Abstract:
Disclosed is an electroplated product, comprising a base material and an electroplated metal layer including a copper layer on the surface of the base material, wherein the electroplated metal layer further includes a nickel substitute metal layer on the copper layer and the nickel substitute metal is Cu-Sn alloy, Ru, Rh, Pd, or an alloy composed of 2, 3, or 4 elements selected from Ru, Rh, Pd, and Co. A method for preparing the same is also disclosed. The metal electroplated layer of said electroplated product is free of nickel, and therefore will not cause nickel irritation on skin. Furthermore, the electroplated layer also has the advantages of nickel coating, including good smoothness, brightness, wearing resistance, corrosion resistance, and thermal shock resistance, etc.
Abstract:
A ceramic and a preparation method therefor are provided. The ceramic includes a zirconia matrix, and an additive dispersed inside and on an outer surface of the zirconia matrix. The additive is an oxide including elements A and B, where A is selected from at least one of Ca, Sr, Ba, Y, and La, and B is selected from at least one of Cr, Mn, Fe, Co, and Ni.
Abstract:
A metal shell includes: a metal body having a through hole; a plastic member disposed on the metal body at a position of the through hole; and a NFC antenna disposed on a surface of the plastic member and configured to receive a signal via the through hole. An area of a part of the NFC antenna overlapping the through hole is larger than one third of an area of the NFC antenna. A cell phone including the metal shell is also provided.
Abstract:
An amorphous alloy having the general formula of: (ZrxAlyCuzNi1-x-y-z)100-a-bScaYb, wherein x, y, and z are atomic percents, and a and b are atom molar ratios, in which: about 0.45≦̸x≦̸about 0.60; about 0.08≦̸y≦̸about 0.12; about 0.25≦̸z≦̸about 0.35; 0
Abstract:
The present disclosure provides a magnesium alloy and a preparation method and an application thereof. Based on the total weight of the magnesium alloy, the magnesium alloy includes 2-3.5 wt% of Ce, 0.01-0.2 wt% of R, 0.8-1.5 wt% of Mn, 0-0.01 wt% of Fe, 0-0.01 wt% of Cu, 0-0.01 wt% of Ni, 0-0.01 wt% of Co, 0-0.01 wt% of Sn, 0-0.01 wt% of Ca, and 94.74-97.19 wt% of Mg, wherein R is at least one selected from Al and Zn.
Abstract:
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.