摘要:
An innovative method of manufacturing polishing pads using photo-curing polymers (14) and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.
摘要:
Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.
摘要:
An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.
摘要:
An aqueous slurry is provided for polishing or planarizing a workpiece which contains a metal, the solids portion of said slurry being comprised of about 1 to about 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from one or more of the group consisting of aluminum hydrates, aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.
摘要:
An improved polishing pad is provided comprising a solid uniform polymer sheet having no intrinsic ability to absorb or transport slurry particles having during use a surface texture or pattern which has both large and small flow channels present simultaneously which permit the transport of slurry across the surface of the polishing pad, where said channels are not part of the material structure but are mechanically produced upon the pad surface. In a preferred version of the invention, the pad texture consists of a macrotexture produced prior to use and a microtexture which is produced by abrasion by a multiplicity of small abrasive points at a regular selected interval during the use of the pad.
摘要:
An apparatus for polishing semiconductor wafers (4) in which the polishing pads (1) are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross section along this linear dimension. In addition, the wafer holder (2) travels in a straight line parallel to the long linear dimension of the polishing pads (1).
摘要:
The present invention relates to a method of polishing a metal surface using an aqueous polishing composition for metal surfaces comprising water, an abrasive agent, such as aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide and a salt, or combination of salts, such as aluminum chloride, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, aluminum bromide, aluminum iodide, aluminum chloride, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride, magnesium perchlorate and iron chloride.
摘要:
The present invention relates to a method of polishing a metal surface using an aqueous polishing composition for metal surfaces comprising water, an abrasive agent, such as aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide and a salt, or combination of salts, such as aluminum chloride, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, aluminum bromide, aluminum iodide, aluminum chloride, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride, magnesium perchlorate and iron chloride.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.