摘要:
An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
摘要:
The present invention provides a plating method and a plating apparatus capable of plating small parts effectively without any deformation. A object product to be plated is put in each accommodating concave portion in a carrier tape including a number of the accommodating concave portions spaced at a specific interval and this carrier tape is passed through a plating apparatus so as to form metallic plating layer on the surface of the object product to be plated.
摘要:
A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.
摘要:
Conveyors (17) are provided for tumbling and transferring parts to be subjected to treatments, including electroplating in a series of treatment tanks (10, 11, 12). The conveyors are supported on the treatment tanks for pivotal movement between a position in which the parts are received from a parts feeder to a treatment position in which the parts are subjected to tumbling and immersion within a treatment solution and drying and next to a discharge position where they are discharged either to another conveyor in a next treatment tank or a subsequent station for further processing. Movement of the conveyors to the several positions is carried out by tilt devices which vary the slope of the upper run of each conveyor. A plating tank (11) includes anode baskets (40) disposed adjacent the load-receiving end of the upper run of the conveyor (25) and cathode danglers (43) for contacting the parts on the upper run to establish a current path comprising danglers, the parts, the electrolytic solution and the anodes (40). Circulation of electrolyte is provided establishing a circulation path past the anodes through an inlet opening in the parts receiving hopper (28) portions of the conveyor.
摘要:
The conveying channel of the vibrator conveyor is arranged in a spiral around a central pipe and surrounded by a gastight container. This container contains a treatment medium, preferably an oxygen-free anhydrous electrolyte, into which part of the vibrator conveyor with the central pipe dips. According to the invention, a gas cushion (10) is arranged between the base (3) or the lid (4) of the central pipe (2) and the base (8) of the container (6). In this embodiment, bulk materials can be transported over great differences in height.
摘要:
Bei einer Galvanisiereinrichtung für im horizontalen Durchlauf zu behandelnde plattenförmige Werkstücke, insbesondere Leiterplatten (Lp) wird mindestens ein Seitenrand der Werkstücke durch Transport- und Kontaktierorgane (TKO) erfaßt, die an einem endlos umlaufenden flexiblen Metallband (Mb) befestigt sind. Die den Werkstücken zugewandte Seitenfläche des Metallbandes (Mb) gleitet ober- und unterhalb der Transport- und Kontaktierorgane (TKO) auf sich in Durchlaufrichtung (Pf1) erstreckenden Führungs- und Abdichtelementen (FAE). Metallband (Mb) und Transport- und Kontaktierorgane (TKO) haben also gleichzeitig den Aufgaben des Transports der Werkstücke, der kathodischen Kontaktierung der Werkstücke und der Abdichtung der Galvanisierzelle (Gz) gegen den Austritt von Elektrolytlösung. Durch diese dreifache Funktion ergibt sich ein besonders geringer baulicher Aufwand.
摘要:
Bei einer Galvanisiereinrichtung für im horizontalen Durchlauf zum Auftrag eines Metalles durch eine Elektrolytlösung geführte plattenförmige Werkstücke, insbesondere Leiterplatten, umfaßt die Transporteinrichtung (Te) einen seitlich angeordneten oberen Bandtrieb (Bto) und einen seitlich angeordneten unteren Bandtrieb (Btu), wobei die Werkstücke zwischen dem unteren Trum des oberen Bandtriebes (Bto) und dem oberen Trum des unteren Bandtriebes (Btu) reibschlüssig mitgenommen werden. Zusätzlich ist jeweils zwischen oberem Trum und unterem Trum der Bandtriebe (Bto,Btu) eine Dichtwand (Dw) angeordnet, wodurch die Kontaktiervorrichtung zur kathodischen Kontaktierung des über die Bandtriebe (Bto,Btu) überstehenden Seitenrandes der Werkstücke vor dem Zutritt von Elektrolytlösung abgeschirmt wird.