公开(公告)号：EP0221179A4

公开(公告)日：1987-10-05

申请号：EP86903989

申请日：1986-06-06

申请人： DIVINCENZO MAUREEN

发明人： DIVINCENZO MAUREEN

IPC分类号： B44C1/28 ,  C23F1/04 ,  C25D5/02 ,  D05C1/08 ,  G03F7/00

CPC分类号： C23F1/04 ,  D05C1/08 ,  G03F7/00 ,  Y10T428/12361 ,  Y10T428/24273 ,  Y10T428/24298

公开(公告)号：EP0091376B1

公开(公告)日：1987-01-21

申请号：EP83400687.6

申请日：1983-04-01

申请人： FAIRCHILD CAMERA & INSTRUMENT CORPORATION

发明人： Phy, William S.

IPC分类号： H01L23/48

CPC分类号： H01L24/86 ,  H01L23/49541 ,  H01L23/49572 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0271 ,  Y10T428/12229 ,  Y10T428/12361

公开(公告)号：EP0195836A1

公开(公告)日：1986-10-01

申请号：EP85103634.3

申请日：1985-03-27

申请人： Burlington Industries, Inc.

发明人： Gamblin, Rodger Lotis

IPC分类号： C23F1/04 ,  B41J3/04

CPC分类号： B41J2/1643 ,  B41J2/162 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1632 ,  C23F1/04 ,  C25D3/562 ,  Y10T428/12361

摘要： Improved orifice plates (54) such as, fluid jet orifice plates, photoetching masks or the like, include a substrate of highly corrosion resistant metal (56) and a layer of an amorphous metal alloy such as, an amorphous nickel-phosphorus alloy or an amorphous cobalt phosphorus alloy, the alloy layer and substrate together defining a predetermined array of openings (64) therein.

公开(公告)号：EP0074168B1

公开(公告)日：1986-01-08

申请号：EP82303929.2

申请日：1982-07-23

申请人： FUJITSU LIMITED

发明人： Shimizu, Shokichi ,  Aoki, Hideji ,  Kida, Susumu ,  Kanazawa, Yuki

IPC分类号： H01L21/92 ,  H01R9/16

CPC分类号： H01L23/057 ,  H01L21/50 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16152 ,  Y10T29/49121 ,  Y10T428/12361 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  H01L2924/00 ,  H01L2224/05599

摘要： For use in producing a package enclosing an electronic device, a lead frame (1) is first treated by electroplating, separately from any outer housing structure component of the package, so as to provide a working contact layer on outerlead parts (3) of the frame. The electronic device is then fixed in its desired position relative to the lead frame, and electrical connections are provided between the device and innerlead parts (2) of the frame, whereafter a housing structure is sealed around the device so that it is enclosed within that structure, but so that outerlead parts covered by the said working contact layer are left projecting from that structure. The electroplating of the lead frame whilst still separate from the housing structure can serve to avoid such problems as contamination of the electroplating bath by the housing structure.

摘要翻译： 为了用于生产封装电子设备的封装件，引线框架（1）首先通过电镀与封装的任何外壳结构部件分开地进行处理，以在工作接触层（3）上提供工作接触层 帧。 然后将电子设备相对于引线框架固定在其期望的位置，并且在框架的设备和内衬部分（2）之间提供电连接，之后将壳体结构密封在设备周围，使得其被包围在该框架内 结构，但是使得由所述工作接触层覆盖的外层部分从该结构留下。 引线框架的电镀仍然与壳体结构分离，可以避免诸如电镀槽被壳体结构污染的问题。

公开(公告)号：EP0069241B1

公开(公告)日：1985-09-11

申请号：EP82105106.7

申请日：1982-06-11

申请人： Kühni AG

发明人： Bühlmann, Ulrich, Dipl.-Masch.-Ing.

IPC分类号： B01D53/18

CPC分类号： B01J19/32 ,  B01J2219/32227 ,  B01J2219/32268 ,  B01J2219/32289 ,  B01J2219/32408 ,  B01J2219/32483 ,  Y10S261/72 ,  Y10T428/12361

公开(公告)号：EP0049022B1

公开(公告)日：1985-08-28

申请号：EP81201075.9

申请日：1981-09-28

申请人： VECO BEHEER B.V.

