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    COPPER PASTE, BONDING METHOD, AND METHOD FOR PRODUCING BONDED BODY
    1.
    发明公开
    COPPER PASTE, BONDING METHOD, AND METHOD FOR PRODUCING BONDED BODY 审中-公开

    公开(公告)号：EP3778069A1

    公开(公告)日：2021-02-17

    申请号：EP19775134.0

    申请日：2019-03-18

    申请人： Harima Chemicals, Inc.

    发明人： NAKAJO, Haruyuki ,  OGAWA, Takayuki ,  ZHANG, Ya

    IPC分类号： B22F1/00 ,  H01B1/00 ,  H01B1/22

    摘要： This copper paste includes metal particles and a dispersion medium. The metal particles includes first-type particles and second-type particles. The first-type particles are copper particles having nanostructures on the surfaces thereof, and having an average particle diameter of 1 to 100 µm. The second-type particles are copper particles having an average particle diameter of 0.05 to 5 µm. The average particle diameter of the first-type particles is 2 to 550 times the average particle diameter of the second-type particles. For example, a laminate, in which a copper paste (5) is disposed between a first member (1) and a second member (2), is heated in a reducing atmosphere to sinter the copper paste, whereby the first member and the second member can be bonded without pressurizing.

    ELECTROCONDUCTIVE PASTE
    2.
    发明公开
    ELECTROCONDUCTIVE PASTE 审中-公开

    公开(公告)号：EP3690898A1

    公开(公告)日：2020-08-05

    申请号：EP18860874.9

    申请日：2018-09-28

    申请人： Harima Chemicals, Inc.

    发明人： NAKAJO Haruyuki ,  UEDA Masayuki ,  NAKATANI Makoto ,  HOSOYA Kazuo ,  IYANAGA Miki

    IPC分类号： H01B1/22 ,  H01B1/00 ,  H01L21/288 ,  H05K1/09

    摘要： A conductive paste having high bondability to even a substrate which has low bondability to silver is provided. The conductive paste according to one embodiment of the present invention comprises: a silver particle having an average particle size within a range of 1 to 500 nm as a first average particle size; one or more metals selected from a group consisting of aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, indium, tin, gallium, germanium and bismuth; and an amine compound, wherein an amount of substance of the amine compound is equal to or more than an amount of substance of the metal.

    SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD
    9.
    发明公开
    SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD 审中-公开
    焊锡合金，锡膏和电子电路板

    公开(公告)号：EP3170615A1

    公开(公告)日：2017-05-24

    申请号：EP16768162.6

    申请日：2016-02-03

    申请人： Harima Chemicals, Inc.

    发明人： ISHIKAWA, Shunsuke ,  NAKANISHI, Kensuke ,  MATSUSHIMA, Yuka ,  TAKEMOTO, Tadashi

    IPC分类号： B23K35/26 ,  C22C13/02

    CPC分类号： B23K35/262 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/42 ,  C22C13/02

    摘要： In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass% or more and below 0.2 mass%; the content ratio of the copper is 0.1 mass% or more and 1 mass% or less; the content ratio of the bismuth is above 4.0 mass% and 10 mass% or less; the content ratio of the antimony is 0.005 mass% or more and 8 mass% or less; the content ratio of the indium is 0.005 mass% or more and 2 mass% or less; the content ratio of the nickel is 0.003 mass% or more and 0.4 mass% or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

    摘要翻译： 在基本由锡，银，铜，铋，锑，铟和镍组成的焊料合金中，银的含量比例为0.05质量％以上且低于0.2质量％ 铜的含有比例为0.1质量％以上1质量％以下， 铋的含量比例超过4.0质量％且10质量％以下， 锑的含有比例为0.005质量％以上且8质量％以下， 铟的含有比例为0.005质量％以上且2质量％以下， 镍的含有比例为0.003质量％以上且0.4质量％以下， 并且锡的含量比率是剩余比率，并且铋含量相对于镍含量的质量比率（Bi / Ni）是35以上且1500以下。