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    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING
    8.
    发明公开
    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING 审中-公开

    公开(公告)号：EP3578683A1

    公开(公告)日：2019-12-11

    申请号：EP18176836.7

    申请日：2018-06-08

    申请人： Atotech Deutschland GmbH

    发明人： KULKO, Roman-David ,  ZARWELL, Sebastian ,  KLAEDEN, Kilian ,  PETER, Anna ,  BECK, Birgit

    IPC分类号： C23C18/40 ,  C23C18/48

    摘要： An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, comprising
    a) copper ions;
    b) at least one reducing agent suitable for reducing copper ions to metallic copper;
    c) at least one complexing agent for copper ions;
    characterized in that the electroless copper plating bath further comprises
    d) at least one compound according to formula (1):

    wherein
    Z 1 and Z 2 are independently selected from the group consisting of hydrogen; carboxylic acid group; carboxylate group; sulfonic acid group; sulfonate group; carboxamide group; nitrile group; nitro group; substituted or non-substituted trialkylammonium group; substituted or non-substituted 2-carboxyvinyl group; substituted or non-substituted 2-vinylcarboxylate group; substituted or non-substituted 2-(trialkylammonium)vinyl group; substituted or non-substituted hydroxamic acid group; and substituted or non-substituted oxime group;
    with the proviso that at least one of Z 1 and Z 2 is not hydrogen;
    and
    wherein R 1 , R 2 , R 3 and R 4 are defined as follows:
    i. R 1 , R 2 , R 3 and R 4 are hydrogen; or
    ii. R 1 with R 2 are forming together a substituted or non-substituted aromatic ring moiety, R 3 and R 4 are hydrogen; or
    iii. R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, R 1 and R 2 are hydrogen; or
    iv. R 1 with R 2 as well as R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, respectively.


    The invention further concerns a method for depositing at least a copper or copper alloy layer on a surface of a substrate, a layer system and a kit-of-parts for providing the inventive electroless copper plating bath.