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1.发明公开VERTICAL SYSTEM FOR THE PLATING TREATMENT OF A WORK PIECE AND METHOD FOR CONVEYING THE WORK PIECE 有权垂直系统用于工件用来承载工件电镀处理和方法
公开(公告)号：EP2162569A2
公开(公告)日：2010-03-17
申请号：EP08759145.9
申请日：2008-06-03
发明人： SCHNEIDER, Reinhard , KUNZE, Henry , WIENER, Ferdinand , HAUF, Uwe , SCHELLER, Britta , KLINGL, Heinz
摘要： Vertical system for the plating treatment of a work piece, the system comprising at least two treatment modules, wherein retaining devices for the work pieces are provided in the treatment modules, and at least one transport device including at least one gripping device, which retains the work piece and has a respective fastening device, and each fastening device comprises first and second clamping devices, each associated with one side of the work piece, wherein both the first and second clamping devices are displaceable for gripping and releasing the work pieces, wherein the gripping device comprises at least two fastening devices that are spaced apart from one another, each of the first and second clamping devices are moveable torsion bars as a result of which the work piece is tensioned between the fastening devices during clamping parallel to its first side.
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2.发明授权TREATMENT UNIT FOR THE WET-CHEMICAL OR ELECTROLYTIC TREATMENT OF FLAT WORKPIECES 有权治疗方法湿化学或电解处理扁平工件的
公开(公告)号：EP1694886B1
公开(公告)日：2007-09-26
申请号：EP04801219.9
申请日：2004-12-07
发明人： HAUF, Uwe , KUNZE, Henry , WIENER, Ferdinand
IPC分类号： C25D7/06
CPC分类号： H05K3/0085 , C23C18/1619 , C23C18/163 , C25D7/0614 , C25D17/001 , C25D17/28 , H05K2203/0746 , H05K2203/1509 , H05K2203/1572 , Y10S414/135 , Y10S414/141
摘要： The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces 1, such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces are transported on a conveying path by means of conveying members 6. The treatment unit comprises carrier elements with recesses , said carrier elements being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members that consist of insertion elements 14, 26, preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses of the carrier elements. The treatment unit is preferably utilized in horizontal conveyorized lines.
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公开(公告)号：EP1678450A2
公开(公告)日：2006-07-12
申请号：EP04790305.9
申请日：2004-10-12
发明人： WIENER, Ferdinand , HAUF, Uwe , BREHM, Klaus
IPC分类号： F26B1/00
CPC分类号： F26B15/12 , F26B21/004 , F26B21/10
摘要： The invention relates to a device and to a corresponding method which is used to dry a treated product (1). Said device comprises transport means (3) which are used to transport the treated product (1) along a conveyor belt. Gas outlet devices (4, 5) which are disposed in an opposite manner are arranged above and below the conveyor belt. A gaseous drying medium is guided by blowing means to the gas outlets in a separate manner via supply pipes (8, 9). Pressure allocated to a respective gas outlet device (4, 5) is detected and a gas flow associated with the gas outlet device (4, 5) is controlled by control means according to said pressure.
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公开(公告)号：EP2702189B1
公开(公告)日：2018-03-07
申请号：EP12716430.9
申请日：2012-04-25
发明人： DAMBROWSKY, Nina , HAUF, Uwe , EWERT, Ingo , DAMBROWSKY, Christof , WENZEL, René
摘要： The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling blind micro vias, through hole vias, trenches and similar structures on printed circuit boards, chip carriers and semiconductor wafers.
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公开(公告)号：EP1299575A2
公开(公告)日：2003-04-09
申请号：EP01965078.7
申请日：2001-07-06
发明人： HAUF, Uwe , FUERHAUPTER, Harry , STIOP, Alexey , GRIESER, Udo
CPC分类号： H05K3/383 , C23C22/52 , C23F1/18 , H05K3/064 , H05K3/28 , H05K2203/0796 , H05K2203/124
摘要： The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R 3 =R 1 , R 1 -O, R 1 -S, amino or substituted amino, wherein R 1 and R 2 may especially be phenyl or substituted phenyl.
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6.发明授权
公开(公告)号：EP2162569B1
公开(公告)日：2019-10-02
申请号：EP08759145.9
申请日：2008-06-03
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公开(公告)号：EP2702189A1
公开(公告)日：2014-03-05
申请号：EP12716430.9
申请日：2012-04-25
发明人： DAMBROWSKY, Nina , HAUF, Uwe , EWERT, Ingo , ERBEN, Christof , WENZEL, René
摘要： The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling blind micro vias, through hole vias, trenches and similar structures on printed circuit boards, chip carriers and semiconductor wafers.
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8.发明公开TREATMENT UNIT FOR THE WET-CHEMICAL OR ELECTROLYTIC TREATMENT OF FLAT WORKPIECES 有权治疗方法湿化学或电解处理扁平工件的
公开(公告)号：EP1694886A2
公开(公告)日：2006-08-30
申请号：EP04801219.9
申请日：2004-12-07
发明人： HAUF, Uwe , KUNZE, Henry , WIENER, Ferdinand
IPC分类号： C25D17/28
CPC分类号： H05K3/0085 , C23C18/1619 , C23C18/163 , C25D7/0614 , C25D17/001 , C25D17/28 , H05K2203/0746 , H05K2203/1509 , H05K2203/1572 , Y10S414/135 , Y10S414/141
摘要： The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces 1, such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces are transported on a conveying path by means of conveying members 6. The treatment unit comprises carrier elements with recesses , said carrier elements being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members that consist of insertion elements 14, 26, preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses of the carrier elements. The treatment unit is preferably utilized in horizontal conveyorized lines.
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公开(公告)号：EP1299575B1
公开(公告)日：2004-08-25
申请号：EP01965078.7
申请日：2001-07-06
发明人： HAUF, Uwe , FUERHAUPTER, Harry , STIOP, Alexey , GRIESER, Udo
CPC分类号： H05K3/383 , C23C22/52 , C23F1/18 , H05K3/064 , H05K3/28 , H05K2203/0796 , H05K2203/124
摘要： The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R 3 =R 1 , R 1 -O, R 1 -S, amino or substituted amino, wherein R 1 and R 2 may especially be phenyl or substituted phenyl.
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