公开(公告)号：EP1384396A1

公开(公告)日：2004-01-28

申请号：EP02766904.3

申请日：2002-04-30

申请人： Infineon Technologies AG

发明人： BARTOLA, Robert ,  MOGEL, James ,  LAUREANTI, Steven, J.

IPC分类号： H05K1/02

CPC分类号： H05K1/0272 ,  H01L23/473 ,  H01L2224/32

摘要： A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.

公开(公告)号：EP1163483A1

公开(公告)日：2001-12-19

申请号：EP00918176.9

申请日：2000-03-20

申请人： Eaton, Manford L.

发明人： Eaton, Manford L.

IPC分类号： F28F7/00

CPC分类号： C09K5/06 ,  C09K5/063 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3737 ,  H01L23/4275 ,  H01L24/32 ,  H01L2224/32 ,  H01L2924/3011 ,  Y10T29/4935

摘要： A method for establishing a thermal interface (1000) between an electrical component (200) and a heat sink (100) including the selection of a compound having a melt temperature above the normal operating temperature of the component (200). The electrical component (200) initially reaches an initial operating temperature sufficient to deform or melt the compound and fill the spaces between the mating surfaces (210, 110) of the component (200) and heat sink (100). Upon cooling, a solidified thermal joint (1000) is permanently established which precludes the component (200) from heating beyond its normal operating temperature upon subsequent operation. As the normal operating temperature of the component (200) is below the melt point of the compound, the compound remains in a solid state. The compound is selected so as to deform only during initial component (200) operation so as to avoid the problems of liquefaction. An alternative compound is selected with the above attributes along with desired adhesive characteristics to fix the component (200) to the heat sink (100) with the compound therebetween at low closure forces.

公开(公告)号：EP1142015A1

公开(公告)日：2001-10-10

申请号：EP00956979.9

申请日：2000-09-06

申请人： Sony Computer Entertainment Inc.

发明人： OOTORI, Yasuhiro ,  SASAKI, Chiyoshi

IPC分类号： H01L23/367 ,  H01L23/42

CPC分类号： H01L23/367 ,  H01L2224/32 ,  H01L2224/73253 ,  H01L2224/83385

摘要： A heat sink includes a heat receiving surface having a plurality of protruding portions, the heat receiving surface of which is thermally connected to a heat generating component through a heat transfer rubber, to receive heat from the heat generating component and then dissipate the heat.

公开(公告)号：EP0627765B1

公开(公告)日：1998-09-30

申请号：EP94201343.4

申请日：1994-05-11

申请人： LABORATOIRES D'ELECTRONIQUE PHILIPS S.A.S. ,  Koninklijke Philips Electronics N.V.

发明人： Gamand, Patrice, Société Civile S.P.I.D.

IPC分类号： H01L23/48 ,  H01L23/66

CPC分类号： H01L23/66 ,  H01L23/481 ,  H01L2224/32 ,  H01L2224/33 ,  H01L2924/3011

公开(公告)号：EP0828410A2

公开(公告)日：1998-03-11

申请号：EP97202494.7

申请日：1997-08-12

申请人： DELCO ELECTRONICS CORPORATION

发明人： Stankavich, Anthony John ,  Sarma, Dwadasi Hare Rama ,  Paszkiet, Christine Ann ,  Ellis, Marion Edmond

IPC分类号： H05K3/34

CPC分类号： H05K3/3484 ,  H01L2224/16225 ,  H01L2224/32 ,  H05K1/092 ,  H05K2201/10992 ,  H05K2203/043

摘要： A high temperature thick-film hybrid circuit characterized by a surface-mount circuit component (10) that is electrically interconnected with a conductor (14). The surface-mount circuit component (10) of the thick-film hybrid circuit is bonded to the conductor (14) with a soldering technique employing dual-solder layers (18,20). The dual-solder layers (18,20) enable component attachment to the conductor (14) at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165°C. The dual-solder layers (18,20) chosen to inhibit tin diffusion from the solder, silver leaching from the conductor (14), and the formation of a brittle intermetallic at the solder-conductor interface.

摘要翻译： 一种高温厚膜混合电路，其特征在于与导体（14）电互连的表面安装电路部件（10）。 厚膜混合电路的表面安装电路部件（10）通过使用双焊料层（18,20）的焊接技术结合到导体（14）。 双焊料层（18,20）使得组件能够在低于组件的最大加工温度的温度下与导体（14）附接，同时形成在超过165℃的温度下表现出合适的粘合性能的焊接接头。 所选择的双焊料层（18,20）用于抑制锡从焊料的扩散，来自导体（14）的银浸出，以及在焊料 - 导体界面处形成脆性金属间化合物。