公开(公告)号：EP2138022A2

公开(公告)日：2009-12-30

申请号：EP08737401.3

申请日：2008-04-09

申请人： ATI Technologies ULC

发明人： REFAI-AHMED, Gamal ,  SHELTAMI, Khalid ,  OSQUEIZADEH, Nima

IPC分类号： H05K7/20 ,  F04D25/08 ,  G06F1/20

CPC分类号： F04D25/08 ,  F04D25/082 ,  G06F1/206 ,  H05K7/20727

摘要： A configurable multiple inlet thermal management device, such as a air-mover or passive heat sink, for electronic devices. The thermal management device is arranged on a computing device or on a component of a computing device or similar, such as an expansion module or alike, so that incoming air flow decreases the temperature of the heat producing components. In order to provide best possible air flow the air-mover comprises blade design that pressurizes the air flow from at least one side of the air-mover component. The air-mover includes removable covers for providing the openings required for intake air from the desired direction and for providing a fan wind. Depending on the application the openings may be permanently opened or closed. The intake air flow is then directed in form of fan wind towards the heat producing elements.

公开(公告)号：EP2057678A1

公开(公告)日：2009-05-13

申请号：EP07789638.9

申请日：2007-08-13

申请人： ATI Technologies ULC

发明人： REFAI-AHMED, Gamal

IPC分类号： H01L23/427

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2215/06 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.

公开(公告)号：EP2409328A1

公开(公告)日：2012-01-25

申请号：EP10753030.5

申请日：2010-03-15

申请人： ATI Technologies ULC

发明人： REFAI-AHMED, Gamal

IPC分类号： H01L23/36 ,  H01L21/50 ,  H01L23/31

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/38 ,  H01L23/42 ,  H01L23/427 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device includes first and second stacked semiconductor dies on a substrate. A lid having a plurality of fins extending downwardly into the cavity is mounted on the substrate to encapsulate the semiconductor dies. At least some of the fins are longer than other ones of said fins. The lid is attached to the substrate, with the longer fins extending downwardly above a region of the substrate not occupied by the first die. The shorter fins extend downwardly above a region of said first die not covered by said second die. A thermal interface material fills the remainder of the cavity and is in thermal communication with both dies, the substrate and the fins. The lid may be molded from metal. The lid may be bonded to the topmost die, using a thermal bonding material that may be liquid metal, or the like.

公开(公告)号：EP2057678B1

公开(公告)日：2019-06-26

申请号：EP07789638.9

申请日：2007-08-13

申请人： ATI Technologies ULC

发明人： REFAI-AHMED, Gamal

IPC分类号： H01L23/427 ,  F28D15/02