摘要:
An apparatus presented herein for printing on one or both sides of flat objects, comprising a loop-shaped conveying path (FW) for the flat objects (K), which is arranged to convey the objects thereon individually on a first section (1A) of the conveying path, and as a (partial) stack of several objects on a second section (2A); a feed conveyor (EF) arranged to feed the objects to be - printed individually into the first section of the conveying path on the upstream side towards a printer (D); a printer (D) arranged along the first portion of the conveying path and adapted to print the objects to be printed one at a time fed to the printer through the first portion on a side facing the printer; a first discharge conveyor (1AF) adapted and controlled to discharge the objects to be printed one at a time downstream of the printer from the first portion toward the second portion; a first collector (1S) for the objects, the first collector being arranged downstream of the first discharge conveyor at the second section and being arranged to - collect objects discharged from the first discharge conveyor in a stack; a stacking conveyor (SF) for a (partial) stack of the objects from the first collector, the stacking conveyor being arranged and arranged to convey the (partial) stack of the objects along the second section; a second collector (2S) arranged at the second section and adapted to receive at least one (partial) stack conveyed by the stack conveyor along the second section and to feed the objects thereof individually upstream to the printer into the first section.
摘要:
Ein Wert- oder Sicherheitsprodukt weist einen flächigen Grundkörper mit einer ersten Außenseite und einer, der ersten Außenseite gegenüberliegenden zweiten Außenseite auf. Das Wert- oder Sicherheitsprodukt weist ein Sicherheitsmerkmal auf, das in einem Innenbereich des Grundkörpers oder auf der ersten Außenseite des Grundkörpers angeordnet ist. Weiter weist das Wert- oder Sicherheitsprodukt eine, auf einem ersten Teilbereich der ersten Außenseite angeordnete Lackschicht auf, die vollflächig ausgebildet ist, sowie eine, auf einem zweiten Teilbereich der ersten Außenseite angeordnete Anordnung von mehreren Lackelementen, wobei das Sicherheitsmerkmal mit dem ersten Teilbereich und/oder mit dem zweiten Teilbereich der ersten Außenseite zumindest teilweise überlappend gebildet ist. Die Herstellung der Anordnung der Lackelemente ist vergleichsweise aufwändig, so dass durch die Anordnung der Lackelemente eine erhöhte Fälschungssicherheit erzielbar ist.
摘要:
Thermal compression apparatus for connecting electrical components (22) to a substrate (16), comprising a top tool (26) and a bottom tool (12) with a first heat source and a support surface (14) for supporting the substrate (16) which has at least one electrical component (22) arranged on it. The top tool (26) comprises a press-on element (30) with at least one spring element (32), preferably a strip-like leaf spring. The at least one spring element (32) is designed to be elastically deformed in the event of a relative movement between the top tool (26) and the bottom tool (12) and as a result to exert a force (F) on a substrate (16) which is located between the press-on element (30) and the support surface (14) and has at least one electrical component (22) arranged on it, in order to press the at least one electrical component (22) against the substrate (16), which is to be arranged on the support surface (14), for the duration of a curing process. The top tool (26) can comprise a second heat source (28) (for example a radiant heater or a heating resistor which is arranged in or on the press-on element (30)). The first heat source and the optional second heat source (28) are designed to supply heat to the substrate (16) which is to be arranged between the support surface (14) and the press-on element (30) and has the at least one electrical component (22), in order to cure a connecting means (20) which is fitted between the substrate (16) and the at least one electrical component (22).
摘要:
The invention relates to a device for identifying a person, comprising a real-image camera (10) for capturing a reflection image of a face (14) of the person in the visible spectral range, a thermal imaging camera (12) for capturing an infrared emissions image of the face of the person, a real-image analysis (16) and an infrared image analysis (18). The real-image camera is designed to transmit the reflection image in the form of reflection image data (20) to the real-image analysis. The thermal imaging camera is designed to transmit the infrared emissions image in the form of infrared image data (22) to the infrared image analysis. The real-image analysis is designed to determine first biometric features (24) of the face from the reflection image data, to receive a reference image (30) comprising a personal identification (36), to determine second biometric features (32) from said reference image and, if the first and second biometric features coincide to a defined degree, to make the personal identification available to an output control (42). The infrared image analysis is designed to detect a temperature distribution (34) from the infrared image data and to determine whether said temperature distribution at least partially approaches a temperature distribution in the face of a living person, and if this is the case, to instruct the output control to output the personal identification.
摘要:
A method for producing a carrier card with a removable integrated chip module card has the following steps: - provision of a carrier card in ID1 format made of a single‑layer or multilayer paper, wherein the individual layers have predetermined material properties, and the individual layers are joined by means of waterproof adhesive, -a- production of a cavity, wherein the cavity is single‑staged or multi‑staged, so that at least one outer and one inner subcavity are formed, by -a1- first notching of the carrier card along a contour of the outer subcavity to be made in the carrier card; -a2- removal of paper material within the first contour to produce the outer subcavity to be made in the carrier card; -a4- removal of paper material within a second contour of the inner subcavity to be made in the carrier card; -b- shaping of the removable integrated chip module card(s) in the mini‑SIM, micro-SIM, nano-SIM, and/or embedded-SIM format with notched or through‑notched features and/or webs between each removable integrated chip module card(s) and the remaining carrier card; and -c- adhesive bonding of an integrated chip module into the cavity.