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公开(公告)号：EP1678450A2
公开(公告)日：2006-07-12
申请号：EP04790305.9
申请日：2004-10-12
发明人： WIENER, Ferdinand , HAUF, Uwe , BREHM, Klaus
IPC分类号： F26B1/00
CPC分类号： F26B15/12 , F26B21/004 , F26B21/10
摘要： The invention relates to a device and to a corresponding method which is used to dry a treated product (1). Said device comprises transport means (3) which are used to transport the treated product (1) along a conveyor belt. Gas outlet devices (4, 5) which are disposed in an opposite manner are arranged above and below the conveyor belt. A gaseous drying medium is guided by blowing means to the gas outlets in a separate manner via supply pipes (8, 9). Pressure allocated to a respective gas outlet device (4, 5) is detected and a gas flow associated with the gas outlet device (4, 5) is controlled by control means according to said pressure.
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113.发明授权Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating 失效是selbstbeschleunigendes和本身为auffrischendes浸涂不含甲醛，以及相应的组合物的方法
公开(公告)号：EP1054081B1
公开(公告)日：2006-02-01
申请号：EP00117279.0
申请日：1994-03-15
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114.发明公开
公开(公告)号：EP1573094A2
公开(公告)日：2005-09-14
申请号：EP03756458.0
申请日：2003-08-28
发明人： SCHNEIDER, Reinhard , KENNY, Stephan , KÜSSNER, Torsten , PLÖSE, Wolfgang , REENTS, Bert , STREUP, Heribert
摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.
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公开(公告)号：EP1565268A1
公开(公告)日：2005-08-24
申请号：EP03785685.3
申请日：2003-11-28
发明人： KOPP, Lorenz , KUNZE, Henry , WIENER, Ferdinand
IPC分类号： B05B1/20
CPC分类号： H01L21/67051 , B05B1/205 , B08B3/02 , H05K3/0085 , H05K2203/0746 , H05K2203/1509
摘要： Disclosed is a nozzle arrangement which can be used especially as a gushing nozzle in electroplating plants through which circuit boards penetrate in a horizontal direction. Said nozzle arrangement comprises an elongate housing (2) that is provided with at least one port for supplying a liquid used for treating a workpiece, e.g. a circuit board, and preferably several slit-shaped liquid discharge ports (8) for dispensing the treatment liquid. A liquid duct (5) is embodied inside the housing (2) in order to supply treatment liquid from the liquid supply port to the liquid discharge ports (8). In order to obtain a flow rate of the treatment liquid, which is as constant as possible at the liquid discharge ports (8), (a) the cross section of the passage of the liquid duct (5) for the treatment liquid decreases steadily from the liquid supply port in the longitudinal direction of the housing, and/or (b) an accumulation space is provided upstream of where the liquid leaves the liquid discharge ports (8).
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116.发明公开VERFAHREN UND VORRICHTUNG ZUR BESCHICHTUNG VON LEITERPLATTEN MIT LASER-STRUKTURIERBAREN, THERMISCH HÄRTBAREN LÖTSTOPPLACKEN SOWIE GALVANORESISTEN 有权方法和设备涂料印制电路板用激光结构，热固化阻焊剂和GALVANORESISTEN
公开(公告)号：EP1552730A1
公开(公告)日：2005-07-13
申请号：EP03757973.7
申请日：2003-10-14
发明人： SCHÄFER, Hans-Jürgen
CPC分类号： B05C1/083 , B05C1/025 , B05C9/14 , H05K3/0091 , H05K3/28 , H05K2203/0143 , H05K2203/1509 , H05K2203/1563 , H05K2203/1572
摘要： Disclosed are a method and a device for coating printed boards (1) with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened. The device used for carrying out said method comprises at least one roller-type coating plant (2) with an application roller (4), a dosing roller (5) that embodies a dosing gap along with the application roller (4), a storage container (6) for the solder stop lacquer or galvanoresist, which is disposed above the roller-type coating plant (2), means for conveying the printed boards (7), means for drying the solder stop lacquer (11), and an apparatus (13) for turning the coated printed boards. Said roller-type coating plant (2) is provided with only one coating unit for coating the bottom side of the printed boards.
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公开(公告)号：EP1343921B1
公开(公告)日：2005-03-16
申请号：EP01992803.5
申请日：2001-10-04
IPC分类号： C23C18/16 , C23C18/20 , C23C18/24 , C23C18/28 , C23C18/32 , C23C18/34 , C23C18/44 , C23C18/50 , C23C18/18
CPC分类号： C23C18/34 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/50
摘要： A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
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公开(公告)号：EP1510111A1
公开(公告)日：2005-03-02
申请号：EP03730130.6
申请日：2003-05-27
发明人： SCHELLER, Britta , WEX, Orlando
CPC分类号： C25D17/06 , H05K3/0085
摘要： The device in accordance with the invention and the method serve to treat flat and flexible work pieces (1) with a fluid, preferably in electroplating plants and etching facilities. The device and the method permit to place foil-type work pieces (1) in particular in such a manner into the fluid, a wet-chemical or electrochemical processing fluid for example, that the work pieces (1) will not deform or hit the side walls of a processing tank (3) or other built-in components. For this purpose, the processing tank (3) is assigned a protective carrier (5) into which the work pieces (1) are lowered, said carrier (5) being in a largely empty condition. For treatment, the protective carrier (5) is for example lowered into a tank (3) which is filled with processing fluid, said processing fluid flowing into the protective carrier (5). Means are provided on the protective carrier (5) by means of which the processing fluid is allowed to controlledly flow into the protective carrier (5).
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119.发明公开CONVEYORIZED PLATING LINE AND METHOD FOR ELECTROLYTICALLY METAL PLATING A WORKPIECE 有权传送带和方法电解金属化WORKPIECES
公开(公告)号：EP1488025A1
公开(公告)日：2004-12-22
申请号：EP03712040.9
申请日：2003-03-17
发明人： HÜBEL, Egon
CPC分类号： H05K3/241 , C25D17/004 , C25D17/10 , C25D17/28 , C25D21/12
摘要： To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plating printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.
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120.发明授权
公开(公告)号：EP1287182B1
公开(公告)日：2004-11-17
申请号：EP01945134.3
申请日：2001-05-15
CPC分类号： C25B11/0442 , C25B1/28 , H05K3/005 , Y10T29/53204
摘要： In order to regenerate permanganate solutions being utilized for the etching and roughening of plastics surfaces electrolytic methods are known. Though relatively small quantities of by-products are produced with these methods as compared to chemical regeneration methods, large quantites of manganese dioxide are produced when printed circuit boards are treated. In order to avoid formation of manganese dioxide during the regeneration method a novel cathode (2) has been found which is provided with a porous, electrically nonconducting layer (7) on the cathode body (3). The layer (7) preferably consists of a plastics material being resistant to acid and/or alkali.
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