公开(公告)号：EP1833079A1

公开(公告)日：2007-09-12

申请号：EP07012911.9

申请日：2000-04-17

申请人： Applied Materials, Inc.

发明人： Mitchell, Robert J.C.S. ,  Relleen, Keith D. ,  Ruffell, John

IPC分类号： H01L21/00

CPC分类号： H01L21/67213 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707 ,  Y10S414/139 ,  Y10S414/141

摘要： An apparatus for processing wafers one at a time. The apparatus has a vacuum chamber 1 into which wafers are loaded through a pair of loadlocks 3, 4 which are spaced one above the other. A robot within the vacuum chamber 1 has a pair of gripper arms 22, 29 which are moveable along and rotatable about a vertical axis 23 so as to be moveable between the loadlocks 3, 4 and a wafer processing position. Each of the loadlocks 3, 4 has a vertically moveable portion 8, 26 which is moveable away from the remainder of the loadlock to provide access in a horizontal plane for one of the gripper arms 22, 29.

摘要翻译： 一次一个处理晶片的装置。 该装置具有真空室1，通过一对彼此间隔开的一对装载锁3,4，装载有晶片。 真空室1内的机器人具有一对夹持臂22,29，它们能够沿竖直轴线23移动并且可绕垂直轴线23旋转，以便能够在装载锁3,4和晶片加工位置之间移动。 每个装载锁3,4具有可垂直移动的部分8,26，其可移动离开负载锁的其余部分，以在夹持臂22,29之一的水平平面内提供通路。

公开(公告)号：EP1596430B1

公开(公告)日：2007-07-25

申请号：EP05008674.3

申请日：2005-04-20

申请人： Miraial Co., Ltd.

发明人： Nakano, Ryuichi ,  Hyobu, Yukihiro ,  Okamoto, Yoshihisa

IPC分类号： H01L21/68 ,  B65D81/20 ,  B65B31/04

CPC分类号： H01L21/67393 ,  H01L21/67017 ,  H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

公开(公告)号：EP1755151A1

公开(公告)日：2007-02-21

申请号：EP06016294.8

申请日：2006-08-04

申请人： ASYS AUTOMATIC SYSTEMS GMBH & CO. KG

发明人： Hügler, Klaus

IPC分类号： H01L21/00 ,  H01L21/677

CPC分类号： H01L21/6773 ,  H01L21/67126 ,  H01L21/67196 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67748 ,  Y10S414/139

摘要： Eine Bearbeitungsanlage modularen Aufbaus für flächige Substrate unter atmosphärischen Sonderbedingungen sieht gleich gerichtete, unabhängig voneinander längs der in Reihe angeordneten Module verlaufende Führungsbahnen vor, auf denen Transfereinheiten angeordnet sind, die jeweils auf die Modulreihe zu auskragende Transferkammern aufweisen, welche Reinräume bilden und unabhängig voneinander gegeneinander verfahrbar sowie mit jeweiligen Modulen zu verbinden sind, die ihrerseits bevorzugt bezüglich ihrer Übergabeöffnungen nach deren Höhenlage gruppiert und auf die Höhenlage einer jeweiligen Transferkammer abgestimmt angeordnet sind.

摘要翻译： 对于特殊的大气条件下平坦衬底的加工系统的模块化结构提供整流，彼此独立地沿所述串联排列模块之前延伸的导向纤网，在其上传送单元被布置，每一个都具有被悬臂，其形成相对于彼此可移动的洁净室和彼此独立地传输室模块的行 并连接到相应的模块，所述模块又优选地根据它们的高度相对于它们的传送开口分组并且被布置成匹配相应的传送室的高度。

公开(公告)号：EP1738401A2

公开(公告)日：2007-01-03

申请号：EP05731754.7

申请日：2005-04-01

申请人： Infineon Technologies AG

发明人： BRADL, Stephan ,  GROMMES, Walther ,  KRÖNINGER, Werner ,  MELZL, Michael ,  SCHWAIGER, Josef ,  STACHE, Thilo

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141 ,  Y10S438/977 ,  Y10T29/49998

摘要： Disclosed is, among other things, a method in which a workpiece (14) is fastened to a workpiece support (12) with the aid of connecting means (18, 20), the workpiece (14) and the workpiece support (12) being joined together using an annular connecting means (18, 20). The resulting compound is machined, whereupon the machined workpiece (14) is separated from the workpiece support (12), making it possible to create a particularly simple machining process.

公开(公告)号：EP1454340B1

公开(公告)日：2006-09-13

申请号：EP02791341.7

申请日：2002-11-27

申请人： Diamond Semiconductor Group, LLC.

发明人： SIERADZKI, Manny ,  WHITE, Nicholas, R.

IPC分类号： H01L21/00

CPC分类号： H01L21/67745 ,  H01L21/67155 ,  H01L21/67778 ,  Y10S414/139

摘要： A high-speed wafer-processing apparatus and method that employs a vacuum chamber having at least two wafer transport robots and a process station. The vacuum chamber interfaces with a number of single-wafer load locks that are loaded and unloaded one wafer at a time by a robot in atmosphere. Four load locks are sized to allow for a gentle vacuum cycling of each wafer without significant pumpdown delays. The robots in the vacuum chamber move wafers sequentially from one of the load locks to a process station for processing and then to another one of the load locks for unloading by the atmospheric robot.

公开(公告)号：EP0805481B1

公开(公告)日：2006-06-21

申请号：EP97111628.0

申请日：1991-08-19

申请人： Hitachi, Ltd.