发明人： de Hek, Johan Adriaan ,  Mohan, Anand, Dr.

IPC分类号： C25D1/08

CPC分类号： C25D1/08 ,  B41N1/247 ,  Y10S428/935 ,  Y10T428/12361 ,  Y10T428/12479

公开(公告)号：EP0150900A1

公开(公告)日：1985-08-07

申请号：EP85300044.6

申请日：1985-01-04

申请人： Nutter, Dale Edward

发明人： Nutter, Dale Edward

IPC分类号： B01D3/22

CPC分类号： B01J19/32 ,  B01J2219/32213 ,  B01J2219/32227 ,  B01J2219/32237 ,  B01J2219/32286 ,  B01J2219/32289 ,  B01J2219/32408 ,  Y10T29/496 ,  Y10T428/12361

摘要： Improved gas-liquid contact apparatus for fractionating towers or other vessels which have beds of packing formed of stacked grids. The packing has a low pressure drop, good efficiency and minimal entrainment at high gas flow rates.

摘要翻译： 改进的气液接触装置用于分离塔或其他容器，其具有由堆叠网格形成的填料床。 填料具有低压降，高效率和在高气体流速下的最小夹带。

公开(公告)号：EP0053134B1

公开(公告)日：1985-05-02

申请号：EP81901476.2

申请日：1981-05-21

申请人： GTE PRODUCTS CORPORATION

发明人： FREEMAN, Roger K. ,  GOEBEL, Franz

IPC分类号： H01M4/02

CPC分类号： H01M4/13 ,  H01M2/26 ,  H01M4/38 ,  H01M4/381 ,  H01M6/14 ,  H01M6/46 ,  H01M2004/027 ,  Y10T428/12361

摘要： An anode structure (15) for a cylindrical primary electrochemical cell. The anode structure in accordance with the invention includes a thin, circular, lithium metal disc (15a) having a central opening (15f) therein, and a small, thin, resilient, metal (e.g., nickel) contact member (15b) secured to the lithium disc (15a). The metal contact member (15b) is of a generally circular configuration and has a flat central portion with a circular opening (15e) therein aligned with the opening in the lithium disc (15a). The contact member has a plurality of tab portions (15d) extending outwardly from, and spaced at regular intervals about, its outer periphery, and a pair of spikes or barbs (15c) depending from opposed ends of each tab portion. The spikes are pressed into the soft lithium disc (15a) at points spaced from the opening therein for permanently securing the contact member to the disc. The contact member further has a plurality of notches spaced at regular intervals about the perimeter of the central opening thereby to define a plurality of resilient, deflective portions intermediate to the notches. The deflective portions lie in a flat, common plane with each of the deflective portions having an exposed edge facing a central axis of the contact member.

公开(公告)号：EP0045627B1

公开(公告)日：1985-02-27

申请号：EP81303486.5

申请日：1981-07-30

申请人： RAYCHEM CORPORATION (a California corporation)

发明人： Broyles, Harry Clifton

IPC分类号： F16L13/00 ,  F16B4/00 ,  B23P11/02

CPC分类号： B23P11/025 ,  A61F2/91 ,  A61F2/915 ,  A61F2002/91558 ,  A61F2210/0014 ,  C22F1/006 ,  F16B1/0014 ,  F16L13/00 ,  Y10S428/913 ,  Y10T428/12361 ,  Y10T428/12368

公开(公告)号：EP0091376A1

公开(公告)日：1983-10-12

申请号：EP83400687.6

申请日：1983-04-01

申请人： FAIRCHILD CAMERA & INSTRUMENT CORPORATION

发明人： Phy, William S.

IPC分类号： H01L23/48

CPC分类号： H01L24/86 ,  H01L23/49541 ,  H01L23/49572 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0271 ,  Y10T428/12229 ,  Y10T428/12361

摘要： A lead frame (20) for tape automated bonding includes individual leads (12) each having a stretch loop (40) to accommodate elongation of the loop as the lead is bonded to a substrate (28) after inner lead bonds have been formed to an integrated circuit (26). Such a lead frame allows temporary connection and testing of the circuit prior to final lead formation and packaging.