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公开(公告)号:EP3761508A2
公开(公告)日:2021-01-06
申请号:EP20183511.3
申请日:2020-07-01
Applicant: STMicroelectronics International N.V.
Inventor: GOYAL, Avneep Kumar
IPC: H03K5/135 , H03K19/003 , H04L7/00
Abstract: A synchronizer circuit (300A) includes a first synchronizer (306A) having a first input (A) for receiving a signal associated with a first clock signal (CLK_A), a second input for receiving a second clock signal (CLK_B), and an output (Z1) for providing a synchronizer circuit output signal (SYNCH_O/P); a second synchronizer (308A) having a first input for receiving the signal associated with the first clock signal (CLK_A), a second input for receiving the second clock signal (CLK_B), and an output (Z2); a detection stage (310A) having a first input coupled to the output of the first synchronizer (306A) and to the output of the second synchronizer (308A), a second input for receiving the second clock signal (CLK_B), and an output (Z4); and a fault output stage (312A) having a first input (Z4) coupled to the detection stage (310A), a second input for receiving the second clock signal (CLK_B),, and an output for providing a fault output signal (FAULT_O/P).
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32.
公开(公告)号:EP3744004A1
公开(公告)日:2020-12-02
申请号:EP19741821.3
申请日:2019-01-22
Applicant: Nanyang Technological University
Inventor: CHANG, Joseph Sylvester , CHONG, Kwen Siong , LWIN, Ne Kyaw Zwa , HARIHARAKRISHNAN, Sivaramakrishnan
IPC: H03K19/003 , H03K3/356
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公开(公告)号:EP3731414A1
公开(公告)日:2020-10-28
申请号:EP20171008.4
申请日:2020-04-23
Applicant: STMicroelectronics (Rousset) SAS
Inventor: FROIDEVAUX, Nicolas , LOPEZ, Laurent
IPC: H03K19/003 , H03K19/0185 , H03K17/30
Abstract: La présente description concerne un dispositif comportant, en série (71) :
un premier transistor (73) MOS de type P ;
un deuxième transistor (75) MOS de type N, connecté au premier transistor (71) ; et
un troisième transistor (77), connecté au deuxième transistor (75), ledit troisième transistor (77) étant commandé par un signal numérique,
dans lequel la grille (733) du premier transistor (73) et la grille (753) du deuxième transistor (75) sont interconnectées et destinées à recevoir un potentiel (VDD) d'alimentation d'une puce.-
公开(公告)号:EP3443669B1
公开(公告)日:2020-03-04
申请号:EP17715312.9
申请日:2017-03-17
Applicant: Qualcomm Incorporated
Inventor: PETERSON, LuVerne Ray , BRYAN, Thomas Clark , THILENIUS, Stephen
IPC: H03K19/00 , H03K19/0185 , H03K19/003 , H03K17/16
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公开(公告)号:EP3588779A1
公开(公告)日:2020-01-01
申请号:EP18305800.7
申请日:2018-06-22
Applicant: MENTA
Inventor: PETITHOMME, Stéphane
IPC: H03K19/003 , G06F9/38
Abstract: A flexible Digital Signal Processor module comprises a Filter unit comprising a multiplier and an adder, where the multiplier receives input from a memory and a Shift Register Lookup table. The Digital Signal Processor module may implement digital filters such as FIR or IIR filters by providing suitable filter coefficients from the memory and data values from the Shift Register Lookup table. An optional state machine may ensure synchronisation of addressing of the memory Shift Register Lookup table, and between multiple instances of the Digital Signal Processor module where these are required for a particular filter implementation. The proposed architecture offers additional modes of operation in which operations other than filter implementations are supported.
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公开(公告)号:EP2503695B1
公开(公告)日:2019-12-18
申请号:EP12161092.7
申请日:2012-03-23
Applicant: LG Innotek Co., Ltd.
Inventor: Lee, Youngwuk
IPC: H03K19/003
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37.
公开(公告)号:EP3475981B1
公开(公告)日:2019-12-11
申请号:EP17722594.3
申请日:2017-04-26
Applicant: Qualcomm Incorporated
Inventor: KUMAR, Dorav , NARAYANAN, Venkatasubramanian , THALLA, Bala Krishna , RASOULI, Seid Hadi , GUTTAL, Radhika Vinayak , PATURI, Sivakumar
IPC: H01L23/528 , H03K19/177 , H01L27/02 , H01L27/088 , H03K19/003
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公开(公告)号:EP2439847B1
公开(公告)日:2019-10-02
申请号:EP11184567.3
申请日:2011-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Lee, Jeong-Ho , Hong, Seung-Pyo , Son, Ju-Ho , Jang, Seung-Ho , Gill, Hyun-Tae , Lee, Joon-Hee , Roh, Yi-Ju
IPC: H03K19/003
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39.
公开(公告)号:EP3095192B1
公开(公告)日:2019-08-07
申请号:EP14802059.7
申请日:2014-11-21
Applicant: Robert Bosch GmbH
Inventor: RITZMANN, Steffen , ROSAHL, Thoralf
IPC: H03K17/16 , H03K19/003
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40.
公开(公告)号:EP3506510A1
公开(公告)日:2019-07-03
申请号:EP18208735.3
申请日:2018-11-27
Applicant: INTEL Corporation
Inventor: ATSATT, Sean R. , WEBER, Scott J. , DASU, Aravind Raghavendra , GUTALA, Ravi Prakash
IPC: H03K19/003 , G06F1/20 , G06F1/3296 , G06F1/3287 , H03K19/00 , H03K19/0175
Abstract: An integrated circuit assembly may include an integrated circuit having a plurality of programmable logic sectors and an interposer circuit positioned adjacent to the integrated circuit. The interposer circuit may include at least one voltage regulator that distributes a voltage to at least one of the plurality of programmable logic sectors and at least one thermal sensor that measures a temperature of the at least one of the plurality of programmable logic sectors.
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