发明人： Kato, Shigekazu ,  Nishihata, Kouji ,  Tsubone, Tsunehiko ,  Itou, Atsushi

IPC分类号： H01L21/00 ,  C23C14/56

CPC分类号： H01L21/67748 ,  B01J3/006 ,  B41J2/36 ,  B41J2/365 ,  C23C14/564 ,  H01L21/67028 ,  H01L21/67167 ,  H01L21/67253 ,  H01L21/67736 ,  Y10S134/902 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

公开(公告)号：EP1608002A1

公开(公告)日：2005-12-21

申请号：EP04715563.5

申请日：2004-02-27

申请人： TOKYO ELECTRON LIMITED

发明人： HIROKI, Tsutomu

IPC分类号： H01L21/02 ,  H01L21/68 ,  B01J3/00 ,  B01J3/02 ,  B65G49/00 ,  F16K51/02

CPC分类号： H01L21/67126 ,  F16K3/029 ,  F16K51/02 ,  Y10S414/135 ,  Y10S414/139

摘要： A gate valve (20) for a semiconductor processing system includes a housing (21) forming a plurality of passages (22A to 22D) arrayed in a first direction. The passages respectively have ports (23A to 23D) facing a first predetermined side in a second direction perpendicular to the first direction. The ports are respectively provided with valve seats (25A to 25D) at gradually set back positions in the second direction, as being closer to a second predetermined side in the first direction. Valve plates (24A to 24D) are arrayed in the second direction to open/close the ports. The valve plates are slid by an actuating mechanism (30A to 30D) .

摘要翻译： 一种用于半导体处理系统的闸阀（20）包括形成沿第一方向排列的多个通道（22A至22D）的壳体（21）。 通道分别在垂直于第一方向的第二方向上具有面向第一预定侧的端口（23A至23D）。 端口分别在第二方向上逐渐设置在靠近第一方向上的第二预定侧的阀座（25A至25D）上。 阀板（24A至24D）沿第二方向排列以打开/关闭端口。 阀板通过致动机构（30A至30D）滑动。

公开(公告)号：EP1604386A2

公开(公告)日：2005-12-14

申请号：EP04721063.8

申请日：2004-03-16

申请人： TOKYO ELECTRON LIMITED

发明人： WALLACE, Jay ,  HAMELIN, Thomas

IPC分类号： H01L21/00

CPC分类号： H01L21/67748 ,  C23C16/4405 ,  C25D11/02 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67248 ,  H01L21/67253 ,  Y10S414/135 ,  Y10S414/139

摘要： A dual chamber apparatus including a first chamber and a second chamber which is configured to be coupled to the first chamber at an interface. Each of the first chamber and the second chamber has a transfer opening located at the interface. An insulating plate is located on one of the first chamber and the second chamber at the interface and is configured to have a low thermal conductivity such that the first chamber and the second chamber can be independently controlled at different temperatures when the first chamber and the second chamber are coupled together. Additionally, the apparatus may include an alignment device and/or a fastening device for fastening the first chamber to the second chamber. In embodiments, the insulating plate may be constructed of Teflon. Further, the first chamber may be a chemical oxide removal treatment chamber and the second chamber may be a heat treatment chamber.

公开(公告)号：EP0886618A4

公开(公告)日：2005-09-07

申请号：EP97902010

申请日：1997-01-14

申请人： BROOKS AUTOMATION INC

发明人： MUKA RICHARD S

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67017 ,  H01L21/67772 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139

摘要： A system uses a portable carrier (32) for transporting wafers in a particle-free environment. A cassette (34) within the carrier is delivered to a clean load lock (22). A mini-environment (52) defines an interior region (54) for the reception of the carrier. Transfer mechanisms (68, 70) retrieve the cassette from the carrier and move it into the load lock chamber. A hood (78) of the mini-environment is movable between lowered and raised positions while maintaining a seal with its walls. Laminar flow air is continually directed through the mini-environment and filtered to remove particles from the wafers in the cassette.

公开(公告)号：EP1547120A1

公开(公告)日：2005-06-29

申请号：EP03754850.0

申请日：2003-09-24

申请人： Varian Semiconductor Equipment Associates Inc.

发明人： EVANS, Morgan, D.

IPC分类号： H01J37/18

CPC分类号： H01J37/185 ,  H01J37/20 ,  H01J2237/31701 ,  H01L21/67155 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67772 ,  Y10S414/135 ,  Y10S414/139

摘要： An apparatus in combination with a load lock of an ion implanter comprises a cover adjacent an isolation valve slot of the load lock. The cover defines an aperture generally conforming to the size and shape of the load, or wafer, within the load lock with sufficient clearance for a robot arm to pick the wafer from within the load lock and transfer the wafer to the implant chamber. The cover masks a portion of the slot so as to reduce the opening between the load lock and the implant chamber of the ion implanter. The smaller opening reduces the pressure burst from the load lock to the implant chamber when the isolation valve and slot is opened. By reducing the pressure burst, the cover can shorten the recovery time for the implant chamber to reach operating pressure.

摘要翻译： 与离子植入器的负载锁相结合的设备包括与负载锁的隔离阀槽相邻的盖。 该盖限定了大体上符合装载锁内的负载或晶片的尺寸和形状的孔，其具有足够的间隙以供机器人臂从装载锁内拾取晶片并将晶片传送到植入室。 该罩掩蔽了槽的一部分，以便减少离子注入机的加载锁和注入室之间的开口。 当隔离阀和槽打开时，较小的开口减少了从加载锁到植入室的压力冲击。 通过减少压力爆裂，封盖可以缩短植入室达到操作压力的恢复时间。