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    SURFACTANT COMPOSITION
    103.
    发明公开
    SURFACTANT COMPOSITION 审中-公开
    表面活性剂组合物

    公开(公告)号：EP3017864A1

    公开(公告)日：2016-05-11

    申请号：EP14820633.7

    申请日：2014-06-19

    申请人： Dai-Ichi Kogyo Seiyaku Co., Ltd.

    发明人： OGASAWARA, Asako

    IPC分类号： B01F17/42 ,  B01F17/44 ,  C08F2/20 ,  C08F2/30 ,  C08L71/00

    CPC分类号： C08F2/24 ,  B01F17/0021 ,  B01F17/0057 ,  B01F17/0064 ,  B01F17/0085 ,  C08F2/20 ,  C08F2/26 ,  C08F2/30 ,  C08G65/2612 ,  C08G65/326 ,  C08G65/327 ,  C08L71/00 ,  C08F212/08 ,  C08F2220/1825 ,  C08F2220/1858

    摘要： A reactive surfactant composition comprising one kind or two or more kinds of reactive surfactants (X) represented by a following general formula (I) and one kind or two or more kinds of polyfunctional compounds (Y) represented by a following general formula (II) (in the formulae, D represents a polymerizable unsaturated group represented by either of D-1 and D-2, R 1 represents a hydrogen atom or a methyl group, A represents an alkylene group or a substituted alkylene group having from 2 to 4 carbon atoms, n1 and n2 represent an addition mole number of from 0 to 1,000, T represents a hydrogen atom or an anionic hydrophilic group selected from (CH 2 ) a -SO 3 M, -(CH 2 ) b -COOM, -PO 3 M2,-P(U)O 2 M, and -CO-CH 2 -CH(SO 3 M)-COOM, a and b each represents a number of from 0 to 4, U represents a residue in which T is eliminated from the general formula (I) or general formula (II), M independently represents a hydrogen atom, an alkali metal atom, an alkali earth metal atom, an ammonium residue, or an alkanol amine residue, and m1, m2 and m3 represent numbers of substituents of from 1 to 2, from 1 to 3 and from 2 to 3, respectively.) suppresses foaming of an emulsion material and a dispersion material, has a high polymerization stability, for example, in the case of using as an emulsifier for emulsion polymerization, and can further improve various characteristics such as water resistance of coating films.

    摘要翻译： 含有下述通式（I）所示的反应性表面活性剂（X）和下述通式（II）所示的1种或2种以上的多官能性化合物（Y）中的1种或2种以上的反应性表面活性剂组合物， （式中，D表示由D-1和D-2中的任一个表示的可聚合不饱和基团，R 1表示氢原子或甲基，A表示亚烷基或具有2至4个碳原子的取代亚烷基 （CH 2）a -SO 3 M， - （CH 2）b -COOM，-PO 3 M 2，-P（U） O2M和-CO-CH2-CH（SO3M）-COOM，a和b各自表示0-4的数，U表示其中T从通式（I）或通式（II）中消除的残基， M独立地表示氢原子，碱金属原子，碱土金属原子，铵残基或链烷烃 l胺残基，并且m1，m2和m3分别代表1至2,1至3和2至3的取代基数目）抑制乳液材料和分散材料的起泡，具有高聚合稳定性， 例如在用作乳液聚合用乳化剂的情况下，可以进一步改善涂膜的耐水性等各种特性。

    RESIN COMPOSITION FOR LASER PROCESSING
    107.
    发明公开
    RESIN COMPOSITION FOR LASER PROCESSING 审中-公开
    HARZZUSAMMENSETZUNGFÜRLASERBEARBEITUNG

    公开(公告)号：EP2826820A1

    公开(公告)日：2015-01-21

    申请号：EP13760488.0

    申请日：2013-02-20

    申请人： Dai-Ichi Kogyo Seiyaku Co., Ltd.

    发明人： Murakami Satoshi ,  Kikuta Manabu

    IPC分类号： C08L101/00 ,  C08K5/00 ,  C08L33/02

    CPC分类号： C08K5/3475 ,  C08K5/005 ,  C08K5/11 ,  C08K5/12 ,  C08K5/523 ,  C08L101/00 ,  H05K1/03 ,  H05K3/0011 ,  C08F212/08 ,  C08F220/06 ,  C08F2220/1858 ,  C08F2220/1825 ,  C08L25/14 ,  C08L33/064

    摘要： A resin composition for laser processing which is able to enhance laser processability with maintaining a resist performance of a resin after ultraviolet laser processing, and which can be, for example, used as a resist in forming a circuit of a printed wiring board is provided.
    Disclosed is a resin composition for laser processing containing a resin and an ultraviolet absorber, wherein the resin is a thermoplastic resin having a carboxyl group and having a softening temperature of from 70 to 140°C, and a content of the ultraviolet absorber is from 1 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin.

    摘要翻译： 提供一种激光加工用树脂组合物，其能够通过在紫外线激光加工后保持树脂的抗蚀剂性能而提高激光加工性，并且其可以例如用作形成印刷线路板的电路的抗蚀剂。 公开了一种含有树脂和紫外线吸收剂的激光加工用树脂组合物，其中，树脂为具有羧基，软化温度为70〜140℃的热塑性树脂，紫外线吸收剂的含量为1 相对于100质量份热塑性树脂为30质量份。