METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

    公开(公告)号:EP4462467A1

    公开(公告)日:2024-11-13

    申请号:EP24169742.4

    申请日:2024-04-11

    摘要: A plurality of semiconductor dice is arranged onto a first surface of a common electrically conductive substrate (12). The common electrically conductive substrate (12) has a second surface opposite the first surface and comprises a plurality of substrate portions (12A, 12B) and elongated sacrificial connecting bars (CB) extending between adjacent substrate portions (12B). Insulating material (100) is coated on the second surface of the elongate sacrificial connecting bars (CB). Solder material (18) is grown on the second surface of the common electrically conductive substrate (12). The insulating material (100) counters growth of the solder material on the second surface of the elongate sacrificial connecting bars (CB). Singulated individual semiconductor devices are provided by cutting the common electrically conductive substrate (12) having the plurality of semiconductor dice arranged onto the first surface thereof along the length of the elongate sacrificial connecting bars (CB) having the insulating material (100) coated on its second surface.

    CONTROLE DE LA LUMINOSITE D'UN ECRAN
    73.
    发明公开

    公开(公告)号:EP4462416A1

    公开(公告)日:2024-11-13

    申请号:EP24173017.5

    申请日:2024-04-29

    IPC分类号: G09G3/34 G09G3/36

    摘要: La présente description concerne un système comprenant :
    - un microcontrôleur (106) comprenant un réseau de neurones (120) ;
    - un capteur à temps de vol (104) configuré pour effectuer une capture d'une scène comprenant un utilisateur, et comprenant une pluralité de pixels, la capture comprenant, pour chaque pixel, la mesure d'une distance à l'utilisateur et d'une valeur de signal, le capteur étant en outre configuré pour calculer une valeur d'écart type associé à la valeur de distance et une valeur d'écart-type associé à la valeur de signal et une valeur de confiance, le capteur étant en outre configuré pour fournir les valeurs au réseau,
    le réseau étant configuré pour générer, sur la base des valeurs, une estimation d'une direction associée à l'utilisateur, le système comprenant en outre un écran (102), le microcontrôleur étant configuré pour contrôler l'écran, ou un autre circuit, sur la base de l'estimation.

    SYSTÈME SUR PUCE COMPORTANT UN CONTRÔLEUR DE MÉMOIRE ET PROCÉDÉ DE CONTRÔLE DE MÉMOIRE CORRESPONDANT

    公开(公告)号:EP4459493A1

    公开(公告)日:2024-11-06

    申请号:EP24172620.7

    申请日:2024-04-26

    IPC分类号: G06F21/76 G06F21/78

    摘要: Le système sur puce (SOC) comporte un contrôleur de mémoire (CNTMEM) adapté pour recevoir des transactions (TR1, TR2) contenant des informations de transaction (TINF) définissant un accès à une mémoire (MEM), le contrôleur de mémoire (CNTMEM) étant configuré pour stocker les informations de transaction dans un registre de commande (REG), et pour piloter l'accès à la mémoire (MEM) à partir du contenu dudit registre de commande (REG). Le contrôleur de mémoire (CNTMEM) comporte des moyens de vérification (CMP) configurés pour conditionner l'accès à la mémoire en fonction d'une comparaison entre les informations de transaction stockées dans le registre de commande (REG) et une liste d'informations spéciales (LST) définissant des transactions spéciales.

    CONTROL CIRCUIT OF A TRIAC OR A THYRISTOR
    75.
    发明公开

    公开(公告)号:EP4447320A1

    公开(公告)日:2024-10-16

    申请号:EP23305555.7

    申请日:2023-04-13

    IPC分类号: H03K17/60 H02M7/162 H03K17/72

    摘要: The present disclosure relates to a control circuit (210) of a triac (TR201) or thyristor having its driving reference terminal connected to a first reference node (IN202) and coupled to a voltage rectifier (202) comprising at least a semiconductor device (D204) connected between the first reference node (IN202) and a second reference node (GND-DC-200)of the control circuit comprising:
    - A first bipolar transistor (TB210);
    - A driving circuit of said first transistor (TB210) referenced to the second reference node (GND-DC-200).

