公开(公告)号：EP2873031B1

公开(公告)日：2018-08-22

申请号：EP12745650.7

申请日：2012-07-12

申请人： ASSA ABLOY AB

发明人： AYALA, Stéphane ,  FURTER, Urs ,  PELLANDA, Laurent

IPC分类号： G06K19/077 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/22 ,  H01L21/48 ,  H01L25/00

CPC分类号： H01L24/78 ,  G06K19/07754 ,  G06K19/07773 ,  G06K19/07779 ,  H01L21/4889 ,  H01L23/49855 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75801 ,  H01L2224/75841 ,  H01L2224/7598 ,  H01L2224/78102 ,  H01L2224/787 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01Q1/2225 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45099

摘要： The method of manufacturing a functional inlay comprises the steps of: —) providing a support layer with at least a first and a second side —) embedding a wire antenna in said support layer —) processing said support layer with said embedded wire antenna to a connection station in which —) said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —) said support layer is approached on said second side by a connection device; and —) said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

公开(公告)号：EP3278456A1

公开(公告)日：2018-02-07

申请号：EP15787783.8

申请日：2015-10-12

申请人： Xilinx, Inc.

发明人： KARP, James ,  KIREEV, Vassili

IPC分类号： H03K19/173 ,  H01L25/00

CPC分类号： H01L23/5382 ,  H01L23/3121 ,  H01L23/5386 ,  H01L25/00 ,  H01L25/0655 ,  H01L25/18 ,  H01L27/0207 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1431 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19107 ,  H03K19/1732 ,  H01L2924/014 ,  H01L2924/00014

摘要： Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package includes a first semiconductor die having a plurality of communication circuits for communicating data over respective data terminals of the package. The package also includes a second semiconductor die having N contacts for communicating data to and from the semiconductor die. The second semiconductor die includes a logic circuit configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts.

公开(公告)号：EP3273466A2

公开(公告)日：2018-01-24

申请号：EP17173147.4

申请日：2017-05-26

申请人： Renesas Electronics Corporation

发明人： YAJIMA, Akira ,  YAMADA, Yoshiaki

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/29 ,  H01L23/485 ,  H01L23/525

CPC分类号： H01L24/13 ,  H01L21/311 ,  H01L21/321 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02377 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/06135 ,  H01L2224/10145 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/16112 ,  H01L2224/16237 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2924/3512 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/053

摘要： The semiconductor device includes: a semiconductor substrate; a conductor layer formed over the semiconductor substrate and having an upper surface and a lower surface; a conductive pillar formed on the upper surface of the conductor layer and having an upper surface, a lower surface, and a sidewall; a protection film covering the upper surface of the conductor layer and having an opening which exposes the upper surface and the sidewall of the conductive pillar; and a protection film covering the sidewall of the conductive pillar. Then, in plan view, the opening of the protection film is wider than the upper surface of the conductive pillar and exposes an entire region of an upper surface of the conductive pillar.

公开(公告)号：EP3227916A4

公开(公告)日：2018-01-03

申请号：EP15866028

申请日：2015-12-01

申请人： ENDURA TECH LLC

发明人： DOSLUOGLU TANER

IPC分类号： H01L23/488 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L27/02 ,  H01L27/092 ,  H05K3/34

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L27/0203 ,  H01L27/092 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/17177 ,  H01L2224/81191 ,  H01L2924/1206 ,  H01L2924/14 ,  H01L2924/1427 ,  H01L2924/15311 ,  H05K3/3436

摘要： A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.

公开(公告)号：EP3211661A3

公开(公告)日：2017-09-13

申请号：EP17000283.6

申请日：2017-02-22

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Soga, Kyoko ,  Asai, Satoshi

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/98 ,  H01L25/065 ,  G03F7/038 ,  G03F7/075 ,  C08L83/14 ,  C08L63/00 ,  C08G77/52

CPC分类号： H01L25/0657 ,  C08G59/621 ,  C08G59/623 ,  C08G77/18 ,  C08G77/52 ,  C08L63/00 ,  C08L83/14 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/0757 ,  H01L21/563 ,  H01L21/78 ,  H01L23/296 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11002 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/133 ,  H01L2224/13393 ,  H01L2224/16148 ,  H01L2224/271 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27848 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83986 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/00015 ,  H01L2924/3511 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2224/48 ,  H01L2224/83102 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01006 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/81201 ,  C08L83/04

