公开(公告)号：EP3143849B1

公开(公告)日：2019-07-03

申请号：EP15709451.7

申请日：2015-03-05

申请人： Auto-Kabel Management GmbH ,  Tazarine, Wacim ,  Betscher, Simon ,  Gronwald, Frank ,  Rafati, Sohejl

发明人： TAZARINE, Wacim ,  BETSCHER, Simon ,  GRONWALD, Frank ,  RAFATI, Sohejl

IPC分类号： H05K1/14 ,  H05K1/05 ,  H05K1/02 ,  B60R16/03 ,  F02N11/08

CPC分类号： H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

公开(公告)号：EP3134253A4

公开(公告)日：2018-06-13

申请号：EP15818955

申请日：2015-04-21

申请人： UNIV CORNELL

发明人： MACCURDY ROBERT ,  LIPSON HOD

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K3/28 ,  H05K3/36 ,  H05K3/46

CPC分类号： H05K1/185 ,  A61B17/50 ,  B29C64/00 ,  B29C65/16 ,  B29C67/0051 ,  B29L2031/34 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L21/67115 ,  H01L21/67132 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/112 ,  H01L25/18 ,  H01L25/50 ,  H01L27/01 ,  H01L27/13 ,  H05K1/0287 ,  H05K1/113 ,  H05K1/115 ,  H05K1/117 ,  H05K1/14 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/125 ,  H05K3/284 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1327

摘要： A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.

公开(公告)号：EP2413370A3

公开(公告)日：2017-12-20

申请号：EP11157815.9

申请日：2011-03-11

申请人： Neo Solar Power Corp.

发明人： Wu, Meng-Hsiu ,  Tai, Yu-Wei ,  Chen, Yang-Fang

IPC分类号： H01L31/0224 ,  H05K3/12 ,  H05K1/02 ,  H05K1/09 ,  H01L31/18

CPC分类号： H01L31/022425 ,  H01L31/1804 ,  H05K1/0287 ,  H05K1/092 ,  H05K3/1216 ,  H05K2203/1476 ,  Y02E10/547 ,  Y02P70/521

摘要： An electrode structure for a solar cell is disposed on a substrate of the solar cell. The electrode structure includes a plurality of bus electrodes and a plurality of finger electrodes. The bus electrodes are formed by separately disposing a conductive material on the substrate. The finger electrodes are formed by separately disposing a conductive material on the substrate and at two sides of the bus electrodes. The bus electrodes and the finger electrodes are formed by two screen printing processes. The bottom portion of the finger electrodes are formed by a first screen printing process, and the top portion of the finger electrodes and the bus electrodes are formed by a second screen printing process. Therefore, the electrode structure can enhance the conductivity of electrodes and increase the reliability and yield of the solar cell, thereby achieving the purposes of increasing the photo-electro transition efficiency of the solar cell and decreasing the manufacturing cost.

摘要翻译： 用于太阳能电池的电极结构设置在太阳能电池的基板上。 电极结构包括多个总线电极和多个指状电极。 汇流电极通过在衬底上分开设置导电材料而形成。 指状电极通过在基板上和汇流电极的两侧分开设置导电材料而形成。 总线电极和指状电极通过两个丝网印刷工艺形成。 指状电极的底部通过第一丝网印刷工艺形成，并且指状电极的顶部和汇流电极通过第二丝网印刷工艺形成。 因此，电极结构可以提高电极的导电性，提高太阳能电池的可靠性和良率，从而达到提高太阳能电池的光电转换效率，降低制造成本的目的。

公开(公告)号：EP3016140B1

公开(公告)日：2017-06-21

申请号：EP15192107.9

申请日：2015-10-29

申请人： Nichia Corporation

发明人： Nakabayashi, Takuya

IPC分类号： H01L25/075 ,  F21S8/10 ,  H05K1/11 ,  B60Q1/14 ,  B60Q1/16 ,  F21Y105/12 ,  F21Y105/10 ,  H01L33/38 ,  H01L33/62 ,  H05K1/02

CPC分类号： H01L33/62 ,  B60Q1/1423 ,  B60Q1/16 ,  B60Q2300/42 ,  B60Q2300/45 ,  F21S41/143 ,  F21S41/18 ,  F21S41/663 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/10 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/0287 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

摘要翻译： 发光器件包括基板，多个第一配线构件，多个第二配线构件和多个发光元件。 第一接线构件在第一方向上延伸。 第二配线部件沿第二方向延伸。 每个第二接线构件被分割成多个第二接线部分。 发光元件沿着第二方向布置。 发光元件的第一电极连接到相应的一个第一接线构件。 发光元件的第二电极具有第一连接部分和连接到第一连接部分的第二连接部分。 第一连接部分和第二连接部分连接到相应的一个第二配线部件，并沿第二方向桥接分段的第二配线部分中的至少两个。

公开(公告)号：EP2846083A1

公开(公告)日：2015-03-11

申请号：EP14755317.6

申请日：2014-01-08

申请人： Lin'an New Sanlian Lighting Electric Co., Ltd.

