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    PASSIVIERENDES GLEITSCHLEIFEN, INSBESONDERE FÜR ALUMINIUM, MAGNESIUM UND ZINK
    53.
    发明授权
    PASSIVIERENDES GLEITSCHLEIFEN, INSBESONDERE FÜR ALUMINIUM, MAGNESIUM UND ZINK 有权
    钝化震荡整理，特别适用于铝，镁和锌

    公开(公告)号：EP2217742B1

    公开(公告)日：2011-05-18

    申请号：EP08853742.8

    申请日：2008-10-16

    申请人： Henkel AG & Co. KGaA

    发明人： MASLOWSKI, Andreas

    IPC分类号： C23C22/73 ,  C23C22/34 ,  C23F3/00 ,  B24B31/14

    CPC分类号： B24B31/14 ,  C23C22/34 ,  C23C22/73 ,  C23F3/03

    摘要： The invention relates to a method for the vibratory grinding and adhesion-promoting passivating of metal components, which at least partially comprise metals and/or alloys selected from aluminum, magnesium and/or zinc, in one operation employing an aqueous composition having a pH value between 0.3 and 3.5, containing complex fluorides of the elements of boron, silicon, titanium, zircon or hafnium individually or mixed together in concentrations of the fluoro anions of between 100 and 4000 ppm in total as a vibratory grinding medium, and to a component produced directly using this method, and to the use thereof for structural adhesion or for applying other corrosion-protecting coatings. The present invention further relates to the use of a concentrate in order to produce the vibratory grinding medium in the method according to the invention.

    METAL SURFACE PROTECTION FILM FORMING AGENT AND APPLICATION THEREOF
    56.
    发明公开
    METAL SURFACE PROTECTION FILM FORMING AGENT AND APPLICATION THEREOF 审中-公开
    METALLOBERFLÄCHENSCHUTZFILMBILDNER和DENEN ANWENDUNG

    公开(公告)号：EP1413650A4

    公开(公告)日：2004-12-08

    申请号：EP02720614

    申请日：2002-04-26

    申请人： AJINOMOTO KK

    发明人： FURUTA KIYONORI ,  KURAUCHI MASAHIKO ,  SATO HIROYUKI

    IPC分类号： C09K13/06 ,  C09G1/02 ,  C09G1/04 ,  C23C22/68 ,  C23F3/00 ,  C23F3/04 ,  C23F11/10 ,  C23F11/14 ,  H01L21/304 ,  H01L21/3205 ,  H01L21/321 ,  C23F11/00

    CPC分类号： C09G1/02 ,  C09G1/04 ,  C23C22/68 ,  C23F3/00 ,  C23F3/04 ,  C23F11/144 ,  H01L21/3212

    摘要： A metal surface protection film forming agent containing a specific Α−amino acid such as leucine and phenyl alanine, and a metal abrasive liquid using this. The agent can be used as an abrasive liquid used in a chemical−mechanical polishing method in semiconductor circuit fabrication, is composed of various safe additives light in environmental load, and can restrict the dishing of metal wiring especially copper metal wiring and corrosion during polishing. Such a specific Α−amino acid used adsorbs to a wiring metal surface, especially a copper metal surface buried in a substrate recess or reacts with the metal to prevent the elution of the metal and forms a protection film on the metal surface. A metal surface protection film forming agent and a method of polishing a substrate surface for producing a semiconductor−use substrate, a method of forming a metal surface protection film, the application of the specific amino acid to a metal surface protection film forming agent, and a semiconductor circuit−use substrate using them, a semiconductor circuit containing it and methods of producing them.

    摘要翻译： 含有特定的α-氨基酸例如亮氨酸和苯基丙氨酸的金属表面保护膜形成剂以及使用其的金属研磨液。 该试剂可以用作在半导体电路制造中的化学机械抛光方法中使用的研磨液，由环境负荷轻的各种安全添加剂组成，并且可以限制抛光期间金属布线特别是铜金属布线的凹陷和腐蚀。 所使用的这种特定的α-氨基酸吸附到布线金属表面，特别是埋入基板凹槽中的铜金属表面，或与金属反应以防止金属洗脱并在金属表面上形成保护膜。 一种金属表面保护膜形成剂和抛光基板表面以制造半导体用基板的方法，一种形成金属表面保护膜的方法，该特定氨基酸在金属表面保护膜形成剂上的应用，以及 使用它们的半导体电路用基板，包含它的半导体电路及其制造方法。

    Aqueous dispersion for chemical mechanical polishing of metal films
    60.
    发明公开
    Aqueous dispersion for chemical mechanical polishing of metal films 审中-公开
    WässrigeDispersion zum chemisch-mechanischen Polieren von Metallfilmen

    公开(公告)号：EP1138734A2

    公开(公告)日：2001-10-04

    申请号：EP01108139.5

    申请日：2001-03-30

    申请人： JSR Corporation

    发明人： Motonari, Masayuki, JSR Corporation ,  Hattori, Masayuki, JSR Corporation ,  Kawahashi, Nobuo, JSR Corporation

    IPC分类号： C09G1/02 ,  C09K3/14 ,  C23F3/00 ,  H01L21/321 ,  H01L21/768

    CPC分类号： C09G1/02 ,  C09K3/1463 ,  C23F3/00 ,  H01L21/3212 ,  Y10T428/325

    摘要： It is an object of the present invention to provides an aqueous CMP dispersion with an adequately high initial removal rate, and which, even after repeated polishing, exhibits at least one, and preferably two or more, of the following functions and effects: (1) reduction of performance of polishing pads is suppressed and an adequate removal rate is maintained, (2) generation of pits on polishing surfaces is inhibited, and (3) uneven sections on polishing surfaces are flattened, and satisfactory finished surfaces can be formed with high precision. The aqueous CMP dispersion comprises an abrasive, an organic compound and water. The organic compound with an effect of suppressing reduction of performance of polishing pads may be biphenol, bipyridyl, vinylpyridine, adenine or the like. The organic compound with an effect of inhibiting generation of pits on polishing surfaces may be biphenol, bipyridyl, vinylpyridine, hypoxanthine or the like. The organic compound with an effect of flattening uneven sections on polishing surfaces may be biphenol, bipyridyl, vinylpyridine, salicylaldoxime or the like. The aqueous CMP dispersion of the present invention that contains specific organic compounds has at least one and especially two functions and effects from among that of suppressing reduction of performance of polishing pads, that of suppressing void wearing of polishing surfaces and that of flattening polishing surfaces, as well as a combination of these three functions and effects, even with repeated polishing. The aqueous CMP dispersion is particularly useful for polishing of copper films, and can form satisfactory finished surfaces with high precision.

    摘要翻译： 水性CMP分散体包含研磨剂，有机化合物和水。 具有抑制抛光垫性能降低的效果的有机化合物可以是联苯酚，联吡啶，乙烯基吡啶，腺嘌呤等。 具有抑制抛光面上产生凹坑效果的有机化合物可以是联苯酚，联吡啶，乙烯基吡啶，次黄嘌呤等。 在抛光表面上具有平坦化不均匀部分的作用的有机化合物可以是联苯酚，联吡啶基，乙烯基吡啶，水杨醛肟等。