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公开(公告)号：EP2885129A1
公开(公告)日：2015-06-24
申请号：EP13829752.8
申请日：2013-08-15
发明人： NACHTIGAL, Alan K. , RUFF, Andrew T. , LYONS, Christopher S. , JOLY, Guy D. , SPAGNOLA, Joseph C. , WEIGEL, Mark D. , DELMORE, Michael D. , KIDANE, Samuel , KLUN, Thomas P.
CPC分类号： H01L31/048 , B32B27/08 , B32B27/36 , B32B2250/42 , B32B2255/10 , B32B2255/20 , B32B2255/26 , B32B2255/28 , B32B2307/412 , B32B2307/71 , B32B2457/12 , C08J7/045 , C08J7/18 , C08J2367/02 , C08J2433/00 , H01L51/524 , Y10T428/2848
摘要： The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application of an adhesive layer and/or a topsheet to protect the exposed uppermost layer of the barrier stack during roll-to-roll processing. Some embodiments include application of an adhesive layer and/or a topsheet before the exposed, uppermost layer of the barrier film contacts a solid surface or processing roll. Inclusion of an adhesive layer and/or a topsheet protects the oxide layer during processing, which creates an excellent barrier assembly that can be manufactured using roll-to-roll processing.
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公开(公告)号：EP2885130A1
公开(公告)日：2015-06-24
申请号：EP13829299.0
申请日：2013-08-15
发明人： NACHTIGAL, Alan K. , RUFF, Andrew T. , LYONS, Christopher S. , JOLY, Guy D. , SPAGNOLA, Joseph C. , WEIGEL, Mark D. , DELMORE, Michael D. , KIDANE, Samuel , KLUN, Thomas P.
CPC分类号： H01L31/0481 , B32B27/06 , B32B27/30 , B32B37/1018 , B32B37/12 , B32B2307/40 , B32B2307/412 , B32B2307/546 , B32B2307/7265 , B32B2307/748 , B32B2333/08 , B32B2457/20 , C23C14/08 , H01L51/448
摘要： The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.
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公开(公告)号：EP2298047B1
公开(公告)日：2020-02-05
申请号：EP09751434.3
申请日：2009-05-20
发明人： THEIS, Daniel J. , NELSON, Brian K. , DOBBS, James N. , KIDANE, Samuel , SWANSON, Ronald P. , CARLSON, Daniel H. , TIEFENBRUCK, Grant F. , STENSVAD, Karl K.
IPC分类号： H05K3/12
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公开(公告)号：EP2588315A1
公开(公告)日：2013-05-08
申请号：EP11801468.7
申请日：2011-07-01
发明人： WEIGEL, Mark D. , ROEHRIG, Mark A. , NACHTIGAL, Alan K. , KIDANE, Samuel , HENDERSON, Andrew J.
IPC分类号： B32B27/08 , B32B7/12 , B32B7/02 , H01L31/048
CPC分类号： H01L31/0481 , B32B7/02 , B32B7/12 , B32B17/10018 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/286 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/10 , B32B2255/20 , B32B2307/412 , B32B2307/416 , B32B2307/42 , B32B2307/546 , B32B2307/71 , B32B2307/712 , B32B2307/7246 , B32B2307/732 , B32B2327/12 , B32B2367/00 , B32B2457/12 , B32B2551/00 , Y02E10/50 , Y10T428/24942 , Y10T428/2495 , Y10T428/31663 , Y10T428/31667
摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
摘要翻译： 提供一种包括插入在第一聚合物膜基材和压敏粘合剂层的第一主表面之间的阻挡膜的组件。 第一聚合物膜基材具有第一热膨胀系数，在一些实施方案中，其高达每百万开氏百万分之50。 压敏粘合剂层具有与设置在第二聚合物膜基材上的第一主表面相对的第二主表面。 第二聚合物膜基材通常耐紫外线降解。 在一些实施方案中，第二聚合物膜基材具有比第一热膨胀系数高至少40百万分之比/秒的第二热膨胀系数。 该组件对可见光和红外光透射。
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公开(公告)号：EP2588314B1
公开(公告)日：2020-08-19
申请号：EP11801469.5
申请日：2011-07-01
发明人： WEIGEL, Mark D. , ROEHRIG, Mark A. , NACHTIGAL, Alan K. , KIDANE, Samuel , HENDERSON, Andrew J.
IPC分类号： B32B27/08 , B32B7/12 , B32B7/02 , H01L31/048
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公开(公告)号：EP2588315B1
公开(公告)日：2020-04-08
申请号：EP11801468.7
申请日：2011-07-01
发明人： WEIGEL, Mark D. , ROEHRIG, Mark A. , NACHTIGAL, Alan K. , KIDANE, Samuel , HENDERSON, Andrew J.
IPC分类号： B32B27/08 , B32B7/12 , B32B7/02 , H01L31/048
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公开(公告)号：EP2298047A1
公开(公告)日：2011-03-23
申请号：EP09751434.3
申请日：2009-05-20
发明人： THEIS, Daniel, J. , NELSON, Brian, K. , DOBBS, James, N. , KIDANE, Samuel , SWANSON, Ronald, P. , CARLSON, Daniel, H. , TIEFENBRUCK, Grant, F. , STENSVAD, Karl K.
IPC分类号： H05K3/12
摘要： A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.
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8.发明公开
公开(公告)号：EP2879855A1
公开(公告)日：2015-06-10
申请号：EP13826245.6
申请日：2013-06-26
CPC分类号： B29C45/7306 , B29C45/73 , B29C45/76 , B29C2033/023 , B29C2045/7343 , B29C2045/7368 , B29K2995/0013 , B29L2031/00
摘要： Apparatus and methods for injection molding, in which at least one portion of at least one cavity surface that defines a mold cavity, includes a thermally controllable array.
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公开(公告)号：EP2849926A1
公开(公告)日：2015-03-25
申请号：EP13791604.5
申请日：2013-05-01
CPC分类号： B29C45/73 , B29C2045/7393
摘要： A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
摘要翻译： 一种用于注射成型的散热器，具有至少一个具有后部段的承载路径，其中散热片的至少一个非承载动态传热区的至少一部分从后向侧向偏移 承载路径的段。
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公开(公告)号：EP2742537A2
公开(公告)日：2014-06-18
申请号：EP12820563.0
申请日：2012-07-30
发明人： WEIGEL, Mark D. , ROEHRIG, Mark A. , KIDANE, Samuel , DELMORE, Michael D. , BERNIARD, Tracie J.
IPC分类号： H01L31/048
CPC分类号： H01L31/0481 , H01L31/0322 , H01L31/048 , H01L31/049 , Y02B10/12 , Y02E10/50
摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.
摘要翻译： 本申请涉及包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的阻挡叠层; 以及与电子装置相对的靠近障壁叠层的耐气候片。 该组件还包括与电子装置和耐候性片材接触的保护层。 本申请允许任何公开的要素的组合。
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