AUTOMATED FIBER BUNDLE PLACEMENT APPARATUS
    45.
    发明公开

    公开(公告)号:EP4212319A1

    公开(公告)日:2023-07-19

    申请号:EP22215626.7

    申请日:2022-12-21

    摘要: An automated fiber bundle placement apparatus is configured to lay a strip-like fiber bundle impregnated with a thermoplastic resin on a stacking surface on an upper side of a placement die by moving a placement head and by emitting a laser from an emitting device to deposit the fiber bundle on the stacking surface incompletely. The emitting device is configured to emit the laser toward the fiber bundle laid on the stacking surface to its surface that is a reverse side of its surface facing the stacking surface.