公开(公告)号：EP1258909A3

公开(公告)日：2006-04-12

申请号：EP02076864.4

申请日：2002-05-13

申请人： ASM INTERNATIONAL N.V.

发明人： Storm, Arjen ,  Bast, Ronald ,  Kuznetsov, Vladimir Ivanovich ,  Zinger, Jan

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L21/67109

摘要： Method and device for the heat treatment of flat substrates, wherein the substrates are positioned in the vicinity of a heated, essentially flat furnace body extending over the surface of the substrate. In order to provide a reproducible treatment when treating a number of substrates successively, the temperature of the furnace body is measured so close to the surface adjacent to the substrate that the withdrawal of heat from the furnace body by the substrate can be detected. The introduction of each substrate takes place at a point in time when the temperature measured in this way is, within certain limits, equal to a desired initial treatment temperature T trig .

公开(公告)号：EP1258909B1

公开(公告)日：2008-07-30

申请号：EP02076864.4

申请日：2002-05-13

申请人： ASM INTERNATIONAL N.V.

发明人： Storm, Arjen ,  Bast, Ronald ,  Kuznetsov, Vladimir Ivanovich ,  Zinger, Jan

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L21/67109

公开(公告)号：EP1197990A3

公开(公告)日：2005-03-02

申请号：EP01306928.1

申请日：2001-08-14

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  De Ridder, Christianus G.M.

IPC分类号： H01L21/00

CPC分类号： H01L21/67757 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67781

摘要： A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300·mm wafers. The system is configured initially for handling standard 300·mm FOUP cassettes. Adaptions for handling 200·mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300·mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

摘要翻译： 用于处理半导体晶片的系统包括允许选择性地处理200-mm晶片和300.mm晶片的盒的适配。 该系统最初用于处理标准的300.mm FOUP盒。 用于处理200.mm晶圆打开盒的改装包括用于在输入/输出平台上接收这种盒的装载端口适配器框架; 盒式处理机适配器，被配置为可逆地安装在盒式处理器端部执行器上并用于接收200-mm打开的盒式磁带; 用于将300.mm FOUP存储隔间转换成用于存储200-mm打开盒的隔间的商店适配器框架; 以及用于在盒式传送平台上保持200-mm打开盒的转运FOUP，并将这样的盒带入与晶片处理器的界面中。 转运FOUP具有类似于标准300毫米FOUP盒的外表面，但被配置为在其中接收一个200毫米打开的盒式磁带。

公开(公告)号：EP1016128B1

公开(公告)日：2004-08-04

申请号：EP98967122.7

申请日：1998-07-03

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  Snijders, Gert-Jan ,  Kooijman, Cornelis Marinus

IPC分类号： H01L21/00

CPC分类号： H01L21/67769 ,  H01L21/67766 ,  Y10S414/14

摘要： Storage assembly provided with a robot for placing cassettes, which are filled with wafers, in a carousel, comprising a number of magazines. These magazines lie both above one another and next to one another. In order to be able to determine the correct position of the head of the robot which holds the cassettes with respect to the magazines, it is proposed to provide sensor means which determine the vertical position of the head with respect to the base plate of the magazines and sensor means for determining the horizontal position of the head with respect to the magazines. This horizontal position is determined using openings arranged in the base plate of the magazines. In particular, a main opening and an auxiliary opening are present.

公开(公告)号：EP1341213A2

公开(公告)日：2003-09-03

申请号：EP03075327.1

申请日：2003-02-03

申请人： ASM INTERNATIONAL N.V.

发明人： de Ridder, Christianus Gerardus Maria ,  Hasper, Albert ,  Snijders, Gert-Jan ,  Zinger, Jan

IPC分类号： H01L21/00

CPC分类号： H01L21/67769

摘要： An apparatus for treating wafers, provided with at least one treatment chamber, the apparatus being provided with a feeding section in which wafers contained in a wafer storage box can be fed into the apparatus, the apparatus being provided with a wafer handling apparatus, by means of which wafers can be taken out of the wafer storage boxes so as to be treated in the treatment chamber, and the apparatus being provided with at least one sensor box arranged such that the wafer handling apparatus can feed a wafer into the sensor box through an opening provided for that purpose in the at least one sensor box, and the at least one sensor box being arranged to carry out measurements at a wafer, wherein the at least one sensor box is movably arranged and the apparatus is provided with a sensor box handling apparatus arranged to move the at least one sensor box from a storage position to a measuring position.

摘要翻译： 一种用于处理晶片的设备，具有至少一个处理室，所述设备设置有馈送部分，其中容纳在晶片存储盒中的晶片可以被馈送到所述设备中，所述设备通过装置设置有晶片处理装置 其中可以将晶片从晶片储存盒中取出以便在处理室中进行处理，并且该设备设置有至少一个传感器盒，其布置成使得晶片处理装置可以通过一个晶片处理装置将晶片馈送到传感器盒中 在所述至少一个传感器盒中设置用于该目的的开口，并且所述至少一个传感器盒被布置成在晶片处执行测量，其中所述至少一个传感器盒可移动地布置，并且所述设备设置有传感器盒处理 设置成将所述至少一个传感器盒从存储位置移动到测量位置的装置。

公开(公告)号：EP1258909A2

公开(公告)日：2002-11-20

申请号：EP02076864.4

申请日：2002-05-13

申请人： ASM INTERNATIONAL N.V.

