-
11.发明公开Method of removing and/or applying conductive material 失效Verfahren zur Entfernung und / oder Aufbringung von leitendem材料
公开(公告)号：EP0889680A2
公开(公告)日：1999-01-07
申请号：EP98111307.9
申请日：1998-06-19
发明人： Haller, Hans-Otto
摘要： We are familiar with etching printed circuit boards chemically by providing a copper board with a mask and etching copper away chemically at those points where the mask is not present. This is disadvantageous, e.g. from environmental standpoints, because the chemical liquid is increasingly enriched with copper, and, when the liquid has been used, it can no longer be employed and is also difficult to dispose of.
The invention is based on the object of providing a method of either applying or removing conductive material electrically.
The inventive method of removing electrically conductive material from a printed circuit board having an etching mask, which covers the conductor structure, arranged on it is characterized by the fact that the following steps are carried out:
a) the printed circuit board, together with an electrode, is placed in an electrolytic liquid,
b) voltages of different potential are applied to the printed circuit board and the electrode, and
c) electrically conductive material is removed from the printed circuit board.摘要翻译： 我们熟悉通过在不存在掩模的那些位置提供具有掩模的铜板和化学蚀刻铜来化学蚀刻印刷电路板。 这是不利的，例如 从环境的角度来看，由于化学液体越来越多地富含铜，并且当已经使用液体时，它不能再被使用并且也难以处置。 本发明的目的是提供一种电气地施加或去除导电材料的方法。 从具有布置在其上的具有覆盖导体结构的蚀刻掩模的印刷电路板去除导电材料的本发明的方法的特征在于执行以下步骤：a）印刷电路板与 电极放置在电解液中，b）将不同电位的电压施加到印刷电路板和电极，以及c）导电材料从印刷电路板上去除。
-
12.发明授权
-
13.发明公开Method and electrode for defining and replicating structures in conducting materials 有权Verfahren zur定义和复制von Strukturen在leitfähigenMaterialien
公开(公告)号：EP2322694A1
公开(公告)日：2011-05-18
申请号：EP10182946.3
申请日：2002-06-17
摘要： The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode (8), is replicated on an electrically conductive material, a substrate (9). The master electrode (8) is put in close contact with the substrate (9) and the etching/plating pattern is directly transferred onto the substrate (9) by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells (12,14), that are formed in closed or open cavities between the master electrode (8) and the substrate (9).
摘要翻译： 本发明涉及一种电化学图案复制方法，ECPR，以及用于生产涉及微结构和纳米结构的应用的导电电极的结构。 由导电电极，主电极（8）限定的蚀刻或电镀图案被复制在导电材料，基板（9）上。 主电极（8）与基板（9）紧密接触，并通过接触蚀刻/电镀工艺将蚀刻/镀覆图案直接转印到基板（9）上。 接触蚀刻/电镀工艺在局部蚀刻/电镀单元（12,14）中进行，其形成在主电极（8）和基板（9）之间的闭合或开放空腔中。
-
14.发明公开Patterning PEDOT:PSS layer by controlled electrochemical reaction 审中-公开电子邮件：PSS Schicht mittels kontrollierter elektrochemischer Reaktion
公开(公告)号：EP1916670A2
公开(公告)日：2008-04-30
申请号：EP07119282.7
申请日：2007-10-25
申请人： Acreo AB
CPC分类号： H05K3/08 , H05K1/0393 , H05K3/02 , H05K3/061 , H05K3/07 , H05K2201/0329 , H05K2203/0117 , H05K2203/0121 , H05K2203/0143 , H05K2203/1142 , H05K2203/1545 , H05K2203/163
摘要： A method for monitoring a substrate patterning process, wherein at least two electrodes (2, 3) are used to apply a voltage to the substrate (1) to cause a reaction in a portion of the substrate, comprises recording a current driven by said voltage as a function of time and/or as a function of a position of the substrate (1) or a patterning mask.
Also disclosed are a device and a computer program product for monitoring the substrate patterning process.摘要翻译： 一种用于监测衬底图案化工艺的方法，其中使用至少两个电极（2,3）向所述衬底（1）施加电压以引起所述衬底的一部分中的反应，包括记录由所述电压驱动的电流 作为时间的函数和/或作为衬底（1）或图案掩模的位置的函数。 还公开了一种用于监测基板图案化工艺的装置和计算机程序产品。
-
15.发明公开Verfahren zur Behandlung von elektrisch leitfähigen Substraten wie Leiterplatten und dergleichen 审中-公开治疗导电基底，例如印刷电路板等的方法
公开(公告)号：EP1309236A2
公开(公告)日：2003-05-07
申请号：EP02024160.0
申请日：2002-10-30
摘要： Bei einem Verfahren zur Behandlung von elektrisch leitfähigen Substraten wie Leiterplatten, gedruckten Schaltungen und dergleichen, bei dem vorzugsweise mindestens ein Metall in einem Elektrolyten durch ein elektrisches Feld, das zwischen dem Substrat und einer vorzugsweise kathodisch geschalteten Elektrode angelegt wird, mindestens teilweise elektrochemisch abgetragen wird, sind Bereiche des Substrats, insbesondere der Substratoberfläche, zeitweise gegen das elektrische Feld abgeschirmt.
摘要翻译： 在用于治疗的导电基底，例如印刷电路板，印刷电路等，其中优选至少一种金属是至少部分地去除电化学在通过电场的电解质，其在基体和一个优选阴极连接电极之间施加的方法， 在衬底的领域，特别是在基板表面上，暂时从电场屏蔽。
-
公开(公告)号：EP0889680A3
公开(公告)日：2000-07-05
申请号：EP98111307.9
申请日：1998-06-19
发明人： Haller, Hans-Otto
摘要： The invention is based on the object of providing a method of either applying or removing conductive material electrically. The inventive method of removing electrically conductive material from a printed circuit board (PL) having an etching mask, which covers the conductor structure, arranged on it is characterized by the fact that the following steps are carried out: a) the printed circuit board (PL), together with an electrode (ELC), is placed in an electrolytic liquid (E), b) voltages of different potential are applied to the printed circuit board (PL) and the electrode (ELC), and c) electrically conductive material is removed from the printed circuit board (PL).
-
17.发明公开METHOD AND APPARATUS FOR MANUFACTURING INTERCONNECTS WITH FINE LINES AND SPACING 失效用于制造具有细线和间隔的互连的方法和装置
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.01 秒)
