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    METHOD AND APPARATUS FOR REMOVING A CARRIER PART FROM A CARRIER WITH A SINGLE OPERATION, AND A PRODUCT REMOVED FROM A CARRIER
    2.
    发明公开
    METHOD AND APPARATUS FOR REMOVING A CARRIER PART FROM A CARRIER WITH A SINGLE OPERATION, AND A PRODUCT REMOVED FROM A CARRIER 审中-公开
    方法和设备加工于一步一个车辆从梯架删除并透过这个水管框架的远程设备

    公开(公告)号：EP1410434A1

    公开(公告)日：2004-04-21

    申请号：EP02741522.3

    申请日：2002-07-08

    申请人： FICO B.V.

    发明人： VAN DALEN, Adrianus, Wilhelmus ,  VAN EGMOND, Henri, Joseph

    IPC分类号： H01L21/48

    CPC分类号： H01L21/4842

    摘要： The invention relates to a method for removing from a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, wherein the carrier is engaged on two sides by cutting elements provided with at least one cutting edge, which cutting elements are subsequently moved toward each other such that the carrier part is separated from the remaining part of the carrier, characterized in that before the separation takes place the cutting edge projecting relative to a base of the cutting element is urged into the carrier such that the carrier deforms permanently. The invention also relates to a thus manufactured product and to an apparatus for mechanically performing the method.

    DEVICE FOR BENDING LEADS OF A LEAD FRAME
    6.
    发明授权
    DEVICE FOR BENDING LEADS OF A LEAD FRAME 失效
    装置：用于弯曲框架导游

    公开(公告)号：EP0668010B1

    公开(公告)日：1996-09-11

    申请号：EP93923571.9

    申请日：1993-11-01

    申请人： Fico B.V.

    发明人： VAN DALEN, Adrianus, Wilhelmus

    IPC分类号： H05K13/00

    CPC分类号： H01L21/67138 ,  H05K13/0092

    摘要： The leads of a lead frame on which an encapsulated chip is placed are bent by placing them in a mould and subsequently bending them with a bending tool in the form of a cylinder-like roller rotatable round a rotating shaft. Because the roller rolls off over the leads, scraping off of solder onto the leads is prevented during bending. In view of its length the mounting of such a roller causes problems, such as sagging. This is resolved according to the invention by providing the roller on the periphery with slot-like recesses for passage of a bearing for the rotating shaft.

    METHOD AND DEVICE FOR DISPLACING A GROUP OF COMPONENTS ORDERED IN A MATRIX STRUCTURE
    10.
    发明公开
    METHOD AND DEVICE FOR DISPLACING A GROUP OF COMPONENTS ORDERED IN A MATRIX STRUCTURE 审中-公开
    方法和装置，用于移动组中的基体结构父组件

    公开(公告)号：EP1911336A2

    公开(公告)日：2008-04-16

    申请号：EP06747601.0

    申请日：2006-06-27

    申请人： FICO B.V.

    发明人： HENNEKES, Willem Antonie ,  REULINK, Gerardus Hermanus Johannes

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0482 ,  H05K13/021

    摘要： The invention relates to a method and a device for placing electronic components ordered in a matrix structure onto a flat carrier, comprising of picking up components ordered in accordance with a matrix structure and placing the components on the flat carrier, wherein the components are picked up in a group of components comprising subgroups and the components are placed successively per subgroup onto the flat carrier. Means are hereby provided with which numbers, pitch or orientation of groups of electronic components, in particular though not exclusively semi-conductor products, can be modified. Placing the components per subgroup moreover creates the freedom to place the subgroups on different carriers.

    摘要翻译： 本发明涉及一种方法和用于放置在矩阵结构排列的电子元件到平坦的载体，拾取在与基质结构雅舞蹈有序组件包括放元器件平坦载体上，worin的部件的装置被拾取 一组亚组包括的部件和部件的在依次由子组放置在平坦的载体。 装置在此设置有电子元件的基团的哪个号码，音调或取向，尤其是但不排他的半导体产品，可以被修改。 配售每个子组组件的更多了创建自由放置在不同载体上的分组。