公开(公告)号：EP3741556A1

公开(公告)日：2020-11-25

申请号：EP18899622.7

申请日：2018-12-28

申请人： Gold Industries Co., Ltd.

发明人： HAZAMA, Toshimitsu ,  MURATA,Taisei

IPC分类号： B32B7/025 ,  B32B27/18 ,  B32B27/30 ,  B65D65/40 ,  B65D73/02 ,  C08K3/04 ,  C08L25/06 ,  C08L25/10 ,  C08L51/04

摘要： An object of the present invention is to provide a conductive sheet and an embossed carrier tape that can reduce detachment of carbon black and prevents deterioration of buckling strength. A conductive sheet for an embossed carrier tape for mounting an electronic component, in which the conductive sheet has a configuration in which a surface layer having conductivity is laminated on at least one surface of a core layer; the core layer and the surface layer each contain a common material constituted of only a combination of three types of polystyrene-based resins of styrene-butadiene copolymer resin, general purpose polystyrene resin, and high impact polystyrene resin; a common material constituting the core layer and a common material constituting the surface layer have the same compounding ratio; and the surface layer is formed by kneading carbon black in the common material.

公开(公告)号：EP2628690A4

公开(公告)日：2016-08-03

申请号：EP11832315

申请日：2011-04-18

申请人： DENKA COMPANY LTD

发明人： SASAKI AKIRA ,  TOKUNAGA HISATSUGU ,  FUJIMURA TETSUO

IPC分类号： B65D73/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B65D85/86

CPC分类号： B65D43/02 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/327 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2307/31 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2553/00 ,  Y10T428/2826

摘要： Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.

摘要翻译： 公开了一种覆盖膜，其与载带组合使用，并且至少包括基层（A），中间层（B），脱模层（C）和热封层（D） 被热密封到载带上。 中间层（B）作为主要成分含有使用茂金属催化剂聚合并且拉伸弹性模量为200MPa以下的直链状低密度聚乙烯。 释放层（C）含有导电材料，并且还含有芳香族乙烯基含量为15〜35质量％的芳族乙烯基 - 共轭二烯共聚物的氢化树脂作为主要成分。 当覆盖膜被释放时，该覆盖膜的剥离强度的变化小，因此能够抑制在安装过程中的释放期间的麻烦。

公开(公告)号：EP2722290B1

公开(公告)日：2016-03-30

申请号：EP12800145.0

申请日：2012-06-12

申请人： Denka Company Limited

发明人： TANAZAWA Yusuke ,  ONO Takeshi

IPC分类号： B65D65/40 ,  B32B7/02 ,  B65D73/02 ,  B65D85/86 ,  B32B25/08 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36

CPC分类号： H05K13/0084 ,  B32B25/08 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/24 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2307/412 ,  B32B2307/518 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2435/00 ,  B32B2435/02 ,  B32B2553/00 ,  Y10T428/1352 ,  Y10T428/265 ,  Y10T428/31938

摘要： The present invention relates to a cover tape and to an electronic component package that uses the cover tape, the cover tape comprising at least a substrate layer, a heat seal layer, and an antistatic layer, the antistatic layer containing (A) an ionic liquid including a cyclic quaternary nitrogen-containing cation, (B) a quaternary ammonium salt, and (C) a polyalkylene glycol being formed on a surface toward the heat seal layer, and an anion constituting the (A) ionic liquid including a cyclic quaternary nitrogen-containing cation and the (B) quaternary ammonium salt being one or more anions selected from the group consisting of carboxylic acids, sulfuric acid esters, phosphoric acid esters, sulfonic acids, and phosphoric acids.

公开(公告)号：EP2708475A1

公开(公告)日：2014-03-19

申请号：EP13183488.9

申请日：2013-09-09

申请人： NGK Insulators, Ltd.

发明人： Kaku, Takeshi ,  Tanaka, Hidehiko ,  Shibata, Kazuyoshi ,  Shimizu, Hideki

IPC分类号： B65D65/40 ,  B65D73/02 ,  B32B5/26 ,  B32B5/28 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B18/00 ,  B32B27/04 ,  B32B27/34 ,  B32B27/38

CPC分类号： B32B7/02 ,  B32B5/26 ,  B32B5/28 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/04 ,  B32B27/34 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/558 ,  C04B37/008 ,  C04B2235/963 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/52 ,  Y10T428/2495

摘要： A laminated body is provided that exhibits impact resistance, wear resistance and scratch resistance, and which enables a reduction in weight together with a reduction in the dielectric constant. The laminated body 100 includes a first tabular member 10 configured from a ceramic material and having a first thickness t1, and a second tabular member 20 configured from a polymer material and having a second thickness t2. The laminated body 100 withstands a falling-ball impact breaking test from a height that is higher than that exhibited by a single layer body that is configured from the ceramic material and of a thickness t3 that is the sum of the first thickness t1 and the second thickness t2.

