摘要:
In improved equipment for lapping internal surfaces, use is made of a composite lap (12), the rod (2) of which is held by the tool spindle (11) and inserted with a marginal degree of clearance into a cone (3) that carries the abrasive shell (4), and a chucking mechanism (1) located beneath and coaxial with the spindle and lap; errors are avoided, particularly with small-bore work, by embodying the lap rod (2) in three rigidly associated sections (7, 8 and 9), namely, a polygonal tip (7), insertable and fastened with a transverse pin (10) in a matching polygonal socket (13) offered by the cone (3), a flexible coupling section (8), and a shank (9) uppermost that is screwed into or otherwise clamped to the spindle. Work to be lapped is held in a chuck (1) suspended from at least three cables (5, 6) threaded through relative peripheral mountings (14) afforded by the chuck itself.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.
摘要:
In improved equipment for lapping internal surfaces, use is made of a composite lap (12), the rod (2) of which is held by the tool spindle (11) and inserted with a marginal degree of clearance into a cone (3) that carries the abrasive shell (4), and a chucking mechanism (1) located beneath and coaxial with the spindle and lap; errors are avoided, particularly with small-bore work, by embodying the lap rod (2) in three rigidly associated sections (7, 8 and 9), namely, a polygonal tip (7), insertable and fastened with a transverse pin (10) in a matching polygonal socket (13) offered by the cone (3), a flexible coupling section (8), and a shank (9) uppermost that is screwed into or otherwise clamped to the spindle. Work to be lapped is held in a chuck (1) suspended from at least three cables (5, 6) threaded through relative peripheral mountings (14) afforded by the chuck itself.
摘要:
Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.
摘要:
In improved equipment for lapping internal surfaces, work to be lapped is held in a chuck (1) suspended from at least three cables (5, 6) threaded through relative peripheral mountings (14) afforded by the chuck itself.
摘要:
Les arcs (3 à 13) découpés dans les parties tendres (1) par un cercle de rayon égal à la motié environ de celui du disque et dont le centre est à une distance de celui du disque égal à la moitié du rayon du disque ont une longueur comprise entre 0,5 et 5 mm. Polissage de pièces.