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337 条记录 (耗时 0.019 秒)

    DURCHFÜHRUNGSVORRICHTUNG FÜR EIN EXPLOSIONSGESCHÜTZTES GEHÄUSE
    31.
    发明公开
    DURCHFÜHRUNGSVORRICHTUNG FÜR EIN EXPLOSIONSGESCHÜTZTES GEHÄUSE 有权
    执行装置用于防爆HOUSING

    公开(公告)号：EP2862250A1

    公开(公告)日：2015-04-22

    申请号：EP13719880.0

    申请日：2013-05-03

    申请人： R. Stahl Schaltgeräte GmbH

    发明人： WONDRAK, Tom

    IPC分类号： H02G3/22 ,  H02G3/06 ,  H02G3/08

    CPC分类号： H02G3/06 ,  H02G3/088 ,  H02G3/22 ,  H05K5/02 ,  H05K5/069

    摘要： The invention relates to a feedthrough device (10) for an explosion-proof housing which is constructed, in particular, as a "flameproof enclosure" of the flame protection type. The feedthrough device (10) is arranged in a wall opening of the housing and forms a flameproof gap therein. A rigid component (11) is arranged through said gap so as to be displaced in its direction of extension relative to the wall of the housing. The feedthrough device (10) has, in particular, a clamping body unit (20), a sleeve (21), a cap (22) and a thrust collar (23). The sleeve (21) and the cap (22) can be screwed together. Axial forces are transmitted between the clamping body unit (20) and the cap (22) via the thrust collar (23), which axial forces in turn are supported on mutually abutting surfaces (26, 36) of the clamping body unit (20) and/or of the sleeve (21) that run transversally to the longitudinal axis (L). The sleeve (21) thereby exerts a radial clamping force on the clamping body unit (20). The clamping body unit (20) is fully penetrated by a conduit (25) along a longitudinal axis (L), in which conduit a longitudinal section of a component (11) is arranged.

    ELECTRONICS ENCLOSURES WITH HIGH THERMAL PERFORMANCE AND RELATED SYSTEM AND METHOD
    33.
    发明公开
    ELECTRONICS ENCLOSURES WITH HIGH THERMAL PERFORMANCE AND RELATED SYSTEM AND METHOD 有权
    具有高热性能的电子外壳及相关系统和方法

    公开(公告)号：EP2848106A1

    公开(公告)日：2015-03-18

    申请号：EP13797147.9

    申请日：2013-03-11

    申请人： Raytheon Company

    发明人： FITZ-PATRICK, Bruce C. ,  CLAYTON, Gary A. ,  SHORT, JR., Byron E.

    IPC分类号： H05K7/20

    CPC分类号： H05K5/02 ,  B22D19/0072 ,  B22D19/04 ,  B22D25/02 ,  H05K7/20636 ,  H05K7/20645

    摘要： Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs (110, 226, 326, 426) configured to separate electronic components. The apparatus also includes at least one fluid transport structure (208, 308, 408) encased within the electronics enclosure (100, 218, 224). Each fluid transport structure includes multiple pipes (210, 310, 410) and multiple flow channels (212, 412, 502, 504, 506, 510-516, 518, 520, 606, 608). The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels.

    摘要翻译： 提供了用于冷却电子部件的各种设备，方法和系统。 例如，一种装置包括电子设备外壳，该电子设备外壳具有构造成分离电子部件的多个肋（110,226,326,426）。 该设备还包括包封在电子装置外壳（100,218,224）内的至少一个流体输送结构（208,308,408）。 每个流体传输结构包括多个管道（210,310,410）和多个流动通道（212,412,502,504,506,510-516,518,520,606,608）。 流动通道位于电子设备外壳的肋内，并且管被配置为将冷却流体输送到流动通道和从流动通道输送冷却流体。

    PORTABLE TERMINAL DEVICE
    37.
    发明公开
    PORTABLE TERMINAL DEVICE 审中-公开
    便携式终端设备

    公开(公告)号：EP2827564A1

    公开(公告)日：2015-01-21

    申请号：EP12871037.3

    申请日：2012-12-12

    申请人： NEC Corporation ,  NTT DOCOMO, INC.

    发明人： SHIRAISHI, Mitsutaka

    IPC分类号： H04M1/02 ,  H05K5/02

    CPC分类号： G06F1/1626 ,  H04M1/0266 ,  H04M1/185 ,  H05K5/02

    摘要： A portable terminal device (1) according to the present invention includes: a housing (11) comprising a concave portion (21) in which predetermined components are housed, and a mounting surface (22) that is disposed on a top surface of a side wall arranged around the concave portion (21); a fixing component (12) that is fixed to the mounting surface (22) of the housing (11) and comprises a mounting surface (23) and a protruding portion (24) that is arranged around outside of the mounting surface (23); and a display section (13) that is fixed to the mounting surface (23) at an inner side of the protruding portion (24) of the fixing component (12). Further, a rigidity of the fixing component (12) is lower than a rigidity of the housing (11) and the display section (13).