发明人： ZHOU, Yongjun ,  FAN, Yifan

IPC分类号： F21V19/00 ,  F21S4/00 ,  F21Y101/02

CPC分类号： B26D3/00 ,  F21S4/00 ,  F21V19/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/005 ,  H05K1/0286 ,  H05K1/0287 ,  H05K3/202 ,  H05K2201/10106 ,  H05K2203/175 ,  Y10T83/0524 ,  H01L2924/00

摘要： The invention relates to a method for cascading and molding an LED filament support based on a support flitch. With the method, a plurality of supports may be separated apart from the support flitch as a whole body, thus reducing welded amount and increasing work efficiency. The support flitch comprises a group of supports arranged in parallel and numbered as a first support, a second support, a third support, and so on, till an n-th support one after another. According to three different cutting ways, an inner extension section, an outer extension section, an inner connection side, and a middle connection side at the upper side of the support, as well as the inner extension section, the outer extension section, the inner connection side, and the middle connection side at the lower side of the support are cut out respectively, one group or two groups of the cascaded LED filament supports may be obtained.

摘要翻译： 本发明涉及一种基于支撑薄片级联和模制LED灯丝支架的方法。 通过该方法，可以将多个支撑体作为全身与支撑罩分开，从而减少焊接量并提高工作效率。 支撑薄片包括平行布置并被编号为第一支撑，第二支撑，第三支撑等的一组支撑件，直到第n支撑件一个接一个地移动。 根据三种不同的切割方式，在支撑件的上侧具有内延伸部，外延伸部，内连接侧和中连接侧，以及内延伸部，外延伸部，内延伸部 连接侧，支撑体下侧的中间连接侧分别切出，可以获得一组或两组级联的LED灯丝支撑。

公开(公告)号：EP2701473A2

公开(公告)日：2014-02-26

申请号：EP13181035.0

申请日：2013-08-20

申请人： RIDI Leuchten GmbH

发明人： Pannewitz, Manfred

IPC分类号： H05K1/11 ,  F21V29/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/02

CPC分类号： H05K1/111 ,  H05K1/0209 ,  H05K1/0287 ,  H05K1/181 ,  H05K3/02 ,  H05K2201/09363 ,  H05K2201/09709 ,  H05K2201/10106 ,  Y02P70/611

摘要： Die Erfindung betrifft einen LED-Flächenstrahler (1),
- mit einer Mehrzahl von LED-Leuchtmitteln (5),
- mit einer Platine (2), deren elektrisch leitende Oberfläche mittels linienartiger Abtrennungen (3) in eine Mehrzahl von flächig ausgebildeten Leiterbahn-Segmenten (4) unterteilt ist, derart, dass sie aneinander angrenzend und elektrisch voneinander getrennt angeordnet sind,
- wobei wenigstens ein erstes Leiterbahn-Segment (4) und ein an das erste Leiterbahn-Segment (4) angrenzendes zweites Leiterbahn-Segment (4) mittels eines LED-Leuchtmittels (5) elektrisch miteinander verbunden sind.

摘要翻译： LED泛光灯（1）具有多个LED灯泡（5），具有导电表面的电路板（2），其通过线状分隔件（3）细分成多个片状导体段（4），使得它们 彼此相邻并且彼此电分离。 第一导体段布置成与第二导体段相邻并且电连接到LED灯泡。 电路板包括衬底层和用于安装导体段的金属层（6）。

公开(公告)号：EP2280428A1

公开(公告)日：2011-02-02

申请号：EP09735482.3

申请日：2009-04-24

申请人： Panasonic Electric Works Co., Ltd

发明人： KIRIHARA, Masao ,  HOSHINO, Kanako

IPC分类号： H01L33/00 ,  F21S2/00 ,  F21V29/00 ,  F21Y101/02

CPC分类号： H01L33/486 ,  F21S4/20 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0287 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a first electrode pad and a second electrode pad, and is formed with a patterned wiring being electrically connected to the patterned wiring. The surface mounting type LED package comprises an LED chip and a mounting substrate. The mounting substrate is formed at its front surface with a recess, and its rear surface with a first connection electrode and the second connection electrode which are electrically connected to the first electrode pad and the second electrode pad, respectively when the mounting substrate is mounted on the flexible wiring substrate. The LED chip is disposed within the recess so as to receive the electrical current through the outside connection electrode and the power supply terminal.

