An electroplating machine
    61.
    发明公开
    An electroplating machine 失效
    Vorrichtung zur Elektroplattierung

    公开(公告)号:EP1541719A2

    公开(公告)日:2005-06-15

    申请号:EP05075545.3

    申请日:1998-05-20

    摘要: An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.

    摘要翻译: 公开了一种电镀机,其包括电极定位装置,电解质输送装置,用于覆盖辊的装置,用于将氧化铜粉末溶解在通过该装置的电解质中的装置,以及允许两者之间的距离变化的装置 辊。 电极定位装置具有通过两组连接构件连接的第一开口端和第二端,其中每组中的连接构件彼此平行并与相邻构件间隔开。 电解质输送装置包括连接到电解质源和喷嘴的管道,电解质可通过该喷嘴输送到安装在电极定位装置上的电极。 喷嘴包括细长的间隙,并且电解质沿着细长间隙的整个长度连续地离开喷嘴。 电极定位和电解质输送装置可滑动地彼此接合。 覆盖装置的形状是细长的并且包括用于容纳辊的外表面的大部分的空腔。 用于将氧化铜粉末溶解在电解质中的装置包括上室和下室,其中铜离子浓度低的电解质通过其下部进入上室,并通过其上部离开上室。 在上部室中的多孔罐中形成涡流,以便于将氧化铜粉末溶解在电解质中。 对于允许上辊和下辊之间的距离变化的装置,包括可附接到电镀机的壁的主要部件和可相对于主要部件移动的第二部件。 响应于PCB进入两个辊之间的区域,上辊被垂直向上移动,这也使得二次部件垂直向上移动。

    Electroplating method and electroplating apparatus
    62.
    发明公开
    Electroplating method and electroplating apparatus 审中-公开
    电镀方法和电镀装置

    公开(公告)号:EP1496142A2

    公开(公告)日:2005-01-12

    申请号:EP03257520.1

    申请日:2003-11-28

    发明人: Kaneko, Satochi

    IPC分类号: C25D17/28 C25D17/06 B65G49/04

    CPC分类号: C25D17/28 C25D17/06

    摘要: The present invention provides a plating method and a plating apparatus capable of plating small parts effectively without any deformation. A object product to be plated is put in each accommodating concave portion in a carrier tape including a number of the accommodating concave portions spaced at a specific interval and this carrier tape is passed through a plating apparatus so as to form metallic plating layer on the surface of the object product to be plated.

    摘要翻译: 本发明提供了一种能够有效地电镀小部件而不会变形的电镀方法和电镀装置。 将要电镀的目标产品放入载带中的每个容纳凹部中,所述载带包括以特定间隔隔开的多个容纳凹部,并且该载带穿过电镀装置以在表面上形成金属镀层 的待镀物体产品。

    METAL HYDRIDE COMPOSITE MATERIALS
    63.
    发明公开
    METAL HYDRIDE COMPOSITE MATERIALS 审中-公开
    金属氢化物复合材料

    公开(公告)号:EP1487599A1

    公开(公告)日:2004-12-22

    申请号:EP03739781.7

    申请日:2003-02-12

    摘要: A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.

    摘要翻译: 一种生产金属氢化铈铈金属复合粉末的方法,包括向旋转流通电沉积装置提供一种粉末,该粉末的颗粒包含一种或多种选自镧系钛合金金属和镧系金属镍合金金属的镧系元素合金金属; 并通过该装置在粉末上电沉积一种或多种非镧系元素金属。 还有物质和金属氢化物混合稀土金属粉末的所得组合物。

    METHOD AND APPARATUS FOR THE SURFACE TREATMENT OF PARTS
    65.
    发明公开
    METHOD AND APPARATUS FOR THE SURFACE TREATMENT OF PARTS 失效
    方法和设备零件的表面处理

    公开(公告)号:EP0723604A4

    公开(公告)日:1997-02-26

    申请号:EP94930087

    申请日:1994-10-11

    申请人: TUMBLEVEYOR INC

    发明人: ZECHER ROBERT F

    CPC分类号: C25D17/16 B05C3/08

    摘要: Conveyors (17) are provided for tumbling and transferring parts to be subjected to treatments, including electroplating in a series of treatment tanks (10, 11, 12). The conveyors are supported on the treatment tanks for pivotal movement between a position in which the parts are received from a parts feeder to a treatment position in which the parts are subjected to tumbling and immersion within a treatment solution and drying and next to a discharge position where they are discharged either to another conveyor in a next treatment tank or a subsequent station for further processing. Movement of the conveyors to the several positions is carried out by tilt devices which vary the slope of the upper run of each conveyor. A plating tank (11) includes anode baskets (40) disposed adjacent the load-receiving end of the upper run of the conveyor (25) and cathode danglers (43) for contacting the parts on the upper run to establish a current path comprising danglers, the parts, the electrolytic solution and the anodes (40). Circulation of electrolyte is provided establishing a circulation path past the anodes through an inlet opening in the parts receiving hopper (28) portions of the conveyor.

    Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
    69.
    发明公开
    Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten 失效
    对板状工件,特别是印刷电路板的电镀装置。

    公开(公告)号:EP0365767A1

    公开(公告)日:1990-05-02

    申请号:EP89114379.4

    申请日:1989-08-03

    发明人: Hosten, Daniel

    IPC分类号: C25D17/00 C25D17/28

    摘要: Bei einer Galvanisiereinrichtung für im horizontalen Durchlauf zu behandelnde plattenförmige Werkstücke, insbesondere Leiterplatten (Lp) wird mindestens ein Seitenrand der Werkstücke durch Transport- und Kontaktierorgane (TKO) erfaßt, die an einem endlos umlaufenden flexiblen Metallband (Mb) befestigt sind. Die den Werkstücken zugewandte Seitenfläche des Metallbandes (Mb) gleitet ober- und unterhalb der Transport- und Kontaktierorgane (TKO) auf sich in Durchlaufrichtung (Pf1) erstreckenden Führungs- und Abdichtelementen (FAE). Metallband (Mb) und Transport- und Kontaktierorgane (TKO) haben also gleichzeitig den Aufgaben des Transports der Werkstücke, der kathodischen Kontaktierung der Werkstücke und der Abdichtung der Galvanisierzelle (Gz) gegen den Austritt von Elektrolytlösung. Durch diese dreifache Funktion ergibt sich ein besonders geringer baulicher Aufwand.

    摘要翻译: 在用于水平流动的电镀装置的待处理的板状工件,特别是印刷电路板(LP)被检测出的工件中的至少一个侧边缘通过运输和接触装置(TKO)安装在无端循环柔性金属带(MB)的附接。 面对所述金属带材(MB)的工件侧面侧滑动,并用与通道方向(PF1)延伸的导向元件和密封元件(FAE)上本身的运输和接触装置(TKO)所示。 金属带(MB)和运输和接触装置(TKO)因此同时工件,工件的阴极接触和电镀槽(GZ)针对的电解质溶液泄漏的密封的传输等任务。 通过以特别低的结构费用此三重功能的结果。

    Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
    70.
    发明公开
    Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten 失效
    对板状工件,特别是印刷电路板的电镀装置。

    公开(公告)号:EP0361029A1

    公开(公告)日:1990-04-04

    申请号:EP89114378.6

    申请日:1989-08-03

    发明人: Hosten, Daniel

    IPC分类号: C25D17/00 C25D17/28

    CPC分类号: H05K3/241 C25D17/28

    摘要: Bei einer Galvanisiereinrichtung für im horizontalen Durchlauf zum Auftrag eines Metalles durch eine Elektrolytlösung geführte plattenförmige Werkstücke, insbesondere Leiterplatten, umfaßt die Transporteinrichtung (Te) einen seitlich angeordneten oberen Bandtrieb (Bto) und einen seitlich angeordneten unteren Bandtrieb (Btu), wobei die Werkstücke zwischen dem unteren Trum des oberen Bandtriebes (Bto) und dem oberen Trum des unteren Bandtriebes (Btu) reibschlüssig mitgenommen werden. Zusätzlich ist jeweils zwischen oberem Trum und unterem Trum der Bandtriebe (Bto,Btu) eine Dichtwand (Dw) angeordnet, wodurch die Kontaktiervorrichtung zur kathodischen Kontaktierung des über die Bandtriebe (Bto,Btu) überstehenden Seitenrandes der Werkstücke vor dem Zutritt von Elektrolytlösung abgeschirmt wird.

    摘要翻译: 在用于通过电解溶液引导板状工件涂覆金属,特别是印刷电路板,其包括传送装置的水平流(Te)的一个横向设置上带驱动器(BTO)和横向布置的下部皮带驱动(BTU)的电镀装置,其特征在于所述的工件 上部带驱动器(BTO)和下部皮带驱动(BTU)的上运行的下链通过摩擦夹带。 由此对于的在带驱动器(BTO,Btu)表示的突出工件的侧边缘上的阴极接触的接触器被屏蔽免受电解液除了在上部运行和密封壁(DW)被布置在带驱动器(BTO,英国热量单位)的下部运行之间分别进入。