摘要:
In a semiconductor memory device having a nibble mode function, memory cell arrays are divided into two groups of first and second cell blocks; data bus lines are provided separately to each of the first and second cell blocks; sense amplifiers are provided separately to each of data bus lines; a column decoder for connecting between bit lines is provided in the memory cell array and corresponding data bus lines based on address signals and gate signals in selection state; a switching circuit is provided for switching between sense amplifiers belonging to the first cell block and sense amplifiers belonging to the second cell block and for connecting these sense amplifiers to output buffers; and a clock signal generating circuit is provided for generating the gate signals, and the gate signals are generated by such a way that each gate signal is raised in response to a leading edge of a column address strobe signal and is allowed to fall in response to a trailing edge of the column address strobe signal in the nibble mode.
摘要:
A semiconductor memory device is provided which comprises a main memory cell array (MCA) including a plurality of rows of cell arrays each row corresponding to a two-dimensional virtual matrix configuration, and a redundancy memory cell array (RCA') including a plurality of rows of redundancy memory cells each row corresponding to one horizontal or vertical group of memory cells of the virtual matrix configuration. When a selected memory cell is a predetermined defective cell, a row of memory cells including such a defective cell is replaced with the redundancy memory cell array, thereby correcting a hard error. Also, when such a defective cell is accessed by an error checking and correcting (ECC) circuit of a horizontal and vertical parity checking type, a horizontal or vertical group of memory cells including the selected memory cell is replaced with the corresponding row of the redundancy memory cell array, thereby correcting a soft error and a hard error other than the predetermined hard error.
摘要:
@ In a semiconductor memory device, a decoder circuit (1) is located between first (3) and second (5) memory cell arrays. A sequence of driver circuits (121,122...) in the decoder circuit (1) provides driver circuits common to the first and second memory cell arrays. An output terminal (1211 a,1211b,1221a,...) of each driver circuit is connected directly to a data input/output portion (2) for the first memory cell array (3) and connected to another data input/output portion (4) for the second memory cell array (5) via wirings (141 a, 141 b, 142a, ...) traversing the decoder circuit (1 ).
摘要:
The semiconductor memory device can continuously read or store a plurality of data therefrom or therein. The semiconductor memory device includes a memory unit having a plurality of memory cells (3,4), the memory cells being arranged in a matrix having rows and columns, and a reading storing circuit. The reading storing circuit can read or store data from or into the memory cell at an address corresponding to an address signal received therein in response to the reception of first and second control signals, respectively. The reading storing circuit also can consecutively read or store data from or into the memory cell at another address subsequent to the address read or stored at the last time in response to the reception of the second control signal. Such a device can therefore have improved access time for continuous accessing of a plurality of data.
摘要:
@ A semiconductor memory device, such as a MOS dynamic RAM device, having memory cells each comprising a transfer gate transistor (10) and a capacitor (11). The capacitor (11) is a so-called groove-type capacitor and has a conductive layer (18) formed on an insulation film (17) attached to the inside surface of a groove (16) formed on a semiconductor substrate (12). The conductive layer (18) is electrically coupled to the source (14) of the transfer gate transistor (10). The capacitance of the capacitor (11) is formed between the conductive layer (18) and a second conductive layer (20) formed on the conductive layer (18) via an insulation film (19), and/or between the conductive layer (18) and the semiconductor substrate (12).
摘要:
A dynamic semiconductor memory device provides a selected real cell which is connected to one of a pair of bit lines connected to a sense amplifier and a dummy cell which is connected to the other bit line so as to perform the read-out operation. The dynamic semiconductor memory cell further provides an active restore circuit for pulling up the bit line potential of the bit line on the higher potential side of the pair of bit lines, in which the potential difference is increased by the read-out operation, or a write circuit for charging the selected real cell through the bit line. A test power source pad is provided in the active restore circuit or the write in circuit so that when the reference level of the read cell is tested, an optional power source can be applied from the test power source pad instead of from a normal power source.
摘要:
A semiconductor integrated circuit including a memory unit for storing address information of a failed circuit portion for replacing the failed circuit portion by a redundant circuit portion. The semiconductor integrated circuit provides a comparison unit (24) for detecting coincidence between data read from the memory unit (21) and a received input address (Ao, An). Data produced from the comparison by the comparison unit is delivered through an external connection terminal (7).
摘要:
@ A semiconductor memory device, such as a MOS dynamic RAM device, having memory cells each comprising a transfer gate transistor (10) and a capacitor (11). The capacitor (11) is a so-called groove-type capacitor and has a conductive layer (18) formed on an insulation film (17) attached to the inside surface of a groove (16) formed on a semiconductor substrate (12). The conductive layer (18) is electrically coupled to the source (14) of the transfer gate transistor (10). The capacitance of the capacitor (11) is formed between the conductive layer (18) and a second conductive layer (20) formed on the conductive layer (18) via an insulation film (19), and/or between the conductive layer (18) and the semiconductor substrate (12).
摘要:
A semiconductor integrated circuit device having a fuse-blown type ROM for storing information concerning defective bits for the replacement of defective bits in a semiconductor memory device, etc., with redundant bits. The integrated circuit device comprises fuses (F,) for constituting the ROM, pads (PB) for supplying a melting current to the fuses, and PN junctions (D 1 ) each being formed, for example, by a semiconductor substrate and a diffusion layer formed on the semiconductor substrate. Each of the fuses is melted by applying voltage to a circuit connecting the PN junction (D i ), the fuse (F 1 ), and the pad (PB) so that the PN junction (D i ) is forward biased, and thereby, supplying a large current to the fuse.