公开(公告)号：EP2276331A1

公开(公告)日：2011-01-19

申请号：EP09009109.1

申请日：2009-07-13

申请人： Delphi Technologies, Inc.

发明人： Larisch, Markus

IPC分类号： H05K7/08 ,  H05K1/00 ,  H05K3/22

CPC分类号： H05K7/08 ,  H05K1/0287 ,  H05K1/0295 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/10189 ,  H05K2201/10356

摘要： Ein Kabelsatz, insbesondere für ein elektrisches Verteilungssystem für ein Kraftfahrzeug, umfasst eine Platine mit parallel zueinander in einer Richtung auf der Platine verlaufenden Leiterbahnen und wenigstens zwei Steckverbinder. Jeder der wenigstens zwei Steckverbinder weist zumindest eine Reihe von Kontaktkammern auf. Jede Kontaktkammer ist zur Aufnahme von jeweils einem insbesondere buchsenartig oder stiftartig ausgebildeten Kontaktelement ausgebildet. Die wenigstens zwei Steckverbinder sind derart an der Platine angebracht oder anbringbar, dass die Reihen von Kontaktkammern der wenigstens zwei Steckverbinder quer zur Verlaufsrichtung der Leiterbahnen angeordnet sind.

摘要翻译： 电缆线束具有板（1），其具有在板上的方向上彼此平行延伸的一组导体（3），以及两个插头连接器（5），每个包括一组接触室（7,7a，8,8） 8a，8b），其中每个接触室容纳插座或针式接触元件。 插头连接器附接在板上，使得插头连接器的接触室横向于导体的方向布置，其中接触室彼此平行布置。 还包括用于制造电缆线束的方法的独立权利要求。

公开(公告)号：EP1497810A1

公开(公告)日：2005-01-19

申请号：EP03746802.2

申请日：2003-04-16

申请人： SAFAR, Ladislav

发明人： SAFAR, Ladislav

IPC分类号： G09B23/18 ,  H05K1/00

CPC分类号： G09B23/185 ,  H05K1/0287 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368

摘要： The electro-technical kit comprises a primary board, connection means and functional modules. The primary board (1) is on its both faces divided into an array of first fields (4) and second fields (5), each of the first fields (4) at one board face being assigned to a second field (5) at the other board face and each field (4, 5) being provided with a system of solid, regularly arranged outside contacts (6), inside contacts (7) and axis contacts (3, 9), while on at least one of the fields (4, 5) of the primary board (1) there is placed a separate connection module (2) provided with a system of bushings (12) for insertion of insertion contacts (13), the arrangement of bushings (12) corresponding to the arrangement of solid contacts of each field (4, 5) and the connection module (2) is adapted to hold a functional module (3) the connecting contacts (14) of which are arranged at places the positions of which correspond to positions of at least some of the bushings (12) of the connection module (2).

公开(公告)号：EP0988576A2

公开(公告)日：2000-03-29

申请号：EP98931120.4

申请日：1998-06-12

申请人： Zetfolie B.V.

发明人： RUITER, Jacobus, Christiaan, Gerardus, Maria ,  TERLOUW, Erik, Maarten ,  HADZIIOANNOU, Georges ,  BROUWER, Hendrik-Jan

IPC分类号： G02F1/136 ,  H05K3/40 ,  H01B1/20

CPC分类号： H05K3/4038 ,  G02F1/1333 ,  G02F1/1345 ,  G02F1/135 ,  G02F1/1362 ,  H01B1/22 ,  H05K1/0287 ,  H05K3/105 ,  H05K2201/09609 ,  H05K2203/105

摘要： Substrate (7; 7'; 10) and devices including such a substrate, the substrate having a first surface and a second surface extending substantially in parallel to the first surface, the substrate being of a material of a first conductivity and provided with a plurality of electrically conducting channels (21) which are extending exclusively in a direction perpendicular to the first and second surfaces, said channels having a second conductivity substantially larger than the first conductivity, the substrate being provided with at least one electrode (42) on either one of the first and second surfaces, contacting at least one of said channels, the at least one electrode (42) having a predetermined minimum dimension (D) in a contact area (A) with the substrate, and mutual distances between adjacent ones of the plurality of channels (21) being smaller than said minimum dimension of said at least one electrode (42).