Abstract:
Expandable vinyl aromatic polymers may contain comminuted graphite with a polymodal particle size distribution. Foams obtained from such expandable vinyl aromatic polymers have a reduced thermal conductivity at a reduced foam density.
Abstract:
The present invention relates to a film, in particular to a laser writable film, and to substances used therein, and components thereof. The present invention further relates to a method of manufacturing the film, uses thereof and products comprising the film.
Abstract:
Die vorliegende Erfindung betrifft Zusammensetzungen auf Basis von Polyamid 6 (PA 6) oder Polyamid 66 (PA 66) enthaltend Melamincyanurat, Titandioxid, Glasfasern und nicht-faserförmiges und nicht-geschäumtes gemahlenes Glas mit spezieller Teilchengrößenverteilung, Geometrie und gegebenenfalls Schlichte sowie die Herstellung und die Verwendung der erfindungsgemäßen Zusammensetzungen zur Herstellung von Erzeugnissen der Elektroindustrie, bevorzugt Elektrobauteilen, besonders bevorzugt zur Herstellung von FI-Schaltern und Leitungsschutzschaltern.
Abstract:
A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 µm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 µm or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.
Abstract:
Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan´ of a loss modulus E" to a storage modulus E' (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E' is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm 3 .
Abstract:
The present invention provides a vulcanized rubber capable of improving ice performance of the tire, in particular a vulcanized rubber which is made by vulcanizing a rubber component and has cells with an aspect ratio of 1-30 of which at least a part of a wall surface is hydrophilic.
Abstract:
Vehicle tyre, notably winter tyre, the tread of which contains a rubber composition that is thermally expandable in the non-vulcanized state, expanded in the vulcanized state; in the non-vulcanized state, said composition contains a diene elastomer such as natural rubber and/or a polybutadiene, more than 50 phr of a reinforcing filler such as silica and/or carbon black, between 5 and 25 phr of microparticles of a sodium or potassium (hydrogen) carbonate having a median particle size by weight of between 1 and 50 µm, between 2 and 20 phr of a carboxylic acid the melting point of which is between 60°C and 220°C, such as citric acid or stearic acid for example, the total (hydrogen) carbonate and carboxylic acid content being higher than 10 phr, preferably higher than 15 phr. The combined use of the latter two compounds, at the recommended high contents, allows a great improvement to the grip of the tyre on melting ice without penalizing the rate at which this thermally expandable rubber composition is cured.
Abstract:
Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
Abstract:
The present invention relates to a method of preparing a hard coating film, and, more particularly, to a method of preparing a hard coating film having high hardness. According to this method, a hard coating film having high hardness, which is not easily curled, can be easily prepared.