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1.发明公开
公开(公告)号：EP3143849A1
公开(公告)日：2017-03-22
申请号：EP15709451.7
申请日：2015-03-05
申请人： Auto-Kabel Management GmbH , Tazarine, Wacim , Betscher, Simon , Gronwald, Frank , Rafati, Sohejl
CPC分类号： H05K1/14 , F02N11/0862 , F02N11/087 , F02N2011/0874 , F02N2250/02 , H05K1/0204 , H05K1/0263 , H05K1/0287 , H05K1/056 , H05K1/09 , H05K1/111 , H05K1/142 , H05K1/145 , H05K2201/04 , H05K2201/06 , H05K2201/07 , H05K2201/10166 , H05K2201/10174 , H05K2201/10272
摘要： Circuit arrangement for motor vehicles, comprising at least one semiconductor component (30) and at least one first metal carrier plate (2a) and one metal printed circuit board (2b). Versatile use is possible when the carrier plate (2a) is electrically insulated and at a distance from the printed circuit boards (2b), and the carrier plate (2a) is electrically connected to at least one of the printed circuit boards (2b) by means of at least one semiconductor component (30), so that the carrier plate (2a) and the printed circuit boards (2b) form an electrical triple pole.
摘要翻译： 具有至少一个半导体元件30和至少一个第一金属载体板2a和金属电路板2b的车辆的电路布置。 如果承载板2a与电路板2b电绝缘并且载体板2a通过至少一个半导体器件30与至少一个电路板2b电连接，则提供了多方面的应用范围，使得载体 板2a和电路板2b形成电三极。
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公开(公告)号：EP3143849B1
公开(公告)日：2019-07-03
申请号：EP15709451.7
申请日：2015-03-05
申请人： Auto-Kabel Management GmbH , Tazarine, Wacim , Betscher, Simon , Gronwald, Frank , Rafati, Sohejl
CPC分类号： H05K1/14 , F02N11/0862 , F02N11/087 , F02N2011/0874 , F02N2250/02 , H05K1/0204 , H05K1/0263 , H05K1/0287 , H05K1/056 , H05K1/09 , H05K1/111 , H05K1/142 , H05K1/145 , H05K2201/04 , H05K2201/06 , H05K2201/07 , H05K2201/10166 , H05K2201/10174 , H05K2201/10272
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