RESIN COMPOSITION FOT THROUGH-HOLE FILLING.
    36.
    发明公开

    公开(公告)号:EP3819324A1

    公开(公告)日:2021-05-12

    申请号:EP20204155.4

    申请日:2020-10-27

    摘要: Provided are a resin composition and so forth that can enhance a desmear resistance and an adhesion property between a magnetic layer and a conductive layer and that can give a cured product having a swelling of the conductive layer after a reflow treatment suppressed. The resin composition includes (A) a magnetic powder, (B-1) a solid resin, (B-2) a liquid resin, and (C) a curing accelerator having a melting point of 120°C or higher and 245°C or lower, in which b1/b2 is in the range of 0.15 or more and 0.45 or less, where b1 is a content of the (B-1) component when non-volatile components in the resin composition is taken as 100% by mass, and b2 is a content of the (B-2) component when non-volatile components in the resin composition is taken as 100% by mass.