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公开(公告)号：EP1629704B1
公开(公告)日：2006-12-13
申请号：EP04739481.2
申请日：2004-06-01
CPC分类号： H05K3/423 , C25D21/18 , H05K2201/09563 , H05K2203/0796
摘要： The invention provides a process for filling µ-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising a copper metal salt and optionally organic additives, (ii) operating the bath with direct current density of 0.5 to 10 A/dm2, or current pulses at an effective current density of 0.5 to A/dm2, (iii) withdrawing part of the electrolyte from the galvanic bath, (iv) adding an oxidizing agent to the part of the electrolyte which has been withdrawn, (v) optionally irradiating the withdrawn electrolyte with UV light and (vi) recycling the withdrawn part to the galvanic bath and replacing the organic additives destroyed by the oxidation treatment.
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公开(公告)号：EP2997180B1
公开(公告)日：2019-07-03
申请号：EP14723768.9
申请日：2014-05-09
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公开(公告)号：EP2997180A2
公开(公告)日：2016-03-23
申请号：EP14723768.9
申请日：2014-05-09
CPC分类号： C25D3/38 , C25D5/10 , C25D5/18 , C25D5/38 , C25D5/44 , C25D5/54 , C25D21/12 , H05K1/0265 , H05K1/0306 , H05K3/241 , H05K3/246 , H05K2203/0307 , H05K2203/0723 , H05K2203/1492
摘要： The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
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公开(公告)号：EP1629704A1
公开(公告)日：2006-03-01
申请号：EP04739481.2
申请日：2004-06-01
CPC分类号： H05K3/423 , C25D21/18 , H05K2201/09563 , H05K2203/0796
摘要： The invention provides a process for filling µ-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising a copper metal salt and optionally organic additives, (ii) operating the bath with direct current density of 0.5 to 10 A/dm2, or current pulses at an effective current density of 0.5 to A/dm2, (iii) withdrawing part of the electrolyte from the galvanic bath, (iv) adding an oxidizing agent to the part of the electrolyte which has been withdrawn, (v) optionally irradiating the withdrawn electrolyte with UV light and (vi) recycling the withdrawn part to the galvanic bath and replacing the organic additives destroyed by the oxidation treatment.
摘要翻译： 本发明提供了一种在制造印刷电路板中填充μ盲孔的方法，该方法包括以下步骤：（i）提供用于电镀的电解液，其中金属涂层包含铜金属盐和任选的有机添加剂，（ ii）以0.5至10A / dm 2的直流电流密度操作浴或以0.5至A / dm 2的有效电流密度操作电流脉冲，（iii）从电镀浴中取出部分电解液，（iv）添加 （v）任选地用紫外光照射取出的电解质，和（vi）将取出的部分再循环至电镀浴并替换通过氧化处理破坏的有机添加剂。
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