    SAFETY CIRCUIT FOR A GATE DRIVER DEVICE, CORRESPONDING GATE DRIVER DEVICE AND DRIVER SYSTEM

    公开(公告)号:EP4447310A1

    公开(公告)日:2024-10-16

    申请号:EP24169785.3

    申请日:2024-04-11

    IPC分类号: H02P27/08 H02H7/08

    摘要: A safety circuit (13) for a gate driver device (14) receives PWM driving signals (INH, INL), a system supply voltage (VDD), as well as first (STO1_INT) and second (STO2_INT) safety signals. The circuit (13) includes a first logic circuit (202, 213) configured to propagate the PWM driving signals (INH, INL) to produce gate driving signals (INHg, INLg) if the first safety signal (STO1_INT) is de-asserted, and disable propagation of the PWM driving signals (INH, INL) and de-assert the gate driving signals (INHg, INLg) if the first safety signal (STO1_INT) is asserted. The circuit (13) includes a second logic circuit (216) configured to couple a power supply output node (502) to the system supply voltage (VDD) to produce a driver supply voltage (VSUPPLY) if the second safety signal (STO2_INT) is de-asserted, and decouple the power supply output node (502) from the system supply voltage (VDD) if the second safety signal (STO2_INT) is asserted.

    CURRENT MEASUREMENT DEVICE, CORRESPONDING MANUFACTURING METHOD AND METHOD OF USE

    公开(公告)号:EP4443174A1

    公开(公告)日:2024-10-09

    申请号:EP24166167.7

    申请日:2024-03-26

    IPC分类号: G01R15/20 G01R33/00 H01L23/31

    摘要: An integrated circuit current sensing device (10), comprises an insulating encapsulation (20) that encapsulates a semiconductor die (14) having integrated therein a Hall current sensor (HS) configured to measure an electric current (I) flowing adjacent an active surface of the semiconductor die (14). Embedded in the insulating encapsulation (20) there is provided an electrically conductive trace (100) having opposed ends providing therebetween a current flow path adjacent the active surface of the semiconductor die (14).
    First electrically conductive formations (101) extend through the insulating encapsulation (20) towards the opposed ends of the electrically conductive trace (100) embedded in the insulating encapsulation (20, 20', 20"). The first electrically conductive formations (101) are configured to cause (101) an electrical current subject to measurement to flow in the aforesaid current flow path adjacent the active surface of the semiconductor die (14). Second electrically conductive formations (182, 120, 121) extend through the insulating encapsulation (20) towards the active surface of the semiconductor die (14), the second electrically conductive formations (181, 182, 121) are configured to activate the Hall current sensor (HS) integrated in the semiconductor die (14).

    RECONFIGURABLE, STREAMING-BASED CLUSTERS OF PROCESSING ELEMENTS, AND MULTI-MODAL USE THEREOF

    公开(公告)号:EP4428759A3

    公开(公告)日:2024-10-09

    申请号:EP24155570.5

    申请日:2024-02-02

    摘要: A hardware accelerator (110) includes processing elements (172) of a neural network, each processing element having a memory (104); a stream switch (155); stream engines (150) coupled to functional circuits (102, 160, 165, 180) via the stream switch (155), wherein the stream engines (150), in operation, generate data streaming requests to stream data to and from functional circuits of the plurality of functional circuits (102, 160, 165, 180); a first system bus interface (158) coupled to the stream engines (150); a second system bus interface (184) coupled to the processing elements (172); and mode control circuitry (176), which, in operation, sets respective modes of operation for the plurality of processing elements (172). The modes of operation include: a compute mode of operation in which the processing element (172) performs computing operations using the memory (104) associated with the processing element; and a memory mode of operation in which the memory (104) associated with the processing element (172) performs memory operations, bypassing the stream switch (155), via the second system bus interface (184).