Abstract:
An embodiment of the present invention includes a nonvolatile memory system for storing sector information in storage locations (232) within nonvolatile memory (16) organized into blocks, a plurality of blocks defining a super block and each block having a predetermined plurality of sectors. The nonvolatile memory system includes a controller (14) for shifting sector information to a first (210) and a second block (216) of a particular super block (204) and writing sector information to the first block (210) of the particular super block, wherein shifting to the second block (216) occurs entirely during the writing to the first block thereby decreasing the time required to perform write operations to blocks and increasing overall system performance.
Abstract:
An integrated circuit storing multiple bits per memory cell is described. The amount of charge stored in a memory cell corresponds to the multiple bits. The cells are organised into blocks each with reference and data memory cells. Reference voltage levels (REFA0-REFA15, REFB0-REFB15) are generated so programming circuits can simultaneously set voltages in the data memory cells corresponding to data bits with respect to a first set of reference voltage levels. Reading circuits compare the voltages set in the data memory cells with respect to a second set of reference voltage levels programmed in the reference memory cells to determine the data bits.
Abstract:
A method of forming flexibly partitioned metal line segments (10 and 12) for separate memory banks in a simultaneous operation flash memory device with a flexible bank partition architecture comprises the steps of providing a basic metal layer (2) comprising a plurality of basic metal layer segments (2a, 2b, 2c, ...2j) separated by a plurality of gaps (6a, 6b, 6c, ...6i), each of the gaps having a predefined gap interval length, and providing a metal option layer (8) comprising a plurality of metal option layer segments on the basic metal layer (2), the metal option layer segments overlapping the gaps between the basic metal layer segments but leaving one of the gaps open, to form the metal line segments for the separate memory banks.
Abstract:
A flexible technique for improving yield of manufacturing of high density of memory devices, such as flash EEPROM, involves reconfiguring an integrated memory array having a plurality of sectors (10) selected by an address decoder (11, 13) in response to an N bit field in an address (17). If defective sectors are detected in the array, it is partitioned to disable defective sectors by configuring a sector decoder (12) to prevent access to the defective sectors while maintaining sequential addressing remaining in the array. The step of partitioning includes configuring the sector decoder (12) to replace a defective sector in one half of the array by another sector in the other half of the array having N-m of the address bits in common with the defective sector when m is between 1 and N-1.
Abstract:
A nonvolatile memory (31) includes a global line (65) and a first block (61) and a second block (62). The first block includes a plurality of first local lines (71) and a first decoder (78) coupled to the global line and the first local lines for selectively coupling the global line to one of the first local lines in accordance with an address when the first decoder is enabled and for isolating the first local lines from the global line when the first local decoder is disabled. The second block includes a plurality of second local lines (81) and a second decoder (88) coupled to the global line and the second local lines for selectively coupling the global line to one of the second local lines in accordance with an address when the second decoder is enabled and for isolating the second local lines from the global line when the second local decoder is disabled such that the interference between the first and second blocks is eliminated during memory operation.
Abstract:
A central row-related control circuit (1) transmits an internal row address signal (RA )to each memory sub block in banks of memory mats (MM1, MM2) asynchronously with an external clock signal, and latches a block selection signal (BS )for specifying a memory sub block synchronously with an internal dock signal (CLKR) for one dock cycle period for transmission to each memory sub block (MSB). A spare determination circuit (4) performs spare determination asynchronously with the dock signal. A semiconductor memory device easily adaptable to bank expansion without increase of the chip area and capable of implementing a high speed access can be provided.
Abstract:
The invention relates to a memory system, comprising data lines (15, 25, 35) for transmitting data between memory modules (30) and at least one control unit (5, 10, 20). According to the invention, the memory system is configured in such a way that it has at least one central control unit (5) and at least one group control unit (10), said group control unit (10) having at least one first data line (15) for connecting the group control unit (10) to the central control unit (5) and second data lines (25) for connecting a group of memory modules (30) to the group control unit (10).
Abstract:
Processing equipment with embedded MRAMs, and a method of fabricating, including a data processing device (10) fabricated on a semiconductor chip with MRAM cells fabricated on the chip to form one to all of the memories on the chip. Also included is a dual bank memory (31,32) in communication with the data processing (10) device and circuitry coupled to the data processing device and the dual bank memory for providing simultaneous read access to the dual bank memory.