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    HEAD MODULE, LIQUID JETTING APPARATUS INCLUDING THE SAME, AND CASE
    2.
    发明公开
    HEAD MODULE, LIQUID JETTING APPARATUS INCLUDING THE SAME, AND CASE 审中-公开
    头部模块，液体喷射装置，包括它们和壳体

    公开(公告)号：EP3272538A1

    公开(公告)日：2018-01-24

    申请号：EP17181260.5

    申请日：2017-07-13

    申请人： BROTHER KOGYO KABUSHIKI KAISHA

    发明人： MORI, Shogo

    IPC分类号： B41J2/175 ,  B41J2/18

    CPC分类号： B41J2/135 ,  B41J2/14032 ,  B41J2/16508 ,  B41J2/1652 ,  B41J2/16523 ,  B41J2/16532 ,  B41J2/16585 ,  B41J2/175 ,  B41J2/17513 ,  B41J2/17553 ,  B41J2/17563 ,  B41J2/18 ,  B41J3/543 ,  B41J2002/0055 ,  B41J2002/14185 ,  B41J2002/14403 ,  B41J2202/12 ,  B41J2202/20

    摘要： There is provided a head module including: a case; and a head provided with nozzles through which a liquid is jetted. The head includes: two first inlets through which the liquid flows into the head; and a first outlet through which the liquid flows out of the head. The case includes: a second inlet through which the liquid supplied from an outside flows into the case; two inflow-connecting ports communicating with the second inlet and connected to the two first inlets; an outflow-connecting port connected to the first outlet; and a second outlet communicating with the outflow-connecting port and through which the liquid flows out to the outside.

    摘要翻译： 提供了一种头部模块，包括：壳体; 以及设有用于喷射液体的喷嘴的头部。 头部包括：两个第一入口，液体通过该入口流入头部; 以及液体流出头部的第一出口。 壳体包括：第二入口，从外部供应的液体通过该第二入口流入壳体; 两个流入连接端口，与第二入口连通并连接到两个第一入口; 连接到第一出口的流出连接口; 和与流出连接口连通并使液体流出到外部的第二出口。

    METHOD FOR MANUFACTURING LIQUID-EJECTING HEAD
    3.
    发明公开
    METHOD FOR MANUFACTURING LIQUID-EJECTING HEAD 有权
    VERFAHREN ZUR HERSTELLUNG EINES DRUCKKOPFSFÜRFLÜSSIGKEITEN

    公开(公告)号：EP3098050A1

    公开(公告)日：2016-11-30

    申请号：EP16001152.4

    申请日：2016-05-20

    申请人： Canon Kabushiki Kaisha

    发明人： Kimura, Satoshi ,  Yamaguchi, Yukuo ,  Umeyama, Mikiya ,  Oikawa, Satoshi ,  Amma, Hiromasa ,  Iwano, Takuya ,  Tsujiuchi, Naoko ,  Iijima, Yasushi ,  Toda, Kyosuke

    IPC分类号： B29C45/16 ,  B41J2/16

    CPC分类号： B29C45/0003 ,  B29C45/006 ,  B29C45/0062 ,  B29C45/1635 ,  B29D22/003 ,  B29L2031/7678 ,  B41J2/01 ,  B41J2/14032 ,  B41J2/1404 ,  B41J2/1752

    摘要： Provided is a method for manufacturing a liquid-ejecting head whereby in die slide injection molding it is possible to stably inject resin in secondary molding without damaging the shapes of parts that were formed in primary molding. In order for that, in the connecting section in which a convex section (H521) of a cover member (H121) is inserted into an opening (H500) of a liquid-supply member (H100), the closest distance (t2) to the opening in the area where secondary resin is injected is made larger than the gap (t1) between the opening (H500) and the convex section (H521). As a result, the resin is prevented from flowing into a liquid path (H501) during the secondary molding.

    摘要翻译： 提供了一种液体喷射头的制造方法，其中在模具滑动注射成型中，可以在二次模塑中稳定地注入树脂而不损坏在一次成型中形成的部件的形状。 为此，在将盖部件（H121）的凸部（H521）插入到供液部件（H100）的开口部（H500））的连接部中，最靠近的距离（t2） 使二次树脂注入的区域的开口大于开口（H500）和凸部（H521）之间的间隙（t1）。 结果，在二次成型期间，防止树脂流入液体路径（H501）。

    Method for forming thick film layer of micro injecting device
    7.
    发明公开
    Method for forming thick film layer of micro injecting device 审中-公开
    Verfahren zum Bilden einer DickfilmschichtfürMikrospritzvorrichtung

    公开(公告)号：EP0999057A2

    公开(公告)日：2000-05-10

    申请号：EP99308721.2

    申请日：1999-11-03

    申请人： SAMSUNG ELECTRONICS CO. LTD.

    发明人： Dunaev, Boris Nikolaevich ,  Ahn, Byung-sun ,  Zukov, Andrey Aleksandrovich

    IPC分类号： B41J2/16

    CPC分类号： B41J2/1603 ,  B41J2/14032 ,  B41J2/1626 ,  B41J2/1645

    摘要： A method for forming at thick film layer (30) of micro injecting device is disclosed in which a thin film layer (31') is formed on a substrate (1), a thick film layer (32') is formed on the thin film layer (31') without performing additional heat-treatment, and the thin film layer (31') and thick film layer (32') formed sequentially on the substrate are simultaneously heat-treated, to thereby complete a single thick film layer (30). The single thick film layer (30) is formed by a sequential coating process without being interfered by heat-treatment, thereby eliminating an isolating line. As a result, an overall durability of thick film layer (30) can be significantly enhanced.

    摘要翻译： 公开了一种在微型注入装置的厚膜层（30）上形成的方法，其中在基板（1）上形成薄膜层（31'），在薄膜上形成厚膜层（32'） 层（31'）而不进行附加热处理，并且在基板上依次形成的薄膜层（31'）和厚膜层（32'）被同时热处理，从而完成单个厚膜层（30 ）。 单个厚膜层（30）通过顺序涂布工艺形成，而不受热处理的干扰，从而消除隔离线。 结果，可以显着提高厚膜层（30）的整体耐久性。