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公开(公告)号:EP4318611A1
公开(公告)日:2024-02-07
申请号:EP22913564.5
申请日:2022-09-23
发明人: XU, Wenzhou , MENG, Xiajie , YAO, Qian , WANG, Xiupeng , XING, Guoqiang
IPC分类号: H01L31/18 , H01L31/0216 , C23C16/24
摘要: The present application relates to a solar cell panel, a cell piece and a production process for a cell piece. A silicon oxide layer (200) is formed on the back surface of an N-type silicon wafer (100); an N-type silicon layer (300) is formed on the silicon oxide layer (200), wherein the phosphine concentration of the N-type silicon layer (300) is within a first preset concentration range; and an antireflection layer (400) is formed on the N-type silicon layer (300) and a back electrode (500) is formed on the antireflection layer (400). In the high-temperature annealing process, hydrogen atoms can be bound by phosphine, such that membrane explosion caused by the escape of hydrogen atoms is avoided, an open-circuit voltage, the conversion efficiency and a filling factor can be improved, a back passivation effect can be enhanced, and the quality of a cell piece can be improved.
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公开(公告)号:EP4232409A1
公开(公告)日:2023-08-30
申请号:EP21799014.2
申请日:2021-10-22
申请人: Wacker Chemie AG , Nexeon Limited
发明人: TILLMANN, Jan , DRÄGER, Christoph , KALYAKINA, Alena , KNEISSL, Sebastian , RENNER, Thomas , TAYLOR, Richard Gregory , MEDRANO-CATALAN, José , ANDERSSON, Markus , MASON, Charles A. , WHITTAM, Joshua
IPC分类号: C01B33/021 , C23C16/24 , H01M4/134
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公开(公告)号:EP4174209A1
公开(公告)日:2023-05-03
申请号:EP22203309.4
申请日:2022-10-24
申请人: ASM IP Holding B.V.
发明人: VAN AERDE, Steven R. A. , SU, Juan
IPC分类号: C23C16/24 , C23C16/455 , C23C16/56 , H01L21/02
摘要: A method and a wafer processing furnace for forming a doped polysilicon layer on a plurality of substrates is provided. In a preferred embodiment, the method comprises providing a plurality of substrates to a process chamber. It also comprises executing a deposition cycle comprising providing a silicon-containing precursor to the process chamber thereby depositing, on the plurality of substrates, an undoped silicon layer until a pre-determined thickness is reached and providing the process chamber with a flow of a dopant precursor gas without providing the silicon-containing precursor to the process chamber. The method also comprises performing a heat treatment process, thereby forming the doped polysilicon layer.
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公开(公告)号:EP4094828A1
公开(公告)日:2022-11-30
申请号:EP21744361.3
申请日:2021-01-22
摘要: Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.
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公开(公告)号:EP4092154A1
公开(公告)日:2022-11-23
申请号:EP22176702.3
申请日:2016-06-14
IPC分类号: C23C16/455 , C23C14/10 , C23C14/06 , C23C16/24 , C23C16/34 , C23C16/40 , C23C16/36 , C07F7/02 , H01L21/02 , H01L21/3205
摘要: Halidosilane compounds, processes for synthesizing halidosilane compounds, compositions comprising halidosilane precursors, and processes for depositing silicon-containing films (e.g., silicon, amorphous silicon, silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon carbonitride, doped silicon films, and metal-doped silicon nitride films) using halidosilane precursors. Examples of halidosilane precursor compounds described herein, include, but are not limited to, monochlorodisilane (MCDS), monobromodisilane (MBDS), monoiododisilane (MIDS), monochlorotrisilane (MCTS), and monobromotrisilane (MBTS), monoiodotrisilane (MITS). Also described herein are methods for depositing silicon containing films such as, without limitation, silicon, amorphous silicon, silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon carbonitride, doped silicon films, and metal-doped silicon nitride films, at one or more deposition temperatures of about 500°C or less.
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公开(公告)号:EP3985147A1
公开(公告)日:2022-04-20
申请号:EP21206535.3
申请日:2016-07-01
申请人: Paragraf Limited
IPC分类号: C30B25/10 , C30B25/16 , C30B29/02 , C30B29/60 , C01B32/186 , C23C16/26 , C23C16/24 , C30B29/06 , C23C16/455
摘要: A method of producing a two-dimensional crystalline material, the method comprising: providing a substrate having nucleation sites within a reaction chamber; introducing at a precursor entry point a precursor into the reaction chamber, the precursor being in a gas phase and/or suspended in a gas; heating the substrate to a temperature that is within a decomposition range of the precursor, and that allows two-dimensional crystalline material formation from a species released from the decomposed precursor; and cooling the precursor entry point; wherein the reaction chamber is a close coupled reaction chamber such that a separation between the substrate surface upon which the two-dimensional crystalline material is formed and the point at which the precursor enters the reaction chamber is sufficiently small, and a thermal gradient between the substrate surface and the point at which the precursor enters the chamber is sufficiently steep, such that the fraction of precursor that reacts in the gas phase within the reaction chamber is low enough to allow the formation of the two-dimensional crystalline material, wherein the distance between the surface of the substrate upon which the two-dimensional crystalline material is produced and the point at which precursor enters the chamber is less than 100mm; and wherein the two-dimensional crystalline material is graphene and the species is carbon or wherein the two-dimensional crystalline material is silicene and the species is silicon; and wherein the substrate provides a non-metallic surface upon which the two-dimensional crystalline material is produced.
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117.
公开(公告)号:EP3981896A1
公开(公告)日:2022-04-13
申请号:EP21212136.2
申请日:2019-06-11
申请人: Gelest, Inc.
IPC分类号: C23C16/16 , C23C16/24 , C23C16/448 , C23C16/452 , C23C16/455
摘要: A method for deposition of a thin film onto a substrate is provided. The method includes providing a source precursor containing on or more of elements constituting the thin film, generating a transient species from the source precursor, and depositing a thin film onto the substrate from the transient species. The transient species being a reactive intermediate that has a limited lifetime in a condensed phase at or above room temperature.
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公开(公告)号:EP3520146B1
公开(公告)日:2022-01-19
申请号:EP17781039.7
申请日:2017-09-27
发明人: GERARDI, Cosimo , BATTAGLIA, Anna
IPC分类号: H01L31/0368 , H01L31/065 , H01L31/20 , H01L31/075 , H01L21/02 , C23C16/44 , C23C16/24 , C23C16/02 , C23C16/32 , C23C16/40
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119.
公开(公告)号:EP3653577B1
公开(公告)日:2021-10-06
申请号:EP18206148.1
申请日:2018-11-14
IPC分类号: C01B33/107 , C23C16/24
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公开(公告)号:EP3599290A3
公开(公告)日:2020-06-03
申请号:EP19186736.5
申请日:2019-07-17
申请人: LG ELECTRONICS INC.
发明人: CHANG, Wonjae , AHN, Junyong , LEE, Hyunho
IPC分类号: C23C16/24 , C23C16/455 , C23C16/458 , C23C16/56 , H01L21/02 , H01L31/18
摘要: Provided is a Chemical vapor deposition (CVD) equipment including a chamber having an inner space, a plurality of silicon wafers disposed in the inner space of the chamber in an upright position; and a plurality of shower nozzles configured to inject a mixed gas composed of a silicon deposition gas and an impurity gas toward each side edge of the plurality of wafers. The plurality of shower nozzles can be disposed at both sides of the plurality of the plurality of silicon wafers.
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