VERFAHREN ZUR HERSTELLUNG EINER HYBRID INTEGRIERTEN OPTISCHEN SCHALTUNG UND VORRICHTUNG ZUR EMISSION VON LICHTWELLEN
    43.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINER HYBRID INTEGRIERTEN OPTISCHEN SCHALTUNG UND VORRICHTUNG ZUR EMISSION VON LICHTWELLEN 失效
    制造用于签发光波一种混合集成光路和设备。

    公开(公告)号:EP0630486A1

    公开(公告)日:1994-12-28

    申请号:EP94900752.0

    申请日:1993-12-04

    IPC: G02B6

    Abstract: L'invention concerne un procédé servant à fabriquer un circuit optique intégré de manière hybride. Selon le procédé on utilise un outil de façonnage (39) muni de dispositifs de formation de logement (4) pour un composant semi-conducteur électro-optique (2) et de moules négatifs (5) pour un canal de guide d'ondes (9) et de dispositifs de formation de logement (12) pour un guide d'ondes lumineuses (10). Les dispositifs de formation de logement (4) de l'outil de façonnage (3) ajustent le composant semi-conducteur (2) électro-optique par rapport au moule négatif (5) du canal de guide d'ondes (9) lors du formage avec un polymère. L'unité structurale (13) obtenue se compose du composant semi-conducteur (2) électro-optique qui est ajusté par rapport au canal de guide d'ondes (9) formé dans le polymère. Des dispositifs de formation de logement (6) façonnés dans le polymère sont raccordés au canal de guide d'ondes (9) et permettent d'accoupler par auto-ajustage un guide d'ondes lumineuses (10) au canal de guide d'ondes. L'unité structurale (13) et le guide d'ondes lumineuses (10) sont accouplés solidement l'un à l'autre au moyen d'un revêtement (7), le canal du guide d'ondes (9) étant rempli avec un matériau optiquement transparent, ce qui constitue un guide d'ondes (20).

    Active device mount with mark prevention
    44.
    发明公开
    Active device mount with mark prevention 失效
    Halterfürein aktives Bauteil mit Vermeidung der Riefenbildung。

    公开(公告)号:EP0490541A1

    公开(公告)日:1992-06-17

    申请号:EP91311081.3

    申请日:1991-11-29

    Abstract: An active device mount (1), comprises, a body (2) for receiving an optoelectronic device (10) and having a socket (11) for receiving a holder (15) for an optical fiber, an interior and an entrance end of the socket (11) being covered with a material (16) molded with a lip (17) projecting from the entrance end, the lip (17) having exterior mold vestiges (54), the material (16) preventing a rubbing mark from being applied on the holder (15) by the socket (11), and apertures are filled with material (16) during molding to preclude rotation of the material (16) relative to body (2).

    Abstract translation: 一种有源器件安装件(1),包括:用于接收光电子器件(10)的本体(2),并具有用于容纳用于光纤的保持器(15)的插座(11),所述插座 插座(11)被用从入口端突出的唇部(17)模制的材料(16)覆盖,所述唇部(17)具有外部模具残留物(54),所述材料(16)防止施加摩擦标记 通过插座(11)在保持器(15)上,并且在模制期间用材料(16)填充孔,以防止材料(16)相对于主体(2)旋转。

    OPTICAL PACKAGE AND A PROCESS FOR ITS PREPARATION
    48.
    发明公开
    OPTICAL PACKAGE AND A PROCESS FOR ITS PREPARATION 审中-公开
    OPTISCHESGEHÄUSEUND VERFAHREN ZU DESSEN HERSTELLUNG

    公开(公告)号:EP2943830A1

    公开(公告)日:2015-11-18

    申请号:EP14700607.6

    申请日:2014-01-13

    Abstract: The present invention is directed to a package including optical components, comprising: (i) at least one structure, the structure having at least one optical input or output, (ii) at least one optical interconnection, optically connected to the at least one optical input or output, and (iii) a component in which the at least one optical interconnection and the at least one optical input or output is embedded, wherein (a) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) are made from a chemically identical material, wherein the material of the at least one optical interconnection has a different primary and/or secondary structure, compared to the material of the component embedding the at least one optical interconnection and the at least one optical input or output, (b) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) have a difference in their refractive indices of at least 0.0004 to 0.0015 at 850, 1310, and 1550 nm, respectively, and (c) the at least one optical interconnection (ii) is mechanically fixed by the component (iii) embedding the at least one optical interconnection and the at least one optical input or output. Further, the invention provides methods for the preparation of the said package.

