置在压电层上的电极80。 该方法包括在隔膜上方形成包括第一电极，压电层和第二电极的多层结构，形成从第二电极的端部向外延伸以覆盖位于压电层上方的区域的电压施加电极95， 不具有第二电极的无源部分320，在第一电极和第二电极之间施加电压，并且移除电压施加电极95。

公开(公告)号：EP2978609A1

公开(公告)日：2016-02-03

申请号：EP13890258.0

申请日：2013-07-29

申请人： Hewlett-Packard Development Company, L.P.

发明人： GE, Ning ,  YAOW, Mun Hooi ,  PEH, Bee LIng

IPC分类号： B41J2/355

CPC分类号： B41J2/14032 ,  B41J2/14016 ,  B41J2/14072 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/164

摘要： A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

摘要翻译： 描述流体喷射装置。 在一个示例中，装置包括衬底，衬底上形成有用于容纳流体的腔室。 金属层包括位于腔室下方的电阻器，其具有热耦合至腔室的表面。 至少一层沉积在金属层上。 多晶硅层位于电阻器下面的包括多晶硅结构的金属层下方，以改变电阻器的形貌，使得表面不平坦。

公开(公告)号：EP2287000B1

公开(公告)日：2014-03-05

申请号：EP09758237.3

申请日：2009-05-26

申请人： Konica Minolta IJ Technologies, Inc.

发明人： MATSUSHITA Takehiro

IPC分类号： B41J2/16

CPC分类号： B41J2/162 ,  B41J2/14209 ,  B41J2/1606 ,  B41J2/1634 ,  B41J2/164 ,  B41J2/1645

公开(公告)号：EP1855885B1

公开(公告)日：2013-06-19

申请号：EP06832780.8

申请日：2006-11-10

申请人： Ricoh Company, Ltd.

发明人： KAKUDA, Shinichi

IPC分类号： B41J2/045 ,  B41J2/01 ,  B41J2/055 ,  B41J2/135

CPC分类号： B41J2/1606 ,  B41J2/14274 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/164

公开(公告)号：EP2370268B1

公开(公告)日：2012-12-26

申请号：EP09808942.8

申请日：2009-12-29

申请人： CONTRA VISION LIMITED

发明人： HILL, George Roland ,  EATON, Gail ,  SCHROEDER, Robert

IPC分类号： B41M1/12 ,  B41M1/18 ,  B41M1/34

CPC分类号： B41F15/00 ,  B05D1/32 ,  B05D1/34 ,  B41J2/14032 ,  B41J2/1631 ,  B41J2/164 ,  B41M1/12 ,  B41M1/18 ,  B41M1/34 ,  B44C1/17 ,  B44C3/02 ,  B44C5/0407

公开(公告)号：EP1805023A2

公开(公告)日：2007-07-11

申请号：EP05796869.5

申请日：2005-09-08

申请人： LEXMARK INTERNATIONAL, INC.

发明人： BERTELSEN, Craig, M. ,  HART, Brian, C. ,  HOLT, Gary, A., Jr. ,  WILLIAMS, Gary, R. ,  WEAVER, Sean, T.

IPC分类号： B41J2/16

CPC分类号： B41J2/164 ,  B41J2/1603 ,  B41J2/1645 ,  B41J2/1646

摘要： A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.

公开(公告)号：EP1757714A2

公开(公告)日：2007-02-28

申请号：EP06017587.4

申请日：2006-08-23

申请人： Brother Kogyo Kabushiki Kaisha ,  National Institute of Advanced Industrial Science and Technology

发明人： Yasui, Motohiro Brother Kogyo K.K. ,  Akedo, Jun c/oNational Inst. Advanced Ind. Science

IPC分类号： C23C24/04 ,  H01L41/08 ,  B01J2/14

CPC分类号： C23C24/04 ,  B41J2/161 ,  B41J2/164 ,  C04B35/111 ,  C04B35/491 ,  C04B35/6262 ,  C04B35/62645 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3249 ,  C04B2235/3409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6567 ,  H01L41/1876 ,  H01L41/314 ,  H01L41/43

摘要： A method of producing a film includes: a heating treatment step of performing a heating treatment for ceramic particles; a film-forming step for forming the film by jetting, onto a substrate, an aerosol containing the ceramic particles which have been subjected to the heating treatment so as to make the ceramic particles adhere to the substrate; and an annealing-treatment step for performing an annealing treatment for the film. Accordingly, it is possible to previously vaporize and remove water and an additive which would otherwise cause gasification in the annealing treatment step, thereby preventing the defect and destruction of the film in the annealing treatment step. Thus, it is possible to provide a piezoelectric actuator plate, for ink-jet head, having satisfactory piezoelectric characteristics.

摘要翻译： 制造薄膜的方法包括：对陶瓷颗粒进行加热处理的加热处理步骤; 用于通过将含有已经进行了加热处理的陶瓷颗粒的气溶胶喷射到基板上以使陶瓷颗粒粘附到基板上而形成膜的成膜步骤; 以及对该膜进行退火处理的退火处理工序。 因此，可以预先蒸发除去在退火处理工序中会引起气化的水和添加剂，从而防止退火处理工序中的膜的缺陷和破坏。 因此，可以提供具有令人满意的压电特性的用于喷墨头的压电致动器板。