公开(公告)号：EP2103714B1

公开(公告)日：2014-10-29

申请号：EP07850558.3

申请日：2007-12-13

申请人： Mitsubishi Materials Corporation

发明人： ORITO, Kenji ,  HAYASHI, Toshiharu ,  WADA, Masahiro ,  IZUMI, Reiko ,  HOSHINO, Koji

IPC分类号： C23C24/08 ,  H01M4/86 ,  H01M8/02 ,  C23C10/18 ,  C23C28/00 ,  C23C10/60 ,  H01M4/88 ,  C23C28/04 ,  H01M8/10

CPC分类号： H01M4/8807 ,  C23C24/087 ,  C23C28/042 ,  C23C28/048 ,  H01M4/8817 ,  H01M4/90 ,  H01M8/0232 ,  H01M8/0241 ,  H01M8/0245 ,  H01M2008/1095 ,  Y10S977/762 ,  Y10S977/81 ,  Y10S977/811 ,  Y10T428/12479 ,  Y10T428/12806 ,  Y10T428/12889

公开(公告)号：EP2405723B1

公开(公告)日：2013-06-05

申请号：EP11007897.9

申请日：2005-12-05

申请人： NGK Spark Plug Co., Ltd.

发明人： Wakako, Hisashi ,  Nagai, Makoto ,  Uchida, Atsushi ,  Morita, Masahito ,  Kimura, Kazuo

IPC分类号： H05K1/02 ,  H05K3/24 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1301 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/183 ,  H05K3/246 ,  H05K3/403 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/12361 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12639 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/26 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2120520B1

公开(公告)日：2012-03-07

申请号：EP09000433.4

申请日：2009-01-14

申请人： LG Electronics Inc.

发明人： Yum, Jungsup ,  Ko, Dongki

IPC分类号： H05K3/18 ,  H05K3/42 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K3/181 ,  H05K1/0393 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12847 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

公开(公告)号：EP2309830A1

公开(公告)日：2011-04-13

申请号：EP10174785.5

申请日：2010-09-01

申请人： TDK Corporation

发明人： Atsushi, Sato ,  Hisayuki, Abe ,  Takashi, Ota ,  Miyuki, Yanagida ,  Masumi, Kameda

IPC分类号： H05K3/00 ,  H01L21/44

CPC分类号： H05K3/244 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/1476 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12458 ,  Y10T428/12889

摘要： The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3 × σ × 100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.

摘要翻译： 本发明提供一种镀镍膜，其包含含有磷的镀镍层和形成在镀镍层上的镀金层，其中，所述镀镍层的磷含量为11〜16质量％，其中，（3×× 100）/ X为10以下，其中X和Ã分别为镀金层侧的镀镍层的表面中的磷含量的平均值和标准偏差; 以及具有镀膜50的模块基板100。

公开(公告)号：EP1557895A4

公开(公告)日：2010-05-19

申请号：EP03792704

申请日：2003-08-19

申请人： DAIDO STEEL CO LTD

发明人： TAKAGI SHINOBU ,  SHINKAWA MASAKI ,  URA MIKIO ,  YAGI SHINICHI ,  KANETA YASUSHI ,  HISADA TATSUO

IPC分类号： H01M8/02 ,  H01M8/10

CPC分类号： H01M8/0228 ,  H01M8/0206 ,  H01M8/021 ,  H01M8/0254 ,  H01M2008/1095 ,  Y02P70/56 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12993

摘要： An Au plating film (12) is formed on the surface of a plate-shaped metal base (13) made of a metal more base than Au, and the metal base is cut along a line of cutting plane (18) reflecting the visible outlines of a member to form a separator (10). The thus formed separator (10) has an Au plating film (12) on a major surface (10a) and a cut face (16), which is an edge face (16) continuous with the major surface (10a). A part of the metal base (13) is exposed from a part of the cut face (16). The width of the exposed part is 1 mm of less. In such a way, a metal member for fuel cells having a sufficient corrosion resistance and producible readily at low cost, its manufacturing method, and a fuel cell having such a metal member for fuel cells are provided.

公开(公告)号：EP1007252A4

公开(公告)日：2009-05-27

申请号：EP98938350

申请日：1998-08-04

申请人： UNIV KANSAS STATE

发明人： KLABUNDE KENNETH J ,  ZHANG DAJIE ,  SORENSEN CHRISTOPHER

IPC分类号： B22F1/02 ,  B22F9/12 ,  C08K9/02 ,  G11B5/712 ,  G11B5/855 ,  H01F1/00 ,  B32B15/02 ,  B32B15/04 ,  B32B15/18

CPC分类号： B82Y25/00 ,  B22F1/02 ,  B22F1/025 ,  B22F9/12 ,  B22F2998/00 ,  C08K9/02 ,  G11B5/712 ,  G11B5/855 ,  H01F1/0063 ,  Y10T428/12028 ,  Y10T428/12097 ,  Y10T428/12181 ,  Y10T428/12465 ,  Y10T428/12493 ,  Y10T428/12667 ,  Y10T428/12736 ,  Y10T428/12771 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12986 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/26 ,  Y10T428/2991 ,  B22F1/0018

摘要： Composite nanorparticles comprising an elemental metal core surrounded by a metal-containing shell material are described wherein the particles have an average diameter of from about 5-500 nm; the core metal is preferably selected from the group consisting of the transition metals and especially Fe, Co and Ni, whereas the shell material is advantageously a metal such as an alkaline earth metal, or a metal salt such as a metal oxide or metal halide. The shell material is preferably more oxophilic than the elemental core material, enabling the core metal to remain purely metallic. These core/shell composite particles can be used to fabricate magnetizable recording media such as tapes and disks.