    Abstract translation: 包括光学部件的封装具有一个或多个具有光输入或光输出的结构。 光互连光连接到结构的光输入或光输出。 提供了一种组件,其中嵌入了光学互连和结构的光输入或光输出。 该部件由第一材料和第二材料的光学互连制成。 第一和第二种材料在化学上是相同的。 第一材料具有第一初级和/或二级结构,第二材料具有第二主要和/或二级结构。 第一主和/或二级结构不同于第二主和/或二级结构。 分量和光互连的折射率分别在850nm,1,310nm和1,550nm处彼此相差至少0.0004。 光学互连由部件机械固定。

    OPTICAL MODULE
    49.
    发明公开
    OPTICAL MODULE 有权
    OPTISCHES MODUL

    公开(公告)号:EP2772779A1

    公开(公告)日:2014-09-03

    申请号:EP12844149.0

    申请日:2012-10-03

    Abstract: A prism/lens array (25) in the present invention is a grass prism having an approximately 45 degrees tapered part. A plurality of lenses (31) are provided side by side on the front surface of the prism/lens array (25). A pair of protrusions (33) are formed on both sides of lenses (31) on the surface on which the lenses (31) are provided. The protrusions (33) are formed in the top-bottom direction of the prism/lens array (25) and roughly V-shaped cross sections. Grooves (35) are provided in an inside surface of a prism-securing part (19), in areas corresponding to the protrusions (33). The grooves (33) are shaped such that the protrusions (33) can fit into the grooves; for example, the grooves could have roughly V-shaped cross sections.

    Abstract translation: 本发明的棱镜/透镜阵列(25)是具有大致45度锥形部的草棱镜。 多个透镜(31)并排设置在棱镜/透镜阵列(25)的前表面上。 在设置有透镜(31)的表面上的透镜(31)的两侧上形成有一对突起(33)。 突起(33)在棱镜/透镜阵列(25)的上下方向上形成大致V字状的截面。 在对应于突起(33)的区域中,棱镜(35)设置在棱镜固定部(19)的内表面中。 凹槽33被成形为使得凸起33能够嵌合到凹槽中; 例如,凹槽可以具有大致V形的横截面。

    Optical module and fabrication method
    50.
    发明公开
    Optical module and fabrication method 审中-公开
    Optisches Modul und Herstellungsverfahren

    公开(公告)号:EP2733512A2

    公开(公告)日:2014-05-21

    申请号:EP13184938.2

    申请日:2013-09-18

    Abstract: An optical module includes a flexible printed circuit board on which a light receiving element and/or a light emitting element is mounted face-down as an optical element, and having a part that transmits incoming light to the light receiving element and/or outgoing light from the light emitting element; a lens member disposed on a surface of the printed circuit board, on which the optical element is not mounted, and integrally formed to have within a predetermined area, a lens that transmits the incoming and/or the outgoing light, and a convex part abutting the printed circuit board; a bonding member disposed in an area other than the predetermined area, between the printed circuit board and the lens member, and that bonds the printed circuit board and the lens member; and a cooling member disposed to apply pressure to the optical element toward the printed circuit board and cool the optical element.

    Abstract translation: 光学模块包括柔性印刷电路板,光接收元件和/或发光元件以面朝下的方式安装在其上作为光学元件,并且具有将入射光透射到光接收元件和/或出射光的部分 从发光元件; 透镜构件,设置在印刷电路板的未安装光学元件的表面上,并且整体形成为具有在预定区域内的透镜,透射出入射光和/或出射光的透镜,以及凸出部邻接的透镜构件 印刷电路板; 布置在所述印刷电路板和所述透镜构件之间的所述预定区域以外的区域中的粘合构件,并且将所述印刷电路板和所述透镜构件接合; 以及冷却构件,其设置成向所述光学元件朝向所述印刷电路板施加压力并冷却所述光学元件。

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