公开(公告)号：EP2674464A4

公开(公告)日：2017-01-25

申请号：EP12744721

申请日：2012-01-31

Applicant: NITTO DENKO CORP

Inventor： TOJO MIDORI ,  NAKAYAMA YUSUKE ,  TERADA YOSHIO ,  FURUTA KENJI

IPC: C09J7/00 ,  C08K3/22 ,  C09J7/02 ,  C09J11/04 ,  C09J133/04

CPC classification number: C08K3/22 ,  C08K3/016 ,  C09J7/0217 ,  C09J7/385 ,  C09J133/04 ,  C09J2205/102 ,  Y10T428/2891

Abstract: A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a flame-retardant thermally-conductive pressure-sensitive adhesive layer containing at least: (a) an acrylic polymer prepared by copolymerizing a monomer component containing an alkyl (meth)acrylate as a main component, containing a polar group-containing monomer, and not substantially containing a carboxyl group-containing monomer and (b) a hydrated metal compound.

公开(公告)号：EP2051289A4

公开(公告)日：2014-12-03

申请号：EP07767555

申请日：2007-06-26

Applicant: NITTO DENKO CORP

Inventor： TERADA YOSHIO ,  SUGO YUKI ,  YOSHIDA YOSHINORI ,  MAENO YOUHEI

IPC: B08B1/00 ,  B82Y30/00 ,  C01B31/02

CPC classification number: B08B1/00 ,  B08B7/0028 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B2202/08 ,  C01B2202/34 ,  C01B2202/36

Abstract: Provided is a cleaning member capable of removing minute foreign matter, in particular foreign matter of a submicron level simply, exactly, and sufficiently without contaminating a cleaning site. Further provided is a carrying member provided with a cleaning function having the cleaning member and a method of cleaning a substrate processing equipment with the use of the cleaning member or the carrying member provided with a cleaning function. The cleaning member of the present invention includes a layer member having a plurality of protrusions of a columnar structure on a surface, in which each of the protrusions of a columnar structure has a carbon-based nanostructure.

公开(公告)号：EP2698406A4

公开(公告)日：2014-08-27

申请号：EP12770622

申请日：2012-02-21

Applicant: NITTO DENKO CORP

Inventor： FURUTA KENJI ,  TERADA YOSHIO ,  TOJO MIDORI ,  NAKAMURA KOICHI

IPC: C09J7/02 ,  C09J133/14 ,  C09J201/00 ,  H01M2/08

CPC classification number: C09J7/0285 ,  C08K3/016 ,  C08K3/10 ,  C09J7/22 ,  C09J7/38 ,  C09J133/08 ,  C09J133/14 ,  C09J2201/622 ,  C09J2203/33 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/006 ,  H01M2/08 ,  H01M10/0525 ,  Y10T428/24959 ,  Y10T428/256 ,  Y10T428/266 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/08 ,  C08F220/58

Abstract: A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a substrate and a flame-retardant thermally-conductive pressure-sensitive adhesive layer provided on at least one surface of the substrate. The substrate includes a polyester film and the thickness of the polyester film is 10 to 40 µm, and the thermal resistance of the flame-retardant thermally-conductive pressure-sensitive adhesive sheet is 10 cm 2 ·K/W or less.

公开(公告)号：EP2206757A4

公开(公告)日：2013-10-16

申请号：EP08846263

申请日：2008-10-09

Applicant: NITTO DENKO CORP

Inventor： TERADA YOSHIO ,  ASAI FUMITERU ,  HASHIMOTO HIROKUNI

IPC: C09J7/02 ,  B32B27/18 ,  B32B27/30 ,  C09J9/02 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/301 ,  H01L21/66 ,  H01L21/67

CPC classification number: G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

Abstract: A pressure-sensitive adhesive sheet for testing of the present invention is a pressure-sensitive adhesive sheet for testing wherein a pressure-sensitive adhesive layer is provided on a base film, the base film and the pressure-sensitive adhesive layer have conductivity, and an electrically conductive path is formed therebetween. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside during the test can be prevented.