公开(公告)号：EP2028289A1

公开(公告)日：2009-02-25

申请号：EP08012859.8

申请日：2008-07-16

申请人： Chubu Electric Power Co., Inc. ,  TANAKA KIKINZOKU KOGYO KABUSHIKI KAISHA

发明人： Kashima, Naoji ,  Nagaya, Shigeo ,  Shima, Kunihiro ,  Kubota, Shuichi

IPC分类号： C23C26/00 ,  C25D5/10 ,  B32B15/01 ,  C21D8/12 ,  H01L39/24

CPC分类号： H01L39/2461 ,  B32B15/01 ,  C21D2201/05 ,  C21D2251/02 ,  C21D2251/04 ,  C23C30/00 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  C30B25/18 ,  Y10S977/81 ,  Y10S977/832 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12736 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12958 ,  Y10T428/12986 ,  Y10T428/12993 ,  Y10T428/26 ,  Y10T428/265

摘要： Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (Δφ and Δω) in the textured metal layer surface and orientation degrees (Δφ and Δω) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved. At this time, the surface roughness of the substrate surface becomes 20 nm or less.

公开(公告)号：EP1331282B1

公开(公告)日：2008-11-19

申请号：EP03250281.7

申请日：2003-01-16

申请人： Seiko Epson Corporation

发明人： Kawakami, Atsushi, c/o Seiko Epson Corporation ,  Obi, Yoshiyuki, c/o Seiko Epson Corporation ,  Tsukamoto, Yuzuru, c/o Seiko Epson Corporation

IPC分类号： C23C14/20 ,  C23C14/02 ,  C23C14/34 ,  C23C30/00 ,  C23C14/16

CPC分类号： C23C14/0015 ,  C23C14/16 ,  Y10T428/12576 ,  Y10T428/12889

公开(公告)号：EP1496094B1

公开(公告)日：2008-08-13

申请号：EP04077745.0

申请日：1998-10-29

申请人： Hitachi Chemical Company, Ltd.

发明人： Takeuchi, Kazumasa ,  Saito, Tetsuya ,  Nanaumi, Ken

IPC分类号： C09J179/08 ,  C09J163/08 ,  H01L23/498 ,  H01L21/48 ,  H01L23/48 ,  C09J7/02

CPC分类号： B32B15/08 ,  B32B3/266 ,  B32B7/12 ,  B32B15/20 ,  B32B2311/12 ,  B32B2323/10 ,  B32B2327/18 ,  B32B2367/00 ,  B32B2379/08 ,  B32B2457/00 ,  C08G18/3243 ,  C08G18/345 ,  C08G18/61 ,  C08G77/388 ,  C08G77/452 ,  C08L63/00 ,  C08L79/08 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/20 ,  C09D183/10 ,  C09J7/22 ,  C09J7/35 ,  C09J179/08 ,  C09J183/10 ,  C09J2479/08 ,  C09J2479/086 ,  H01L23/293 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K2201/0154 ,  Y10T156/1052 ,  Y10T428/12361 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12569 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/31663 ,  Y10T428/31667 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An adhesive sheet comprises a polyimide base layer and an adhesive layer (a) disposed on at least one side of the polyimide base layer, the adhesive layer (a) being a layer of a B-stage cured product of a siloxane-modified polyamideimide resin composition comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient. A chip-size package board is produced by making a through-hole in the adhesive sheet, laminating a copper foil on the adhesive layer (a), forming a circuit by removing unnecessary parts of the copper foil by etching, and then gold plating a surface of the circuit. A semiconductor device is prepared by bonding a semiconductor chip to the surface of the chip-size package board bearing the circuit, connecting the circuit of the chip-size package board to bonding pads of the semiconductor chip, and sealing the circuit of the chip-size package board, the bonding wires and the semiconductor chip with a molded resin.

公开(公告)号：EP1931812A1

公开(公告)日：2008-06-18

申请号：EP06803322.4

申请日：2006-09-12

申请人： Board of Regents of the Nevada System of Higher Education, on behalf of The University of Nevada, Reno

发明人： COWAN, Thomas E. ,  MALEKOS, Steven ,  KORGAN, Grant ,  ADAMS, Jesse ,  SENTOKU, Yasuhiko ,  LE GALLOUDEC, Nathalie ,  FUCHS, Julien

IPC分类号： C23C14/34

CPC分类号： H05H1/24 ,  G21B1/19 ,  H01J35/08 ,  H05G2/00 ,  H05G2/001 ,  H05G2/008 ,  H05H1/02 ,  Y02E30/16 ,  Y10T428/12 ,  Y10T428/12299 ,  Y10T428/1241 ,  Y10T428/12493 ,  Y10T428/12806 ,  Y10T428/12868 ,  Y10T428/12889 ,  Y10T428/13

摘要： In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 μm. In particular examples, the distance is less than about 1 μm. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.