发明人： Storm, Arjen ,  Bast, Ronald ,  Kuznetsov, Vladimir Ivanovich ,  Zinger, Jan

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L21/67109

摘要： Method and device for the heat treatment of flat substrates, wherein the substrates are positioned in the vicinity of a heated, essentially flat furnace body extending over the surface of the substrate. In order to provide a reproducible treatment when treating a number of substrates successively, the temperature of the furnace body is measured so close to the surface adjacent to the substrate that the withdrawal of heat from the furnace body by the substrate can be detected. The introduction of each substrate takes place at a point in time when the temperature measured in this way is, within certain limits, equal to a desired initial treatment temperature T trig .

摘要翻译： 用于平面基板的热处理的方法和装置，其中基板位于在衬底的表面上延伸的加热的基本平坦的炉体附近。 为了在连续处理多个基板时提供可再现的处理，炉体的温度被测量为与基板相邻的表面接近，可以检测到通过基板取出炉体的热量。 每个衬底的引入在这样测量的温度在一定限度内等于期望的初始处理温度T trig的时间点发生。

公开(公告)号：EP0778610B1

公开(公告)日：2002-07-17

申请号：EP96203122.5

申请日：1996-11-07

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  Haanstra, Kornelius ,  Schimmel, Rudi

IPC分类号： H01L21/00

CPC分类号： H01L21/67796 ,  H01L21/681 ,  Y10S414/135

公开(公告)号：EP1197990A2

公开(公告)日：2002-04-17

申请号：EP01306928.1

申请日：2001-08-14

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  De Ridder, Christianus G.M.

IPC分类号： H01L21/00

CPC分类号： H01L21/67757 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67781

摘要： A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300·mm wafers. The system is configured initially for handling standard 300·mm FOUP cassettes. Adaptions for handling 200·mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300·mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

摘要翻译： 用于处理半导体晶片的系统包括允许选择性地处理200-mm晶片和300.mm晶片的盒的适配。 该系统最初用于处理标准的300.mm FOUP盒。 用于处理200.mm晶圆打开盒的改装包括用于在输入/输出平台上接收这样的盒的装载端口适配器框架; 盒式处理机适配器，被配置为可逆地安装在盒式处理器端部执行器上并用于接收200-mm打开的盒式磁带; 用于将300.mm FOUP存储隔间转换成用于存储200-mm打开盒的隔间的商店适配器框架; 以及用于在盒式传送平台上保持200-mm打开盒的转运FOUP，并将这样的盒带入与晶片处理器的界面中。 转运FOUP具有类似于标准300毫米FOUP盒的外表面，但被配置为在其中接收一个200毫米打开的盒式磁带。

公开(公告)号：EP1016128A1

公开(公告)日：2000-07-05

申请号：EP98967122.7

申请日：1998-07-03

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  Snijders, Gert-Jan ,  Kooijman, Cornelis Marinus

IPC分类号： H01L21/00

CPC分类号： H01L21/67769 ,  H01L21/67766 ,  Y10S414/14

摘要： Storage assembly provided with a robot for placing cassettes, which are filled with wafers, in a carousel, comprising a number of magazines. These magazines lie both above one another and next to one another. In order to be able to determine the correct position of the head of the robot which holds the cassettes with respect to the magazines, it is proposed to provide sensor means which determine the vertical position of the head with respect to the base plate of the magazines and sensor means for determining the horizontal position of the head with respect to the magazines. This horizontal position is determined using openings arranged in the base plate of the magazines. In particular, a main opening and an auxiliary opening are present.

公开(公告)号：EP0778610A1

公开(公告)日：1997-06-11

申请号：EP96203122.5

申请日：1996-11-07

申请人： ASM INTERNATIONAL N.V.

发明人： Zinger, Jan ,  Haanstra, Kornelius ,  Schimmel, Rudi

IPC分类号： H01L21/00

CPC分类号： H01L21/67796 ,  H01L21/681 ,  Y10S414/135

摘要： Apparatus for transferring substantially circular article from a first unloading position to a second loading position. To obtain exact positioning in the second loading position means are proposed to compensate for misalignment of the article on a support arm portion. During movement of the support arm portion the position of the periphery of the circular article with regard to the support arm portion is detected. Based on that a correction of the movement of the support arm portion is generated.

摘要翻译： 用于将基本上圆形的物品从第一卸载位置转移到第二装载位置的装置。 为了在第二装载位置中获得精确的定位，提出了补偿在支撑臂部分上的物品的不对准的装置。 在支撑臂部分的移动过程中，检测圆形物品周边相对于支撑臂部分的位置。 基于此，产生支撑臂部的移动的校正。