摘要： The present invention is a method for manufacturing a semiconductor apparatus, including preparing a first substrate (13) provided with a pad (11) optionally having a plug (12) and a second substrate or device (15) provided with a plug (14), forming a solder ball (16) on at least one of the pad (11) or the plug (12) of the first substrate (13) and the plug (14) of the second substrate or device (15), covering at least one of a pad-forming surface of the first substrate (13) and a plug-forming surface of the second substrate or device (15) with a photosensitive insulating adhesive layer (17), forming an opening (18, 19) on the pad (11) or the plug (12) of the substrate or the device (13, 15) that has been covered with the photosensitive insulating adhesive layer (17) by lithography, pressure-bonding the plug (14) of the second substrate or device (15) to the pad (11) or the plug (12) of the first substrate (13) with the solder ball (16) through the opening (18, 19), electrically connecting the pad (11) or the plug (12) of the first substrate (13) to the plug (14) of the second substrate or device (15) by baking, and curing the photosensitive insulating adhesive layer (17) by baking. As a result, there is provided a method that enables manufacture of a semiconductor apparatus in which the substrates (13, 15) or the substrate (13) and the device (15) are favourably bonded and electrically connected.

摘要翻译： 本发明是一种用于制造半导体装置的方法，包括：准备第一基板（13），该第一基板（13）设置有可选地具有插塞（12）的衬垫（11）和设置有插塞（14）的第二衬底或装置（15） ，在第一衬底（13）的衬垫（11）或插塞（12）和第二衬底或器件（15）的插塞（14）中的至少一个上形成焊球（16），至少覆盖 第一衬底（13）的衬垫形成表面和具有光敏绝缘粘合剂层（17）的第二衬底或器件（15）的插塞形成表面中的一个，在衬垫上形成开口（18,19） （17）的基板或装置（13,15）的光刻胶（11）或插塞（12）通过光刻，压接第二衬底或装置（14）的插塞 （15）通过所述开口（18,19）与所述第一基板（13）的所述焊盘（11）或所述插头（12）电连接 通过烘烤将第一衬底（13）的衬垫（11）或插塞（12）插入第二衬底或器件（15）的插塞（14），并通过烘烤固化光敏绝缘粘合剂层（17）。 结果，提供了一种能够制造其中衬底（13,15）或衬底（13）和器件（15）有利地接合和电连接的半导体装置的方法。

公开(公告)号：EP1797748B1

公开(公告)日：2017-05-17

申请号：EP05802576.8

申请日：2005-09-29

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： DAVOINE, Cécile ,  FENDLER, Manuel

IPC分类号： H05K3/34

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/114 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/116 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83894 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y10T29/49126 ,  H01L2224/13099 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

公开(公告)号：EP3036762A4

公开(公告)日：2017-03-22

申请号：EP14837815

申请日：2014-03-26

申请人： LG ELECTRONICS INC

发明人： RHEE BYUNGJOON

IPC分类号： H01L23/48 ,  H01L23/492 ,  H01L33/62

CPC分类号： H01L33/62 ,  C09J9/02 ,  C09J2201/602 ,  H01L23/4828 ,  H01L23/4922 ,  H01L23/5328 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L33/36 ,  H01L33/38 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/1411 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29561 ,  H01L2224/29644 ,  H01L2224/29655 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/156 ,  H01L2924/35 ,  H01L2924/36 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device includes an electrode including a plurality of pillars, a semiconductor element configured to be electrically-connected with the electrode, a substrate having electrode patterns, and a conductive adhesive layer located between the substrate and the electrode, the conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other, and including a body which encloses the conductive substances.

摘要翻译： 一种半导体器件，包括：包括多个柱的电极;被配置为与所述电极电连接的半导体元件;具有电极图案的基板;以及位于所述基板和所述电极之间的导电粘合剂层，所述导电粘合剂层包括导电 被配置为将所述柱和所述电极图案彼此电连接的物质，并且包括包围所述导电物质的主体。

公开(公告)号：EP2986089A4

公开(公告)日：2017-02-01

申请号：EP14783360

申请日：2014-04-09

申请人： SHOWA DENKO KK

发明人： SAKAI TAKEKAZU

IPC分类号： H05K3/34 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K3/3494 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03442 ,  H01L2224/0347 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/8138 ,  H01L2224/814 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/124 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01032 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

公开(公告)号：EP1460684B1

公开(公告)日：2017-01-18

申请号：EP04075615.7

申请日：2004-02-26

申请人： Intel Corporation

发明人： Workman, Derek B. ,  Stepniak, Frank ,  Chaudhuri, Arun K. ,  Walsh, Matthew R.

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/29 ,  H01L23/00 ,  C08K5/54 ,  C08L63/00

CPC分类号： H01L24/29 ,  C08K5/54 ,  H01L21/563 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2684434B1

公开(公告)日：2016-12-28

申请号：EP12708973.8

申请日：2012-03-06

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  3D Plus

发明人： LIMOUSIN, Olivier ,  SOUFFLET, Fabrice

IPC分类号： H05K3/32 ,  H05K3/40 ,  H01L21/60 ,  H01L23/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/12

CPC分类号： H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/12042 ,  H05K3/027 ,  H05K3/06 ,  H05K3/12 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00