摘要翻译： 提供具有抗冲击性，耐磨性和耐划伤性的层压体，并且能够减小重量并降低介电常数。 层叠体100包括由陶瓷材料构成并具有第一厚度t1的第一平板状构件10和由聚合物材料构成并具有第二厚度t2的第二平板状构件20。 层叠体100从高于由陶瓷材料构成的单层体表现出的高度而承受落球冲击破坏试验，厚度t3为第一厚度t1和第二厚度t1之和 厚度t2。

公开(公告)号：EP2029324B1

公开(公告)日：2013-08-21

申请号：EP07796167.0

申请日：2007-06-15

申请人： Certainteed Gypsum, Inc.

发明人： HAUBER, Robert, J. ,  HENNIS, Mark, E. ,  FAHEY, Michael, P.

IPC分类号： B25B23/04 ,  B65D85/24 ,  F16J15/14 ,  B65D73/02 ,  F16B27/00

CPC分类号： F16B39/025 ,  B65D73/02 ,  B65D85/20 ,  F16B27/00 ,  F16B39/225 ,  Y10T29/49952 ,  Y10T29/49964 ,  Y10T29/4997

公开(公告)号：EP2623433A1

公开(公告)日：2013-08-07

申请号：EP11829161.6

申请日：2011-09-28

申请人： Sumitomo Bakelite Co., Ltd.

发明人： MASUI Ken ,  HIRAMATSU Masayuki

IPC分类号： B65D73/02 ,  B32B27/00 ,  B65D85/86

CPC分类号： C09J11/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2307/308 ,  B32B2439/40 ,  B65D50/067 ,  B65D73/02 ,  H05F3/00 ,  Y10T428/2826 ,  Y10T428/2848

摘要： According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.

摘要翻译： 根据本发明，提供一种电子部件包装用胶带，其具有合适的透明性，能够抑制从载带剥离时发生的电荷。 本发明的电子部件封装用胶带在基材层的顶部设置有热密封层，上述热密封层含有聚烯烃树脂和聚醚 - 聚烯烃共聚物。 上述热密封层中聚醚 - 聚烯烃共聚物的重量比为10重量％以上且70重量％以下。

公开(公告)号：EP1391394A4

公开(公告)日：2012-10-03

申请号：EP02728158

申请日：2002-05-27

申请人： DENKI KAGAKU KOGYO KK

发明人： FUJIMURA TETSUO ,  MIYAKAWA TAKESHI ,  SHIMIZU MIKIO ,  YOKOYAMA SATOSHI ,  HIGANO MASANORI ,  ISHII MASANORI ,  KOSUGI KAZUHIRO ,  TOMIZAWA TAKASHI

IPC分类号： B65D73/02 ,  B32B1/06 ,  B32B1/08 ,  B32B3/12 ,  B32B7/06 ,  B32B27/08 ,  B65D65/40 ,  B65D85/38 ,  H05K13/00

CPC分类号： B32B1/08 ,  B32B1/06 ,  B32B3/12 ,  B32B7/06 ,  B32B27/08 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2439/00 ,  B65D75/327 ,  B65D77/2032 ,  B65D85/38 ,  B65D2213/02 ,  H01L2221/68313 ,  H05K13/0084

公开(公告)号：EP2183174A4

公开(公告)日：2010-09-15

申请号：EP08796772

申请日：2008-07-29

申请人： 3M INNOVATIVE PROPERTIES CO

发明人： WIHREN CHARLIE V

IPC分类号： B65D85/86 ,  B65D73/02 ,  H05K13/02

CPC分类号： H05K13/0084

公开(公告)号：EP1270438A4

公开(公告)日：2009-04-29

申请号：EP00981778

申请日：2000-12-15

申请人： DENKI KAGAKU KOGYO KK

发明人： MIYAKAWA TAKESHI ,  SHIMIZU MIKIO

IPC分类号： B65D73/02 ,  B65D85/86

CPC分类号： B65D73/02 ,  Y10T428/2457

摘要： An embossed carrier tape suitable for a high-speed mounting and a sheet for an embossed carrier tape. The tear strength conforming to JIS-K-7128-3 of the sheet is higher than 105 N/mm, thereby providing a sheet for an embossed carrier tape with superior high-speed mountability.

公开(公告)号：EP1511675B2

公开(公告)日：2008-08-27

申请号：EP02745798.5

申请日：2002-06-20

申请人： ASSOGRAPH ITALIA S.R.L.

发明人： GORETTI, Franco

IPC分类号： B65D5/50 ,  B65D81/113 ,  B65D73/02

CPC分类号： B65D5/5069 ,  B65D85/68 ,  B65D2585/689

摘要： Box-shaped packaging (10) using corrugated cardboard for the protection of objects in general, especially of computers (70) and the like, comprising between two box-shaped volumes (50, 60), orthogonally interposed in two of their opposing ends, of a pair of parallel tubular volumes having a rectangular cross-section, joined at 90 DEG by a central piece forming a substantially parallelepiped housing for the packaged object (70), protected by said tubular volumes directly on the four edges and by their reaction on the box-shaped volumes (50, 60).