公开(公告)号：EP2392628A4

公开(公告)日：2012-08-29

申请号：EP10735700

申请日：2010-01-13

Applicant: NITTO DENKO CORP

Inventor： NAKAYAMA JUNICHI ,  TERADA YOSHIO ,  FURUTA KENJI ,  WANO TAKASHI

IPC: C09J133/00 ,  C08K3/38 ,  C09J7/00 ,  C09J7/02 ,  C09J11/04 ,  C09J133/08

CPC classification number: C09J133/08 ,  C08K7/00 ,  C08K2003/382 ,  C09J9/00 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1942519A4

公开(公告)日：2010-11-10

申请号：EP06811663

申请日：2006-10-12

Applicant: NITTO DENKO CORP

Inventor： UENDA DAISUKE ,  ARIMITSU YUKIO ,  TERADA YOSHIO ,  AMANO YASUHIRO ,  MURATA AKIHISA

IPC: B08B1/00 ,  A47L25/00 ,  H01L21/304

CPC classification number: B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

公开(公告)号：EP2492991A4

公开(公告)日：2014-04-16

申请号：EP10824765

申请日：2010-09-29

Applicant: NITTO DENKO CORP

Inventor： TERADA YOSHIO ,  SHOUJI AKIRA ,  TOMIOKA KOUKI ,  FURUTA KENJI ,  TOJO MIDORI ,  HAYASHI KAZUNORI ,  MORIKI SHOUJIROU

IPC: H01M2/10 ,  B32B7/02 ,  H01M10/04 ,  H01M10/60 ,  H01M10/613 ,  H01M10/617 ,  H01M10/625 ,  H01M10/647 ,  H01M10/651 ,  H01M10/653 ,  H01M10/6555 ,  H01M10/6561 ,  H01M10/6563 ,  H01M10/658

CPC classification number: H01M10/5055 ,  H01M10/0413 ,  H01M10/647 ,  H01M10/653 ,  H01M10/6555 ,  Y02E60/12

Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mk or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.

公开(公告)号：EP2050515A4

公开(公告)日：2012-01-18

申请号：EP07767769

申请日：2007-06-28

Applicant: NITTO DENKO CORP

Inventor： SUGO YUKI ,  TERADA YOSHIO ,  UENDA DAISUKE ,  NAMIKAWA MAKOTO ,  YOSHIDA YOSHINORI ,  MAENO YOUHEI

IPC: B08B1/00 ,  H01L21/304

CPC classification number: H01L21/67046 ,  B08B1/00 ,  B08B7/0028 ,  C23C16/4407

公开(公告)号：EP1514615A4

公开(公告)日：2005-10-19

申请号：EP02743650

申请日：2002-06-19

Applicant: NITTO DENKO CORP

Inventor： NAMIKAWA MAKOTO ,  TERADA YOSHIO ,  NUKAGA JIROU

IPC: B08B1/00 ,  C09J7/02 ,  C09J201/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/6835 ,  B08B1/00 ,  H01L21/67028

Abstract: A cleaning sheet for foreign-substance-disliking substrate processors such as apparatuses for manufacturing and inspecting semiconductors, flat panel displays, and print substrates, a cleaning-functional carrier member, and a cleaning method. The cleaning sheet is provided with a porous layer as the cleaning layer or an adhesive layer on one face of a sheetlike material provided with a porous layer.

公开(公告)号：EP2824156A4

公开(公告)日：2015-08-19

申请号：EP13758702

申请日：2013-01-31

Applicant: NITTO DENKO CORP

Inventor： TOJO MIDORI ,  TERADA YOSHIO ,  FURUTA KENJI

IPC: C09J201/00 ,  C08K3/22 ,  C09J4/00 ,  C09J7/00 ,  C09J11/04 ,  C09J133/06

CPC classification number: C09J133/26 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/014 ,  C09J4/00 ,  C09J7/20 ,  C09J9/00 ,  C09J11/04 ,  C09J133/06 ,  C09J133/066 ,  C09J139/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/003 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/10 ,  C08F220/58 ,  C08F222/1006

Abstract: A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 µm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 µm or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.