    摘要翻译： 根据本发明的便携式终端设备（1）包括：壳体（11），其包括容纳预定部件的凹部（21）和安装表面（22），所述安装表面（22）布置在侧面 围绕凹入部分（21）布置的壁; 固定在所述壳体11的安装面22上的固定部件12，所述固定部件12具有安装面23和配置在所述安装面23的外侧的突出部24。 和在固定部件（12）的突出部分（24）的内侧固定到安装表面（23）的显示部分（13）。 此外，固定部件（12）的刚性低于壳体（11）和显示部分（13）的刚性。

    ELEMENT HOUSING PACKAGE, COMPONENT FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    39.
    发明公开
    ELEMENT HOUSING PACKAGE, COMPONENT FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 审中-公开
    ELEMENTGEHÄUSEVERPACKUNG，KOMPONENTEFÜREINE HALBLEITERVORRICHTUNG UND HALBLEITERVORRICHTUNG

    公开(公告)号：EP2717309A1

    公开(公告)日：2014-04-09

    申请号：EP12792890.1

    申请日：2012-05-29

    申请人： Kyocera Corporation

    发明人： TSUJINO, Mahiro

    IPC分类号： H01L23/04 ,  H01L23/02 ,  H01L23/12

    CPC分类号： H05K5/02 ,  G02B6/4265 ,  G02B6/4274 ,  G02B6/4279 ,  G02B6/4292 ,  H01L23/057 ,  H01L23/14 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An element housing package according to one aspect of the invention includes a base body having a rectangular shape when seen in a plan view, having a mounting region for mounting a semiconductor element, a frame body disposed so as to surround the mounting region, a connection conductor disposed from the upper surface to a lower surface of the base body, a circuit conductor disposed on the lower surface of the base body, one end of the circuit conductor being electrically connected to the connection conductor and an other end of the circuit conductor being drawn out laterally from a first side surface of the base body, and a metal plate bonded to the lower surface of the base body, having an attachment region which is drawn out laterally from a second side surface adjacent to the first side surface of the base body to be attached to a mounting board, and a ground conductor region which is drawn out laterally from the first side surface of the base body so as to be parallel to the circuit conductor. The metal plate further has an outer peripheral region which is drawn out laterally from the base body, from the ground conductor region to the attachment region along an outer periphery of the base body when seen in a plan view.

    摘要翻译： 根据本发明的一个方面的元件容纳包装包括：当在平面图中看到时具有矩形形状的基体，具有用于安装半导体元件的安装区域，围绕安装区域设置的框体，连接 导体，其设置在所述基体的上表面到下表面，电路导体，其设置在所述基体的下表面上，所述电路导体的一端电连接到所述连接导体，所述电路导体的另一端为 从基体的第一侧面横向拉出，金属板与基体的下表面接合，具有从与基体的第一侧面相邻的第二侧面侧向拉出的安装区域 本体被安装在安装基板上，接地导体区域从基体的第一侧面侧向拉出，以平行于圆环 妳指挥 金属板还具有从平面图看时沿着基体的外周从基体侧从地面导体区域向附着区域拉出的外周区域。

    Gehäuse zur Aufnahme eines Flachbildschirms
    40.
    发明公开
    Gehäuse zur Aufnahme eines Flachbildschirms 审中-公开
    Gehäusezur Aufnahme eines Flachbildschirms

    公开(公告)号：EP2701475A1

    公开(公告)日：2014-02-26

    申请号：EP12181373.7

    申请日：2012-08-22

    申请人： Ruf Telematik AG

    发明人： Brunner, Stefan ,  Kern, Thomas ,  Engler, Fred

    IPC分类号： H05K5/02 ,  H05K7/20 ,  G06F1/16 ,  G06F1/20 ,  H04N5/64

    CPC分类号： H05K7/2039 ,  G06F1/1601 ,  G06F1/20 ,  H05K5/02 ,  H05K7/18 ,  H05K7/20963 ,  Y10T29/49826

    摘要： Es wird ein Gehäuse zur Aufnahme eines Flachbildschirms angegeben, mit einem Rahmen (1), welcher einen Gehäuseinnenraum (8) zur Aufnahme des Flachbildschirms begrenzt. Der Rahmen (1) ist aus einem Flachprofilelement hergestellt, welches mehrere Sollbiegestellen (15) aufweist, die zur Festlegung der Eckbereiche (19) des Rahmens (1) dienen. Auf seiner Innenseite weist der Rahmen (1) eine Innenrille (18) auf, in welche ein wärmeabführendes Element (7) derart eingesetzt ist, dass es zum Übertragen von Wärme aus dem Gehäuseinnenraum (8) auf den Rahmen (1) dient.

    摘要翻译： 壳体具有限定用于接收平板显示屏的壳体内部的框架（1）。 框架设置有设置有若干预定弯曲点（15）的平坦轮廓元件。 框架的平面轮廓元件的预定弯曲点设置在框架的角部（19）中。 包括以下独立权利要求：（1）房屋制造方法; 和（2）制造房屋的设备。