公开(公告)号：EP1289354B1

公开(公告)日：2005-11-30

申请号：EP01121061.4

申请日：2001-09-01

Applicant: TRUMPF LASERTECHNIK GmbH

Inventor： Schwandt, Markus ,  Müllerschön, Oliver

IPC: H05K3/00 ,  H05K3/46 ,  B23K26/18

CPC classification number: H05K3/0038 ,  B23K26/0661 ,  B23K26/18 ,  B23K2201/42 ,  H05K3/0035 ,  H05K3/383 ,  H05K2201/0112 ,  H05K2203/121

公开(公告)号：EP1593450A1

公开(公告)日：2005-11-09

申请号：EP05252728.0

申请日：2005-05-03

Applicant: Agere System Inc.

Inventor： Albanese, Patricia Marie ,  Osenbach, John W. ,  Shilling, Thomas H.

IPC: B23K1/00 ,  H05K3/34 ,  H05K3/26

CPC classification number: B23K1/0016 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K3/26 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2201/10727

Abstract: The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components (11) on the board (13) can be enlarged significantly by selectively omitting, or selectively removing, the soldermask (16) underneath the component (11) package. This improves access of the cleaning fluid to the underside of the component (11) during the cleaning operation.

Abstract translation: 说明书描述的表面安装方法，用于高器件密度的电路板的制造。 在板（13）的部件（11）的对峙的空间可以通过显着选择性省略，或选择性地去除被放大，阻焊（16）的部件（11）封装的下面。 这改善了清洁操作期间清洗液的访问组件（11）的下侧。

公开(公告)号：EP1531025A1

公开(公告)日：2005-05-18

申请号：EP02807734.5

申请日：2002-11-18

Applicant: NIPPON METAL INDUSTRY CO.,LTD.

Inventor： Yoshikawa, M., Nippon Metal Industry Co., Ltd. ,  Aoyama, H., Nippon Metal Industry Co., Ltd. ,  Tanaka, H., Nippon Metal Industry Co., Ltd.

IPC: B23K35/26

CPC classification number: C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/36 ,  B23K2201/42

Abstract: An Sn-Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt% zinc at least and further containing 0.0015 to 0.03 wt% magnesium and 0.0010 to 0.006 wt% aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.

Abstract translation: 根据本发明的Sn-Zn无铅焊料合金以这样的方式构造，使得其是至少含有6至10重量％的锌的至少并且还含有0.0015至0.03重量％的镁和0.0010的锡基焊料合金 至0.006重量％的铝。 不仅在制冷下还能在室温以上保存焊锡膏时，焊料颗粒的内部被形成在焊料颗粒表面上的保护性镁/氧化铝膜保护，锌和活化剂之间的反应被抑制 ，使得保存稳定性提高，并且在焊接期间的高温下，焊料合金进入容易破坏所述保护性氧化物膜的状态，从而保持良好的润湿性。

公开(公告)号：EP1480778A1

公开(公告)日：2004-12-01

申请号：EP03709641.9

申请日：2003-02-24

Applicant: Siemens Aktiengesellschaft

Inventor： Dietrich, Stefan ,  Schuchart, Johannes

IPC: B23K26/06 ,  B23K26/38 ,  H05K3/00 ,  B23Q41/02 ,  B23Q41/06 ,  B23Q7/14

CPC classification number: H05K3/0038 ,  B23K26/0604 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/35 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/50 ,  B23Q7/1442 ,  H05K3/0026 ,  H05K2203/108

Abstract: The invention relates to an operating method and to a trolley (20) for a system used for machining objects by using laser beams, particularly for a system used for boring or structuring substrates. The system has a greater number of slow-working laser machining machines (10, 11) than rapid-working laser machining machines (13, 14). A rapid-working laser machining machine (13, 14) utilized afterwards or beforehand can be better used to capacity due to the parallel operation of a number of slow-working laser machining machines (10, 11). The transfer of objects to be machined or already machined objects is preferably effected by means of trolleys (20), which are both compatible with both the loading stations (10a, 11a, 12a, 13a, 14a, 15a) and the unloading stations (10b, 11b, 12b, 13b, 14b, 15b) of the laser machining machines (10, 11, 12, 13, 14, 15). This enables the objects, which are to be machined, to be directly received by a trolley (20) located in a loading station (10a, 11a, 12a, 13a, 14a, 15a) and, after machining, to be placed in a trolley (20) that is introduced into an unloading station (10b, 11b, 12b, 13b, 14b, 15b) of a laser machining machine (10, 11, 12, 13, 14, 15).

