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889 条记录 (耗时 0.026 秒)

    METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS
    81.
    发明授权
    METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS 有权
    非导电表面的银催化剂和力量金属地段组合物金属化

    公开(公告)号：EP1453988B1

    公开(公告)日：2011-06-08

    申请号：EP02763729.7

    申请日：2002-09-25

    申请人： ATOTECH Deutschland GmbH ,  JOSHI, Nayan H.

    发明人： JOSHI, Nayan, H.

    IPC分类号： C23C18/28

    CPC分类号： C23C18/28 ,  C23C18/22 ,  H05K3/181

    摘要： A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.

    Process for applying a metal coating to a non-conductive substrate
    83.
    发明公开
    Process for applying a metal coating to a non-conductive substrate 审中-公开
    亚历山大·维尔法伦

    公开(公告)号：EP2305856A1

    公开(公告)日：2011-04-06

    申请号：EP09171442.8

    申请日：2009-09-28

    申请人： ATOTECH Deutschland GmbH

    发明人： Pan, Ke Liang ,  Wu, Wei Jie

    IPC分类号： C23C18/31 ,  C23C18/40 ,  C23C18/54

    CPC分类号： C25D5/10 ,  C25D3/38 ,  C25D5/56

    摘要： Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/I of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt, characterised in that the composition according to step (b) is treated with an electrical current for a period of time prior to and / or during contacting said solution with the substrate.

    摘要翻译： 描述了将金属涂层施加到非导电基底上的新方法，包括以下步骤：（a）使基底与包含贵金属/ⅣA族金属溶胶的活化剂接触以获得经处理的基底，（b）使所述经处理的 底物，其组合物包含以下溶液：（i）Cu（II），Ag，Au或Ni可溶性金属盐或其混合物，（ii）0.05至5mol / l的IA族金属氢氧化物和（iii） 所述金属盐的金属离子的络合剂包含对于所述金属盐的金属离子具有约0.73至约21.95的累积形成常数log K的有机材料，其特征在于根据步骤（ b）在与基底接触所述溶液之前和/或期间用电流处理一段时间。

    Solution and method for electrochemically depositing a metal on a substrate
    87.
    发明公开
    Solution and method for electrochemically depositing a metal on a substrate 有权
    溶液和方法，用于在衬底上电化学沉积金属

    公开(公告)号：EP2145986A1

    公开(公告)日：2010-01-20

    申请号：EP08075637.2

    申请日：2008-07-15

    申请人： ATOTECH Deutschland GmbH

    发明人： Middeke, Hermann-Josef

    IPC分类号： C25D5/14 ,  C25D15/02 ,  C23F13/02

    CPC分类号： C25D15/02 ,  C25D5/14

    摘要： To electroplate a metal layer which has silica particles dispersed therein, a solution and a method for electrochemically depositing a metal on a substrate are provided, wherein the solution contains ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles , said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with the solution.

    摘要翻译： 电镀其中有二氧化硅粒子分散于其中的金属层，一个溶液和用于电化学沉积在基片的金属的方法中提供，worin溶液含有金属离子被沉积和二氧化硅颗粒，worin至少一种含硅氧烷的有机 部分被提供到所述二氧化硅颗粒，所述同时与溶液接触的含硅氧烷的有机部分，其包含选自氨基，季铵，季磷和季鉮赋予该二氧化硅中的至少一种官能团颗粒正电荷 ，

    MICROBIAL DEGRADATION OF WATER-BORNE PAINT CONTAINING HIGH LEVELS OF ORGANIC SOLVENT
    90.
    发明公开
    MICROBIAL DEGRADATION OF WATER-BORNE PAINT CONTAINING HIGH LEVELS OF ORGANIC SOLVENT 有权
    用有机溶剂含量高PAINTS水溶液微生物降解

    公开(公告)号：EP2111378A2

    公开(公告)日：2009-10-28

    申请号：EP08714060.4

    申请日：2008-01-29

    申请人： ATOTECH Deutschland GmbH

    发明人： ALMADIDY, Amer ,  LAVAYSSIERRE, Natacha

    IPC分类号： C02F3/34 ,  C02F103/14

    CPC分类号： C02F3/34 ,  C02F2103/14

    摘要： A method for degrading, detackifying and reducing solvent in water comprising organic solvent-laden water-borne paint that comprises adding to the water an effective degrading, detackifying and/or solvent-reducing amount of at least one microorganism culture and sufficient micronutrients to sustain the growth of the at least one microorgansim culture and to reduce solvent content of the water. A method of reducing chemical oxygen demand in water comprising organic solvent-laden water-borne paint, wherein the water contains an excess amount of organic solvent from one or both of paint spray operations and paint spray nozzle cleaning operations, the method comprising adding to the water an effective degrading and detackifying amount of at least one microorganism culture and micronutrients to sustain the growth of the at least one microorgansim culture, whereby chemical oxygen demand in the water is reduced by at least 50% relative to the same system without adding the micronutrients.