摘要:
In einem Verfahren zur Herstellung einer geschlossenen Funktionseinheit einer Vorrichtung, werden mindestens zwei, durch ein oder mehrere Dichtungselemente zu verbindende Komponenten der Funktionseinheit breitgestellt. Eine reaktive, flüssige oder pastöse Zusammensetzung, die durch Vernetzen zu einem Elastomer gehärtet werden kann, wird auf mindestens eine der Komponenten aufgebracht. Die reaktive, flüssige oder pastöse Zusammensetzung wird gehärtet, wobei ein Elastomer erzeugt wird, um ein oder mehrere, mit der/den Komponente(n) selbstklebend verbundene(s) Dichtungselement(e) zu erhalten. Die Komponente(n) wird/werden mit der/den zu verbindenden Komponente(n) in Kontakt gebracht. Alternativ dazu wird die reaktive, flüssige oder pastöse Zusammensetzung vollständig oder zumindest teilweise getrocknet und/oder teilweise gehärtet, um eine oder mehrere, mit der/den Komponente(n) selbstklebend verbundene Vorstufe(n) für (ein) Dichtungselement(e) zu erhalten. Die Komponente(n) wird/werden mit der/den zu verbindenden Komponente(n) in Kontakt gebracht. Die Vorstufe(n) für (ein) Dichtungselement(e) wird/werden auf der/den Komponente(n) gehärtet, wobei ein Elastomer erhalten wird, um ein oder mehrere, mit der/den Komponente(n) selbstklebend verbundene(s) Dichtungselement(e) zu erhalten. Schließlich wird die geschlossene Funktionseinheit erhalten.
摘要:
There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM (400) is arranged between a heat generating component (20) and a heat conducting element (30), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.
摘要:
There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.
摘要:
A cooling system of a wind turbine is provided which includes a generator (10), a housing portion (1), and a hub (2) which is rotatable with respect to the housing portion (1) and drivingly connected to the generator (10). The hub (2) supports at least one blade (4). The housing portion (1) and the hub (2) enclose a cavity for accommodating at least said generator. Heat exchange means (6) are provided on the outer surface of said hub (2) for transferring at least a part of heat produced by said generator (10) in operation to the outside.
摘要:
A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.
摘要:
This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.
摘要:
In this brazing method, which brazes an insulating substrate and a top plate that configure an HV inverter cooler, (1) the insulating substrate is disposed on the top plate with a brazing material layer therebetween, and then, by means of laser irradiation, laser welding is performed at an arbitrary plurality of positions at the joining section between the top plate and the insulating substrate, thus provisionally affixing the insulating substrate to the top plate. (4) Thereafter, by means of heating and melting the brazing material layer, the insulating substrate is brazed onto the top plate with the plurality of laser-welded positions as the brazing start points. (5) After brazing, a power semiconductor is joined onto the insulating substrate corresponding to the center portion of the region surrounded by the plurality of brazing start points.
摘要:
A heat exchanger for an oil cooler comprises at least two heat exchanger members, each enclosing a respective first channel (12), wherein a second channel (7) is formed between the at least two heat exchanger members (10, 10'). At least one of the heat exchanger members presents through hole providing access from outside the heat exchanger to the second channel.
摘要:
A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.
摘要:
A heat exchanger plate for a plate heat exchanger includes a plate substrate formed at least on its upper side with a flow duct configuration having a multiplicity of flow ducts. Some or all of the flow ducts have duct webs, over an entire extent thereof or in sections, forming duct walls delimiting a duct groove of a respective flow duct. A plate heat exchanger and a method for manufacturing a heat exchanger plate for a plate heat exchanger are also provided.