Abstract translation: 本发明涉及一种用于通过使用激光束来加工物体的系统的操作方法和手推车，特别是涉及用于钻孔或构造基板的系统。 该系统与快速激光加工机器相比，具有大量的慢速激光加工机。 由于多台慢速加工的激光加工机器的并联运行，以后或以前使用的快速激光加工机能更好地用于容量。 待加工物体或已经加工的物体的传送优选地通过手推车来实现，所述手推车既兼容激光加工机器的装载站和卸载站。 这使得能够将被加工的物体直接由位于加载站中的手推车直接接收，并且在加工之后被放置在被引入到激光加工机的卸载站中的手推车中。

公开(公告)号：EP0938944B1

公开(公告)日：2004-11-24

申请号：EP99102921.6

申请日：1999-02-13

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kawashima, Yasuji ,  Shimizu, Kaoru

IPC: B23K1/018 ,  B23K3/08

CPC classification number: B23K1/018 ,  B23K1/206 ,  B23K3/08 ,  B23K2201/42 ,  C22B25/06 ,  C22B25/08 ,  Y02P10/228

公开(公告)号：EP1439025A1

公开(公告)日：2004-07-21

申请号：EP02770217.4

申请日：2002-09-26

Applicant: NOF CORPORATION

Inventor： SAITO, Shun ,  NAKASATO, Katsumi ,  KATO, Yukihiro ,  NAKATA, Isao

IPC: B23K35/363 ,  H05K3/34

CPC classification number: B23K1/008 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3618 ,  B23K35/362 ,  B23K2201/42 ,  H05K3/3484

Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

Abstract translation: 提供焊剂助焊剂组合物，焊膏和使用其的焊接方法，其表现出优异的润湿性，给予高度可靠的焊点，并且具有优良的储存稳定性。 助熔剂组合物含有至少一种具有至少一个选自由羧酸化合物和乙烯基醚化合物反应获得的化合物（X）的封端羧基的化合物，通过羧酸酐反应获得的化合物（Y） 化合物和羟基乙烯基醚化合物，以及通过酸酐和多元醇反应获得的化合物（Z），然后用二乙烯基醚化合物进行加成聚合，并且助熔剂组合物不固化。

公开(公告)号：EP1439020A2

公开(公告)日：2004-07-21

申请号：EP03029909.3

申请日：2000-02-21

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Nakamura, Hideki ,  Mawatari, Shohei

IPC: B23K3/06

CPC classification number: B23K1/0016 ,  B23K1/008 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/082 ,  B23K3/085 ,  B23K2201/42 ,  H05K3/3468 ,  H05K2203/0776 ,  H05K2203/1121

Abstract: A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10°C/second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength.

Abstract translation: 其中已在熔融焊料浴中被焊接的印刷电路板是在至少10℃/秒的速率之后立即用冷却液冷却。 在焊接期间的高温焊料的热效应被抑制，和焊料的金属基体细化，在强度的增加钎焊连接所得。

公开(公告)号：EP1405687A2

公开(公告)日：2004-04-07

申请号：EP03029562.0

申请日：2001-09-25

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Kawashima, Yasuji ,  Suetsugu, Kenichiro ,  Hibino, Shunji ,  Okuji, Tatsuo ,  Kabashima, Shoshi ,  Maeda, Yukio ,  Nakata, Mikiya , 

IPC: B23K1/08 ,  B23K3/06

CPC classification number: B23K1/0016 ,  B23K1/012 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/082 ,  B23K2201/40 ,  B23K2201/42 ,  H05K3/34 ,  H05K2203/044

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.
In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract translation: 一种通过使用无铅焊接材料作为焊接材料将电子部件安装在基板上的流焊方法，包括以下步骤：在预热器（3）上方安装加热盖（10）并使基板（11）穿过 预热器和加热盖之间的间隙，其中预热器和焊接槽（5）之间的间隙（d1）设定为20至60mm，并且主喷射（7）和次喷嘴（8）之间的间隙 ）设定为60mm以下，由此能够在预热处理或焊料供给工序中提高流动焊接的效率。

公开(公告)号：EP1187698B1

公开(公告)日：2004-03-03

申请号：EP00937922.3

申请日：2000-05-26

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： DUNSKY, Corey, M. ,  LIU, Xinbing ,  CROGLIO, Nicholas, J. ,  LO, Ho, Wai ,  GUNDRUM, Bryan, C. ,  MATSUMOTO, Hisashi

IPC: B23K26/06

CPC classification number: B23K26/382 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L21/486 ,  H01L21/76802 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427

公开(公告)号：EP1378309A2

公开(公告)日：2004-01-07

申请号：EP03014024.8

申请日：1999-02-13

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kawashima, Yasuji ,  Shimizu, Kaoru

IPC: B23K3/06

CPC classification number: B23K1/018 ,  B23K1/206 ,  B23K3/08 ,  B23K2201/42 ,  C22B25/06 ,  C22B25/08 ,  Y02P10/228

Abstract: There are disclosed a soldering apparatus comprising a solder wave shape forming means for melting solder and forming solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method for separating solder and solder oxides.

Abstract translation: 公开了一种焊接装置，其包括用于熔化焊料并形成焊波形状的焊波形状形成装置，以及用于分离焊剂和焊剂氧化物的分离剂对焊剂氧化物进行粉尘的分离剂除尘装置，其中所述分离剂是任何一种 选自由内脏，谷粒或面粉，豆粉，种籽或面粉，大豆饼粉，花生壳粉或其组合组成的组，以及用于分离焊料和焊剂氧化物的试剂和方法 。