摘要:
A paste coating apparatus (10, 1000) includes a first feeder (30, 30A) that feeds a first belt (20), a mounter (100, 1100) that joins one end portion (2a) of each of a plurality of electronic components (1) to the first belt, a first coater (200, 1200) that coats paste on the other end portion (2b) of each of the plurality of electronic components mounted on the first belt, a first dryer (300, 1300) that dries the paste, a second feeder (50, 50A) that feeds a second belt (40), a transfer device (400, 1400) that transfers the plurality of electronic components from the first belt to the second belt, a second coater (500, 1500) that coats the paste on the one end portion of each of the plurality of electronic components mounted on the second belt, a second dryer (600, 1600) that dries the paste, and a collection device (700, 1700) that winds and collects the second belt.
摘要:
The invention relates to a device for coating a product, comprising a unit for providing a liquid (2) that contains the reagents necessary for coating. The device further comprises a transport device (3), for bringing the surface of the product (4) to be coated in contact with the liquid and for passing it by the liquid such that the surface to be coated stays in contact with the liquid for a certain time in order to effect a coating thereof.
摘要:
A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microeletronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.
摘要:
Bei einer Klebstoff-Auftragsvorrichtung (5) bei Kantenanleimmaschinen mit einem Keilförmigen Düsenkörper (6) mit Auftragsbohrungen (9) für den Klebstoff ist ein am Düsenkörper (6) anliegender Tastschieber (18) vorgesehen, der die Auftragsbohrungen (9) teilweise abdeckt und dessen Tastfläche (20) mit dem plattenförmigen Werkstück (4) zusammenwirkt. Der Tastschieber (18) paßt sich exakt der Oberfläche (21) des Werkstücks (4) an und steuert damit die Freigabe der Klebebreite in Abhängigkeit von der Höhe vom Werkstück (4).
摘要:
Provided is a method for manufacturing an exhaust gas purification catalyst device, the method comprising: (A) placing a catalyst coating layer-forming coating liquid on the upper end surface of a honeycomb substrate having a plurality of cell flow paths partitioned by cell walls in a coating liquid placing station; (B) transferring the substrate, on which the coating liquid has been placed, from the coating liquid placing station to a suction station; and (C) suctioning the substrate, on which the coating liquid has been placed, from the lower end surface in the suction station to coat the cell walls of the substrate with the coating liquid, wherein the suction station comprises two or more suction devices, and step (B) comprises (B1) transferring the substrate, on which the coating liquid has been placed, from the coating liquid placing station to a branch station, and (B2) transferring the substrate, on which the coating liquid has been placed, to an empty suction device among the suction devices of the branch station.
摘要:
Station de traitement localisé de surface (1) d'une pièce industrielle à traiter (2) comprenant un système de mise en dépression (6) de la chambre de traitement (5) et du circuit d'alimentation et de vidange (22, 23) permettant l'alimentation, respectivement la vidange, de la chambre grâce, lors de ladite mise en dépression, à l'aspiration de fluide de traitement à travers le circuit d'alimentation et de vidange (22, 23) depuis les cuves de stockage (3A, 3B, 3C, 3D, ...) jusqu'à la chambre de traitement (5), respectivement grâce, lors de la mise à pression atmosphérique du circuit d'alimentation et de vidange (22, 23), au retour par gravité du fluide de traitement vers les cuves de stockage (3A, 3B, 3C, 3D, ...).